Stephen D Lloyd

US Patent:

20140264645, Sep 18, 2014

Filed:

Mar 14, 2013

Appl. No.:

13/831470

Inventors:

- Sunnyvale CA, US
Martin Lim - San Mateo CA, US
Li-Wen Hung - Wappingers Falls NY, US
Stephen Lloyd - Los Altos CA, US

Assignee:

Invensense, Inc. - Sunnyvale CA

International Classification:

H01L 27/12

US Classification:

257415

Abstract:

A Micro-Electro-Mechanical Systems (MEMS) device includes a first substrate with a first surface and a second surface, the first substrate including a base layer, a moveable beam disposed on the base layer, at least one metal layer, and one or more standoffs disposed on the base layer such that one or more metal layers are situated on the top surface of the one or more standoffs. The MEMS device further includes a second substrate including one or more metal layers bonded to the one or more standoffs resulting in an electrical connection between at least a portion of the one or more metal layers of the second substrate and one or more of the at least one electrode on the bottom surface and the at least one electrode on the top surface.

US Patent:

20140264656, Sep 18, 2014

Filed:

Feb 6, 2014

Appl. No.:

14/174639

Inventors:

- San Jose CA, US
Martin LIM - San Mateo CA, US
Xiang LI - Mountain View CA, US
Stephen LLOYD - Los Altos CA, US
Michael Julian DANEMAN - Campbell CA, US

Assignee:

InvenSense, Inc. - San Jose CA

International Classification:

B81B 7/00

US Classification:

257416

Abstract:

A MEMS device is disclosed. The MEMS device comprises a first plate with a first surface and a second surface; and an anchor attached to a first substrate. The MEMS device further includes a second plate with a third surface and a fourth surface attached to the first plate. A linkage connects the anchor to the first plate, wherein the first plate and second plate are displaced in the presence of an acoustic pressure differential between the first and second surfaces of the first plate. The first plate, second plate, linkage, and anchor are all contained in an enclosure formed by the first substrate and a second substrate, wherein one of the first and second substrates contains a through opening to expose the first surface of the first plate to the environment.