Stephen B Sumner

US Patent:

20180204751, Jul 19, 2018

Filed:

Jul 13, 2016

Appl. No.:

15/743519

Inventors:

- Billerica MA, US
Stephen SUMNER - San Francisco CA, US

International Classification:

H01L 21/673

Abstract:

Substrate containers and/or portions thereof for use in the semiconductor manufacturing industry can be formed by injection molding metal slurries. More particularly, such substrate containers and/or portions thereof can be formed by injection molding metal slurries containing magnesium or magnesium alloys. Substrate containers, wherein at least a portion of the substrate container is injection molded from a metal slurry containing magnesium or magnesium alloy can exhibit improved permeation control of moisture and oxygen over, and as compared to, comparable substrate carriers formed of polymer based materials. Exemplary substrate containers can include wafer containers, reticle pods, disk shippers and/or work-in-process boxes.