Stephen J Springer

US Patent:

20040016995, Jan 29, 2004

Filed:

Jul 25, 2002

Appl. No.:

10/202975

Inventors:

Shun Kuo - Chandler AZ, US
Juergen Foerstner - Mesa AZ, US
Steven Markgraf - Chandler AZ, US
Craig Amrine - Tempe AZ, US
Ananda De Silva - Chandler AZ, US
Heidi Denton - Scottsdale AZ, US
Darrel Frear - Phoenix AZ, US
Henry Hughes - Scottsdale AZ, US
Stephen Springer - Mesa AZ, US

International Classification:

H01L023/02

US Classification:

257/678000

Abstract:

An exemplary method and apparatus for MEMS device control-chip integration and packaging comprises inter alia: a device substrate () comprising at least one MEMS device element () and at least a first interconnect pad (); and a control-chip lid substrate () comprising at least a second interconnect pad (), wherein the first interconnect pad () is suitably adapted for substantial engagement with the second interconnect pad () in order to communicably connect an integrated control chip () to a MEMS device element (). Disclosed features and specifications may be variously controlled, adapted or otherwise optionally modified to improve component density and/or form factor for any MEMS device. An exemplary embodiment of the present invention representatively provides for HV control-chip driver integration and packaging of RF MEMS switches.

US Patent:

20040087053, May 6, 2004

Filed:

Oct 31, 2002

Appl. No.:

10/286441

Inventors:

William Lytle - Chandler AZ, US
Owen Fay - Gilbert AZ, US
Steven Markgraf - Plymouth MN, US
Stephen Springer - Mesa AZ, US

Assignee:

Motorola Inc.

International Classification:

H01L021/00

US Classification:

438/051000, 438/127000

Abstract:

A method is disclosed for encapsulating micromechanical elements or features on a substrate. In accordance with the method, a first substrate () is provided which has a patterned surface (). A seed metallization () is then deposited onto the patterned surface, and a structural material layer (), which preferably comprises copper, is electroplated onto the seed metallization. A solder (), such as SnCu, is electroplated onto the metal layer, and the seed metallization, the structural material layer and the solder are removed from the first substrate as a cohesive structure (), through the application of heat or by other suitable means, such that a negative replica of the patterned surface is imparted to the structure. The structure may then be placed on a second substrate () such that the solder is in contact with the second substrate, after which the solder is reflowed. Prior to reflow, the solder may be exposed to a fluorinated plasma, which forms a dry flux on the solder surface in the form of fluorinated metal oxides.