Steven E Bergerson

US Patent:

6776923, Aug 17, 2004

Filed:

Jun 7, 2002

Appl. No.:

10/165436

Inventors:

Charles Balian - Guilford CT
Stephen G. Wojtowicz - Shelton CT
Steven E. Bergerson - Milford CT

Assignee:

Saint-Gobain Performance Plastics Corporation - Wayne NJ

International Classification:

C09K 500

US Classification:

252 71, 252 70

Abstract:

Disclosed is a thermal interface composition which undergoes a viscoelastic change at microprocessor operating temperatures to transfer heat generated by a heat source to a heat sink, the composition comprising: (A) a viscoelastic composition which softens at about the operating temperature of the heat source, the viscoelastic composition comprising: (1) a thermoplastic elastomer, (2) a compatible hydrocarbon oil, and (3) a tackifying resin; (B) a dispersing agent; and (C) a thermally conductive filler dispersed within the viscoelastic composition. Also disclosed is a method for making the thermal interface composition.

US Patent:

7147367, Dec 12, 2006

Filed:

Jun 11, 2002

Appl. No.:

10/166667

Inventors:

Charles Balian - Guilford CT, US
Steven E. Bergerson - Milford CT, US
Gregg C. Currier - Norfolk CT, US

Assignee:

Saint-Gobain Performance Plastics Corporation - Wayne NJ

International Classification:

G01N 25/04
G01K 1/12

US Classification:

374 44, 374152, 361679, 428355 R

Abstract:

A thermal interface composition undergoes a viscoelastic change at microprocessor operating temperatures to transfer heat generated by a heat source, such as a microprocessor to a heat sink. The composition includes a low melting alloy dispersed in a matrix. The matrix comprises a viscoelastic composition which softens at about the operating temperature of the heat source. The viscoelastic composition may include a thermoplastic elastomer, a compatible hydrocarbon oil, and a tackifying resin. In use, the thermal interface composition flows under pressure between the heat source and the heat sink to make thermal contact between the two. When the heat source is operated and reaches operating temperature, the viscoelastic composition softens and the low melting alloy melts at around the operating temperature to form a highly thermally conductive, generally homogeneous mixture which readily transfers heat to the heat sink.