Stephen Roland Lloyd

US Patent:

20110254760, Oct 20, 2011

Filed:

Aug 27, 2010

Appl. No.:

12/869837

Inventors:

Stephen Lloyd - Los Altos CA, US
David Sachs - Sunnyvale CA, US
David Devries - San Jose CA, US
Doug Vargha - Palo Alto CA, US
Derek Shaeffer - Redwood City CA, US
Erik Anderson - San Francisco CA, US
Kerry Keal - Santa Clara CA, US
Nathan Royer - Cupertino CA, US

Assignee:

InvenSense, Inc. - Sunnyvale CA

International Classification:

G09G 5/00
G06F 19/00
G01P 15/00

US Classification:

345156, 702141, 702 89

Abstract:

The present invention relates to a combination of a 6-axis motion sensor having a 3-axis gyroscope and a 3-axis linear accelerometer, a motion processor and a radio integrated circuit chip (IC), wherein the intelligence in the motion processor enables the communication between the motion sensor, the radio IC and the external network. The motion processor also enables power savings by adaptively controlling the data rate of the motion sensor, depending on the amount or speed of the motion activity.

US Patent:

60185538, Jan 25, 2000

Filed:

Sep 18, 1996

Appl. No.:

8/715442

Inventors:

Sergio A. Sanielevici - Los Altos CA
Stephen F. Lloyd - Palo Alto CA
Kenneth R. Cioffi - Milpitas CA

Assignee:

Wireless Access - Santa Clara CA

International Classification:

H03D 300
H04L 2714

US Classification:

375334

Abstract:

A multi-level quadrature (I/Q) mixer for use in a communication system such as a paging device, where the mixer includes first and second I/Q downconversions followed by demodulation. The first I/Q downconversion converts an I/Q signal pair to a first IF, and the second I/Q downconversion converts an I/Q signal pair to a second IF. The first IF may or may not be the center frequency depending on the number of subchannels in the single channel being downconverted.

US Patent:

20200194495, Jun 18, 2020

Filed:

Oct 28, 2019

Appl. No.:

16/666024

Inventors:

- San Jose CA, US
Julius Ming-Lin TSAI - San Jose CA, US
Stephen LLOYD - Los Altos CA, US

Assignee:

InvenSense, Inc. - San Jose CA

International Classification:

H01L 27/20
H01L 41/08
G06K 9/00
B81C 1/00
H01L 41/113
G01N 29/28
G01N 29/24

Abstract:

An electronic device comprises a CMOS substrate having a first surface and a second surface opposite the first surface. A plurality of ultrasonic transducers is provided having a transmit/receive surface. A contact surface is piezoelectrically associated with the plurality of ultrasonic transducers and is formed on the first surface of the CMOS substrate. The plurality of ultrasonic transducers is disposed on the second surface of the CMOS substrate, with the transmit/receive side attached to the second surface thereof such that the CMOS substrate is between the plurality of ultrasonic transducers and the platen. An image sensing system is also provided, together with a method for ultrasonic sensing in the electronic device.

US Patent:

20190382259, Dec 19, 2019

Filed:

Sep 1, 2019

Appl. No.:

16/558145

Inventors:

- San Jose CA, US
STEPHEN LLOYD - LOS ALTOS CA, US
JOSEPH SEEGER - MENLO PARK CA, US

International Classification:

B81B 7/00
B81B 7/02
B81C 99/00
G06F 11/30
H01L 21/66
H03K 21/02

Abstract:

A device with a first MEMS device and a second MEMS device is disclosed. The first MEMS device is configured to sense at least one external influence. The second MEMS device is responsive to the at least one external influence. The first MEMS device is configured to change a state when the at least one external influence exceeds a threshold value. The first MEMS device is configured to retain the state below the threshold value, wherein the change in state of the first MEMS device is done passively and wherein the state of the first MEMS device is indicative of a status of the second MEMS device. In one example, the first MEMS device further comprises a normally open switch that closes when the external influence exceeds the threshold value.

US Patent:

20190043920, Feb 7, 2019

Filed:

Aug 7, 2017

Appl. No.:

15/670976

Inventors:

- San Jose CA, US
Julius Ming-Lin TSAI - San Jose CA, US
Stephen LLOYD - Los Altos CA, US

Assignee:

InvenSense, Inc. - San Jose CA

International Classification:

H01L 27/20
G01N 29/24
G01N 29/28
H01L 41/113
B81C 1/00
G06K 9/00

Abstract:

An electronic device comprises a CMOS substrate having a first surface and a second surface opposite the first surface. A plurality of ultrasonic transducers is provided having a transmit/receive surface. A contact surface is piezoelectrically associated with the plurality of ultrasonic transducers and is formed on the first surface of the CMOS substrate. The plurality of ultrasonic transducers is disposed on the second surface of the CMOS substrate, with the transmit/receive side attached to the second surface thereof such that the CMOS substrate is between the plurality of ultrasonic transducers and the platen. An image sensing system is also provided, together with a method for ultrasonic sensing in the electronic device.

US Patent:

20160325984, Nov 10, 2016

Filed:

May 6, 2015

Appl. No.:

14/705616

Inventors:

- San Jose CA, US
Stephen LLOYD - Los Altos CA, US

International Classification:

B81B 7/00
B81C 1/00

Abstract:

A system and method for providing a chip scale package of a MEMS device are disclosed. The system is a chip scale package (CSP) that comprises a substrate, a cap substrate, a MEMS device substrate bonded to and located between both the substrate and the cap substrate, at least one solder ball, and a via support structure coupled to both the at least one solder ball and the substrate, wherein the MEMS device substrate and the cap substrate are mechanically isolated from the at least one solder ball. The method comprises coupling a MEMS device substrate to a cap substrate, forming at least one insulated via through both the MEMS device substrate and the cap substrate, providing singulation of the cap substrate to provide a via support structure that surrounds the at least one insulated via, and coupling at least one solder ball to the via support structure.

US Patent:

20160297670, Oct 13, 2016

Filed:

Apr 7, 2015

Appl. No.:

14/681071

Inventors:

- San Jose CA, US
STEPHEN LLOYD - LOS ALTOS CA, US
JOSEPH SEEGER - MENLO PARK CA, US

International Classification:

B81B 7/00

Abstract:

A device with a first MEMS device and a second MEMS device is disclosed. The first MEMS device is configured to sense at least one external influence. The second MEMS device is responsive to the at least one external influence. The first MEMS device is configured to change a state when the at least one external influence exceeds a threshold value. The first MEMS device is configured to retain the state below the threshold value, wherein the change in state of the first MEMS device is done passively and wherein the state of the first MEMS device is indicative of a status of the second MEMS device.

US Patent:

20160231117, Aug 11, 2016

Filed:

Feb 9, 2015

Appl. No.:

14/617391

Inventors:

- San Jose CA, US
Stephen Lloyd - Los Altos CA, US

International Classification:

G01C 19/5719

Abstract:

A system and/or method for efficiently operating a MEMS gyroscope without drive circuitry and/or with drive circuitry and a non-constant oscillating amplitude. In a non-limiting example, drive circuitry may be utilized to drive the MEMS gyroscope proof mass to a desired oscillating amplitude, and then the drive circuitry may be powered off. Rotational velocity may be sensed while the proof mass is being driven to a desired oscillating amplitude, while the proof mass is being maintained at a desired oscillating amplitude, and/or while the proof mass amplitude decays.