Stephen Michael White

US Patent:

6357847, Mar 19, 2002

Filed:

Dec 18, 2000

Appl. No.:

09/739854

Inventors:

Richard N. Ellson - Palo Alto CA
David A. Mantell - Rochester NY
Stephen David White - Santa Clara CA

Assignee:

Xerox Corporation - Stamford CT

International Classification:

B41J 2938

US Classification:

347 12

Abstract:

This invention relates to a method and apparatus for stitching print swaths in an image-rendering device such as an acoustic ink printer. More particularly, the invention is directed to a method implemented in an apparatus to reduce the visual artifact caused by inaccurate paper advance between neighboring swaths of an ink emitter printhead. The method includes the provision of a âpuzzle cutâ or âzipperâ edge between swaths. In this regard, the image is divided into swaths and the edges thereof are dithered to vary the depth of the cut in accordance with the expected paper advance accuracy and other printing characteristics such as noise and variations in the width of print swaths for different printheads.

US Patent:

6742884, Jun 1, 2004

Filed:

Apr 19, 2001

Appl. No.:

09/838685

Inventors:

William S. Wong - Berkeley CA
Robert A. Street - Palo Alto CA
Stephen D. White - Santa Clara CA
Robert Matusiak - Sunnyvale CA
Raj B. Apte - Palo Alto CA

Assignee:

Xerox Corporation - Stamford CT

International Classification:

E03F 100

US Classification:

347 99, 347 46, 347 2, 347 14, 347 16, 347 17, 347 18, 430 5

Abstract:

A method and system for masking a surface to be etched is described. A droplet source ejects droplets of a masking material for deposit on a thin-film or other substrate surface to be etched. The temperature of the thin-film or substrate surface is controlled such that the droplets rapidly freeze upon contact with the thin-film or substrate surface. The thin-film or substrate is then etched. After etching the masking material is removed.

US Patent:

6872320, Mar 29, 2005

Filed:

Apr 19, 2001

Appl. No.:

09/838684

Inventors:

William S. Wong - Berkeley CA, US
Robert A. Street - Palo Alto CA, US
Stephen D. White - Santa Clara CA, US
Robert Matusiak - Sunnyvale CA, US
Raj B. Apte - Palo Alto CA, US

Assignee:

Xerox Corporation - Stamford CT

International Classification:

B44C001/22

US Classification:

216 13, 216 41, 216 42, 216 44

Abstract:

A method and system for masking a surface to be etched is described. A droplet source ejects droplets of a masking material for deposit on a thin-film or other substrate surface to be etched. The temperature of the thin-film or substrate surface is controlled such that the droplets rapidly freeze upon contact with the thin-film or substrate surface. The thin-film or substrate is then etched. After etching the masking material is removed.

US Patent:

6972261, Dec 6, 2005

Filed:

Jun 27, 2002

Appl. No.:

10/186092

Inventors:

William S. Wong - San Carlos CA, US
Steven E. Ready - Santa Cruz CA, US
Stephen D. White - Santa Clara CA, US
Alberto Salleo - San Francisco CA, US

Assignee:

Xerox Corporation - Stamford CT

International Classification:

H01L021/302

US Classification:

438706, 438719, 438763

Abstract:

A method and system for masking a surface to be etched is described. The method includes the operation of heating a phase-change masking material and using a droplet source to eject droplets of a masking material for deposit on a thin-film or other substrate surface to be etched. The temperature of the thin-film or substrate surface is controlled such that the droplets rapidly freeze after upon contact with the thin-film or substrate surface. The thin-film or substrate is then treated to alter the surface characteristics, typically by depositing a self assembled monolayer on the surface. After deposition, the masking material is removed. A material of interest is then deposited over the substrate such that the material adheres only to regions not originally covered by the mask such that the mask acts as a negative resist. Using such techniques, feature sizes of devices smaller than the smallest droplet printed may be fabricated.

