Steven R Allen

US Patent:

7762755, Jul 27, 2010

Filed:

Jul 11, 2006

Appl. No.:

11/485145

Inventors:

Daniel A. Hall - West Newbury MA, US
Christopher Hofmeister - Hampstead NH, US
William Fosnight - Carlisle MA, US
Jeff G. Araujo - Tyngsboro MA, US
Steven Allen - Nashua NH, US
Glenn Sindledecker - Dracut MA, US

Assignee:

Brooks Automation, Inc. - Chelmsford MA

International Classification:

B65B 69/00

US Classification:

414411

Abstract:

A substrate processing apparatus has a frame and a load port connected to the frame and adapted to mate a substrate transport container to the frame. The apparatus has transportable storage that is adapted to be removably connected to the frame and fit beneath the load port. The storage may be an enclosure housing electrical, mechanical, or electromechanical devices of the substrate processing apparatus.

US Patent:

8182192, May 22, 2012

Filed:

Jul 26, 2010

Appl. No.:

12/843659

Inventors:

Daniel A. Hall - West Newbury MA, US
Christopher Hofmeister - Hampstead NH, US
William Fosnight - Carlisle MA, US
Jeff G. Araujo - Tyngsboro MA, US
Steven Allen - Nashua NH, US
Glenn Sindledecker - Dracut MA, US

Assignee:

Brooks Automation, Inc. - Chelmsford MA

International Classification:

B65B 69/00

US Classification:

414411

Abstract:

A substrate processing apparatus has a frame and a load port connected to the frame and adapted to mate a substrate transport container to the frame. The apparatus has transportable storage that is adapted to be removably connected to the frame and fit beneath the load port. The storage may be an enclosure housing electrical, mechanical, or electromechanical devices of the substrate processing apparatus.

US Patent:

8556473, Oct 15, 2013

Filed:

Aug 5, 2010

Appl. No.:

12/851001

Inventors:

Ming Li - Acton MA, US
Steven C. Allen - Beverly MA, US
Sarah Bazydola - Belmont MA, US

Assignee:

OSRAM SYLVANIA Inc. - Danvers MA

International Classification:

F21V 7/00

US Classification:

362350, 36224902

Abstract:

A lamp assembly, and method for making same. The lamp assembly includes first and second truncated reflector cups. The lamp assembly also includes at least one base plate disposed between the first and second truncated reflector cups, and a light engine disposed on a top surface of the at least one base plate. The light engine is configured to emit light to be reflected by one of the first and second truncated reflector cups.

US Patent:

20130088142, Apr 11, 2013

Filed:

Oct 5, 2012

Appl. No.:

13/645790

Inventors:

Osram Sylvania Inc. - Danvers MA, US
Steven C. Allen - Mason OH, US

Assignee:

OSRAM SYLVANIA INC. - Danvers MA

International Classification:

H05B 33/02

US Classification:

313498

Abstract:

Arrangements of solid state light sources for color-mixing, and light sources including the same, are provided. A substrate has and a plurality of different color LED chips coupled thereto. The emitted light is mixed to produce a white light output. The LED chips are arranged on the substrate in a manner that improves color-mixing, for example, by forming LED sets including one or more LED chips of different colors, by skewing the LED chips, and/or by forming a non-rectangular array or a circular array of LED sets and/or chips. The color-mixing LED arrangement may be used in a lamp or other light source together with collimating optics to collimate and further mix the color-mixed light output from the LED arrangement. The color-mixing LED arrangement may be provided as a single package with multiple LED chips or as multiple packages of one or more LED chips.

US Patent:

20130307422, Nov 21, 2013

Filed:

May 15, 2012

Appl. No.:

13/471650

Inventors:

Fred Palmer - Danvers MA, US
Kerry Denvir - Cambridge MA, US
Steven Allen - Mason OH, US

Assignee:

OSRAM SYLVANIA INC. - Danvers MA

International Classification:

H05B 37/02

US Classification:

315186

Abstract:

A driver circuit for a light source including one or more solid state light sources, a luminaire including the same, and a method of so driving the solid state light sources are provided. The driver circuit includes a rectifier circuit that receives an alternating current (AC) input voltage and provides a rectified AC voltage. The driver circuit also includes a switching converter circuit coupled to the light source. The switching converter circuit provides a direct current (DC) output to the light source in response to the rectified AC voltage. The driver circuit also includes a mixing circuit, coupled to the light source, to switch current through at least one solid state light source of the light source in response to each of a plurality of consecutive half-waves of the rectified AC voltage.

US Patent:

59932597, Nov 30, 1999

Filed:

Feb 7, 1997

Appl. No.:

8/797537

Inventors:

Philip T. Stokoe - Attleboro MA
Thomas Cohen - New Boston NH
Steven J. Allen - Nashua NH

Assignee:

Teradyne, Inc. - Boston MA

International Classification:

H01R 13648

US Classification:

439608

Abstract:

A high speed, high density electrical connector for use with printed circuit boards. The connector is in two pieces with one piece having pins and shield plates and the other having socket type signal contacts and shield plates. The shields have a grounding arrangement which is adapted to control the electromagnetic fields, for various system architectures, simultaneous switching configurations and signal speeds, allowing all of the socket type signal contacts to be used for signal transmission. Additionally, at least one piece of the connector is manufactured from wafers, with each ground plane and signal column injection molded into components which, when combined, form a wafer. This construction allows very close spacing between adjacent columns of signal contacts as well as tightly controlled spacing between the signal contacts and the shields. It also allows for easy and flexible manufacture, such as a connector that has wafers intermixed in a configuration to accommodate single ended, point to point and differential applications.

US Patent:

62382454, May 29, 2001

Filed:

Aug 26, 1999

Appl. No.:

9/389854

Inventors:

Philip T. Stokoe - Attleboro MA
Thomas Cohen - New Boston NH
Steven J. Allen - Nashua NH

International Classification:

H01R 13648

US Classification:

439608

Abstract:

A high speed, high density electrical connector for use with printed circuit boards. The connector is in two pieces with one piece having pins and shield plates and the other having socket type signal contacts and shield plates. The shields have a grounding arrangement which is adapted to control the electromagnetic fields, for various system architectures, simultaneous switching configurations and signal speeds, allowing all of the socket type signal contacts to be used for signal transmission. Additionally, at least one piece of the connector is manufactured from wafers, with each ground plane and signal column injection molded into components which, when combined, form a wafer. This construction allows very close spacing between adjacent columns of signal contacts as well as tightly controlled spacing between the signal contacts and the shields. It also allows for easy and flexible manufacture, such as a connector that has wafers intermixed in a configuration to accommodate single ended, point to point and differential applications.