Steve Nicholas

US Patent:

8098191, Jan 17, 2012

Filed:

Nov 5, 2008

Appl. No.:

12/265063

Inventors:

Albert N. Pergande - Orlando FL, US
Steven G. Gray - Orlando FL, US
Hung Q. Le - Orlando FL, US
Steve T. Nicholas - Clermont FL, US

Assignee:

Lockheed Martin Corporation - Bethesda MD

International Classification:

G01S 13/87
G01S 13/88
G01S 13/00

US Classification:

342 61, 342 27, 342 59, 342 62, 342 67, 342118, 342128, 342130, 342131, 342132, 342134, 342175, 342195, 89 111, 244 31

Abstract:

An apparatus and method for protecting against incoming projectiles comprising transmitting two radar waveforms, the first waveform comprising a pulsed continuous wave waveform, and the second waveform comprising a pulsed linear chirp waveform over a bandwidth, and based on returned radar data, causing deployment of a defense mechanism to intercept a detected incoming projectile.

US Patent:

8245390, Aug 21, 2012

Filed:

Nov 6, 2007

Appl. No.:

11/935994

Inventors:

William S. McKinley - Clermont FL, US
Steve T. Nicholas - Groveland FL, US
Jeffery A. Dean - Clermont FL, US

Assignee:

Lockheed Martin Corporation - Bethesda MD

International Classification:

H05K 3/02
H05K 3/10

US Classification:

29846, 29830, 29831

Abstract:

The present invention relates to a method of manufacturing a printed wiring board (PWB) of the type depicted in FIG. . Such a PWB comprises a first substrate and alternating layers of a second substrate and a metal layer. The layer metallization of the PWB is a thick layer of a composite engineered metal material having a configurable coefficient of thermal expansion (CTE) to provide CTE matching with respect to radio frequency (RF) components mounted on the PWB, and having substantial heat dissipation properties to dissipate heat generated by the RF components. This composite metal layer also provides a ground plane for the RF components.

US Patent:

20130048346, Feb 28, 2013

Filed:

Jul 18, 2012

Appl. No.:

13/552526

Inventors:

William S. MCKINLEY - Clermont FL, US
Steve T. Nicholas - Groveland FL, US
Jeffery A. Dean - Clermont FL, US

International Classification:

H05K 7/20
H05K 1/11

US Classification:

174252

Abstract:

The present invention relates to a method of manufacturing a printed wiring board (PWB) of the type depicted in FIG. and to the resulting PWB. Such a PWB comprises a first substrate and alternating layers of a second substrate and a metal layer. The layer 2 metallization of the PWB is a thick layer of a composite engineered metal material having a configurable coefficient of thermal expansion (CTE) to provide CTE matching with respect to radio frequency (RF) components mounted on the PWB, and having substantial heat dissipation properties to dissipate heat generated by the RF components. This composite metal layer also provides a ground plane for the RF components.