US Patent:

7223700, May 29, 2007

Filed:

Oct 14, 2005

Appl. No.:

11/251525

Inventors:

William S. Wong - San Carlos CA, US
Steven E. Ready - Santa Cruz CA, US
Stephen D. White - Santa Clara CA, US
Alberto Salleo - San Francisco CA, US
Michael L. Chabinyc - Mountain View CA, US

Assignee:

Palo Alto Research Center Incorporated - Palo Alto CA

International Classification:

H01L 21/302

US Classification:

438706, 438725, 438758, 438761

Abstract:

A method and system for masking a surface to be etched is described. The method includes the operation of heating a phase-change masking material and using a droplet source to eject droplets of a masking material for deposit on a thin-film or other substrate surface to be etched. The temperature of the thin-film or substrate surface is controlled such that the droplets rapidly freeze after upon contact with the thin-film or substrate surface. The thin-film or substrate is then treated to alter the surface characteristics, typically by depositing a self assembled monolayer on the surface. After deposition, the masking material is removed. A material of interest is then deposited over the substrate such that the material adheres only to regions not originally covered by the mask such that the mask acts as a negative resist. Using such techniques, feature sizes of devices smaller than the smallest droplet printed may be fabricated.

US Patent:

7246958, Jul 24, 2007

Filed:

Nov 15, 2004

Appl. No.:

10/988905

Inventors:

Eric Saund - San Carlos CA, US
Babur B. Hadimioglu - Stockholm, SE
David L. Hecht - Palo Alto CA, US
John S. Fitch - Los Altos CA, US
Stephen D. White - Santa Clara CA, US
Marina LaPalma, legal representative - Menlo Park CA, US

Assignee:

Xerox Corporation - Stamford CT

International Classification:

B41J 3/36
B41J 29/38
B41J 3/28

US Classification:

400 88, 400 76

Abstract:

In accordance with one aspect of the present exemplary embodiment, provided is a hand-held printer system and method for printing on a target. The system includes a hand-held printer, a target position sensing system which senses a position of the target, and a hand-held printer position sensing system which senses a position of the hand-held printer relative to a printing surface of the target. A control mechanism actuates the printing of the hand-held printer based on the sensed positions.

US Patent:

7459225, Dec 2, 2008

Filed:

Nov 24, 2003

Appl. No.:

10/722156

Inventors:

Raj B. Apte - Palo Alto CA, US
David G. Duff - Woodside CA, US
Christian G. Van de Walle - Sunnyvale CA, US
Jeng Ping Lu - Mountain View CA, US
Alberto Salleo - San Francisco CA, US
Stephen D. White - Santa Clara CA, US

International Classification:

H01M 8/10

US Classification:

429 30

Abstract:

An improved fuel cell is described. The invention addresses the problem of mechanical failure in thin electrolytes. One embodiment varies the thickness of the electrolyte and positions at least either the anode or cathode in the recessed region to provide a short travel distance for ions traveling from the anode to the cathode or from the cathode to the anode. A second embodiment uses a uniquely shaped manifold cover to allow close positioning of the anode to the cathode. Using the described structures results in a substantial improvement in fuel cell reliability and performance.

US Patent:

7524015, Apr 28, 2009

Filed:

Dec 20, 2006

Appl. No.:

11/642146

Inventors:

Uma Srinivasan - Mountain View CA, US
Stephen David White - Santa Clara CA, US
Eric J. Shrader - Belmont CA, US
Steven E. Ready - Mountain View CA, US
Scott Jong Ho Limb - Palo Alto CA, US

Assignee:

Palo Alto Research Center Incorporated - Palo Alto CA

International Classification:

B41J 29/393

US Classification:

347 19, 438706

Abstract:

A method of jet-printing smooth micro-scale features is presented. The desired feature prior to being printed is masked by various decimation filters and the decimation is performed at various pitches. The subsequently printed image is then scanned and analyzed to determine the roughness of the lines. The optimum decimation pitch is determined by the feature that exhibits the least amount of droplet spreading and has the lowest edge roughness. The optimum decimation pitch may also be calculated from the material properties and the dynamics of fluids.