Stephen Chi Li

US Patent:

7560303, Jul 14, 2009

Filed:

Nov 7, 2006

Appl. No.:

11/557472

Inventors:

Haochuan Wang - South Pasadena CA, US
Ali Mehrabi - Glendale CA, US
Kouroche Kian - Altadena CA, US
Xiaoming He - Arcadia CA, US
Stephen Li - Huntington Beach CA, US

Assignee:

Avery Dennison Corporation - Pasadena CA

International Classification:

H01L 21/00

US Classification:

438107, 438 26, 438 48, 438118, 257E21499, 257E21519

Abstract:

A method for assembling a semiconductor device including the steps of providing a penetrable substrate having an adhesive surface and a plurality of dies disposed on the adhesive surface; providing a strap lead substrate having a plurality of strap leads disposed thereon; dispensing a first plurality of strap leads from the plurality of strap leads; providing a plurality of pins; bringing the penetrable substrate into close proximity with the strap lead substrate so as to bringing the first plurality of strap leads into contact with the plurality of dies; pressing the first plurality of strap leads against the plurality of dies using the plurality of pins; and, moving the penetrable substrate away from the strap lead substrate while using the plurality of pins to maintain contact between the first plurality of strap leads and the plurality of dies. An apparatus for assembling a semiconductor device is also disclosed.

US Patent:

20080060750, Mar 13, 2008

Filed:

Aug 31, 2006

Appl. No.:

11/469370

Inventors:

Haochuan Wang - South Pasadena CA, US
Ali Mehrabi - Glendale CA, US
Stephen Li - Huntington Beach CA, US
Kouroche Kian - Altadena CA, US
Xiaoming He - Arcadia CA, US
Peikang Liu - Claremont CA, US

Assignee:

AVERY DENNISON CORPORATION - Pasadena CA

International Classification:

B65C 9/18
G08B 13/14
H01Q 17/00
H01R 43/00

US Classification:

156238, 29601, 29825, 3405728

Abstract:

A method for assembling a semiconductor device from a plurality of chips is disclosed. The method includes providing a penetrable carrier having a penetrable carrier substrate and an adhesive layer; providing a plurality of chips disposed on a surface of the adhesive layer; providing a second substrate; bringing the surface of the adhesive layer of the penetrable carrier close to the second substrate; pinning the plurality of chips against the second substrate through the penetrable carrier; and, moving the penetrable carrier away from the second substrate such that the plurality of pinned chips are removed from the surface of the adhesive layer on the penetrable carrier.

US Patent:

20100215880, Aug 26, 2010

Filed:

Feb 25, 2010

Appl. No.:

12/712759

Inventors:

Eugene ROZENBAOUM - Arcadia CA, US
Frank Y. SHIH - Arcadia CA, US
Stephen LI - Huntington Beach CA, US
Prakash MALLYA - Sierra Madre CA, US

Assignee:

Avery Dennison Corporation - Pasadena CA

International Classification:

B32B 27/32
B29C 47/06
B32B 37/15

US Classification:

428 401, 15624411, 428500

Abstract:

The current invention utilizes an extrusion coating method as a key step in a series of multilayer construction processes to make a laminate for graphic application. The extrusion coated layer performs as a strengthening layer to provide mechanical properties for the construction, while an ink receptive coating layer delivers high quality printability performance. High gloss can be achieved through the use of a PET carrier.

US Patent:

20110271076, Nov 3, 2011

Filed:

Apr 28, 2010

Appl. No.:

12/769080

Inventors:

Maarten Koning - Bloomfield, CA
Stephen Li - Menlo Park CA, US

International Classification:

G06F 15/80
G06F 9/46

US Classification:

712 20, 718100

Abstract:

An electronic device includes a processing component and a task manager. The processing component is configurable for one of a single-core processing mode and a multi-core processing mode. The task manager determines a number of tasks running on the electronic device. The processor is configured to one of the single-core processing mode and the multi-core processing mode as a function of the number of tasks.

US Patent:

20140166098, Jun 19, 2014

Filed:

Mar 12, 2012

Appl. No.:

14/003517

Inventors:

Kourosh Kian - Altadena CA, US
Peikang Liu - Claremont CA, US
Stephen Li - Huntington Beach CA, US

Assignee:

Avery Dennison Corporation - Pasadena CA

International Classification:

H01L 31/0224
H01L 31/18

US Classification:

136256, 438 98

Abstract:

Various methods for preparing and/or processing electrically conductive aluminum members such as used in electronic circuits and components are described. Also described are various sheet assemblies using patterned aluminum conductive elements as components of electric circuitry. The sheet assemblies can be used as backsheets for back contact photovoltaic cells or as antennas for RFID tags.