Stephen P Martin

US Patent:

6768965, Jul 27, 2004

Filed:

Apr 18, 2002

Appl. No.:

10/124901

Inventors:

Stephen L. Martin - Vancouver WA
Shigeru Oba - Vancouver WA
Yoshinori Suzuki - Fukushima-ken, JP

Assignee:

SEH America, Inc. - Vancouver

International Classification:

G01B 1500

US Classification:

702155, 438 16, 438 71

Abstract:

Methods and computer program products are provided for analyzing a crystalline structure, such as a wafer or an epitaxial layer in more detail, including the portion of the crystalline structure proximate the edge. The methods and computer program products of one aspect determine the average thickness and the normalized profile of a crystalline structure with enhanced detail. Additionally, the method and computer program product of another aspect represent the profile proximate the edge of the crystalline structure with a pair of lines that are selected to permit the profile of the crystalline structure proximate the edge of the crystalline structure to be characterized in more detail. Further, the method of yet another aspect permits the average edge profile for a plurality of crystalline structure to be defined.

US Patent:

20130255048, Oct 3, 2013

Filed:

Mar 15, 2013

Appl. No.:

13/838551

Inventors:

Nathan Crary - Portland OR, US
Stuart Jenkins - Goleta CA, US
Stephen Martin - Mendham NJ, US
Zihao Dong - Shijiazhuang, CN
Jiqiu Zhang - Tongzhou, CN

Assignee:

DECKERS OUTDOOR CORPORATION - Goleta CA

International Classification:

D06C 11/00
D01G 19/06
D01G 1/00
D01G 15/00
D06C 13/00
D06B 1/00

US Classification:

28162, 28165, 196, 19 66 R, 19 98, 19115 R

Abstract:

A method of making a sheared wool, deep pile fabric that closely resembles natural sheepskin fleece that includes forming a length of wool pile fabric having natural wool fibers on one side and a scrim on an opposing side and finishing the wool pile fabric as natural shearling. The finishing process includes polishing the wool fiber side of the pile fabric by guiding the length of pile fabric over one or more heated first polishing rolls, applying a sheepskin conditioning solution to the wool fiber side of the pile fabric, further polishing the wool fiber side of the pile fabric by guiding the fabric a plurality of times over one or more second heated polishing rolls, and cutting the wool fibers to a designated length.

US Patent:

62866850, Sep 11, 2001

Filed:

Dec 8, 1999

Appl. No.:

9/457903

Inventors:

Oleg V. Kononchuk - Brush Prairie WA
Stephen L. Martin - Vancouver WA

Assignee:

SEH America, Inc. - Vancouver WA

International Classification:

B07B 1500

US Classification:

209 2

Abstract:

A system and method for sorting semiconductor substrates based on substrate thickness. The invention includes weighing each semiconductor substrate to be sorted, and then calculating the thickness of each substrate from its mass, area and density. The system may be configured to automatically sort the substrates according to the weight-based thickness calculations.