Steven S Chan

US Patent:

6525650, Feb 25, 2003

Filed:

Jun 11, 1999

Appl. No.:

09/330335

Inventors:

Steven S. Chan - Alhambra CA
George M. Hayashibara - Los Angeles CA
Davie C. Liu - Rancho Palos Verdes CA

Assignee:

TRW Inc. - Redondo Beach CA

International Classification:

H04Q 522

US Classification:

340 1469, 340 141, 340 142, 340 22, 340 221, 340 227, 455103, 4552771, 455562

Abstract:

A high density electronic switching matrix (ESM) includes several splitting modules ( ) arranged along a first axis, each including a signal input ( ) and several splitter outputs ( ). The ESM ( ) further includes several switching modules ( ) arranged along a second axis perpendicular to the first axis. Each switching module ( ) includes switching inputs ( ) coupled individually to an output of each of the splitting modules ( ). The ESM ( ) is further characterized by couplings between the splitter modules and the switching modules. The couplings are formed by mating male and female connectors ( ) integrated into the splitting modules and the switching modules. The couplings support extremely high frequency operation. The splitting modules ( ) and the switching modules ( ) may thus be coupled closely together to form a dense, high frequency, switching matrix, and may be stacked upon one another.

US Patent:

6897739, May 24, 2005

Filed:

Mar 13, 2003

Appl. No.:

10/387717

Inventors:

Steven S. Chan - Alhambra CA, US
Paul S. Lee - La Palma CA, US

Assignee:

Northrop Grumman Corporation - Los Angeles CA

International Classification:

H01P005/12

US Classification:

333127, 333113, 333137

Abstract:

A compact inline waveguide power divider is provided that comprises a primary waveguide in communication with two parallel waveguides. The two parallel waveguides are stacked on top of one another and each parallel waveguide further comprises an output port. Accordingly, an input signal is transmitted through the primary waveguide and split between the two parallel waveguides. A resistive slot is formed in each of the parallel waveguides, thereby increasing output port isolation through dissipation of reflected power from one output port to the other. Further, a stepped or tapered impedance transformation is applied in each parallel waveguide to provide wide band frequency matching. Alternately, the primary waveguide and the parallel waveguides may be configured as a waveguide power combiner rather than a divider, wherein the parallel waveguides comprise input ports and the primary waveguide comprises an output port.

US Patent:

7053847, May 30, 2006

Filed:

Aug 11, 2004

Appl. No.:

10/917986

Inventors:

Steven S. Chan - Alhambra CA, US
Te Kao Wu - Rancho Palos Verdes CA, US
Arun Bhattacharyya - El Segundo CA, US
Juan Rivera - Torrance CA, US
Phillip L. Metzen - Hermosa Beach CA, US

Assignee:

Northrop Grumman Corporation - Los Angeles CA

International Classification:

H01Q 13/12
H01Q 13/10

US Classification:

343769, 343770

Abstract:

A phased array antenna structure capable of operation at millimeter-wave frequencies and having multiple ring slot radiator elements (). The RF feed structure for each radiator element includes a feed via () extending part-way through a multi-layer structure () on which the radiator elements () are formed and a strip line feed probe () extending from the via () toward the radiator element. A key feature facilitating high-frequency operation is the inclusion of multiple mode suppressors () surrounding the via () and providing a smooth transition from a coaxial mode of RF transmission to a strip line mode of RF transmission. The feed probe () is tailored to provide either a narrow-band or a wideband frequency characteristic.

US Patent:

7432780, Oct 7, 2008

Filed:

Nov 23, 2005

Appl. No.:

11/287414

Inventors:

Steven S. Chan - Alhambra CA, US
Te Kao Wu - Rancho Palos Verde CA, US

Assignee:

Northrop Grumman Corporation - Los Angeles CA

International Classification:

H01P 5/12
H03H 7/48

US Classification:

333127, 333132, 333135, 333137

Abstract:

A rectangular-to-circular mode combiner/divider is provided. In one aspect of the invention, a power combiner is provided that comprises a plurality of rectangular waveguide ports arranged in an integral arrangement. Each rectangular waveguide port is operative to operate in a rectangular mode. The power combiner is also includes a circular waveguide port operative to operate in a circular mode, and a transition body that couples the plurality of rectangular waveguide ports to the circular waveguide port. The transition body has an inner transition cavity and an outer body operative to convert radio frequency (RF) signals between the rectangular mode and the circular mode, and provide a combined output signal at the circular waveguide port from RF signals received at the plurality rectangular waveguide ports.

US Patent:

60280077, Feb 22, 2000

Filed:

Mar 23, 1999

Appl. No.:

9/274832

Inventors:

Steven S. Chan - Alhambra CA
John E. Dowsing - Redondo Beach CA
Jason E. Snodgress - Playa Del Rey CA

Assignee:

TRW Inc. - Redondo Beach CA

International Classification:

H01L 21311

US Classification:

438694

Abstract:

The invention relates to a method for producing low cost hermetic Integrated Module Assembly (IMA) packaging, where an aluminum coating (24) is deposited on a poly-tetrafluoral-ethaline substrate (20), the aluminum coating (24) is selectively etched to form a waveguide window (26) and the substrate (20) is selectively treated over the waveguide window (26) to produce a non-conductive hermetic seal. The substrate (20) is then joined to a metal carrier (28) containing the waveguide (30). As a result of using selectively treated low cost substrates to produce hermetic seals, more expensive substrates are not required to form hermetic seals over substrate to waveguide interconnections.

US Patent:

6131269, Oct 17, 2000

Filed:

May 18, 1998

Appl. No.:

9/080423

Inventors:

Alfred E. Lee - Torrance CA
Steven S. Chan - Alhambra CA

Assignee:

TRW Inc. - Redondo Beach CA

International Classification:

H01P 1100

US Classification:

29600

Abstract:

A circuit module construction and method for its fabrication, in which radio-frequency (RF) or millimeter-wave circuit components (10) are electromagnetically isolated in a circuit module (12), to allow for location of multiple circuit components in close proximity without concern for signal loss or interference between components. Multiple RF or millimeter-wave circuit components (10) are installed on a dielectric substrate (14) and are separated by at least one metal isolation wall (20), which extends in depth all the way through the dielectric substrate (14) to a metal layer (16) formed under the substrate. Each isolation wall (20) is formed by first cutting a channel through the dielectric substrate (14), preferably using a laser that selectively removes the dielectric material but not the metal layer (16). Then the channel is filled with metal by electroplating, to provide continuous electromagnetic isolation in a lateral direction, parallel to the plane of the substrate (14).

US Patent:

53369920, Aug 9, 1994

Filed:

Jun 3, 1992

Appl. No.:

7/892908

Inventors:

Yoshio Saito - Westchester CA
James C. Lau - Torrance CA
Steven S. Chan - Alhambra CA
Richard P. Malmgren - Rancho Dominguez CA

Assignee:

TRW Inc. - Redondo Beach CA

International Classification:

G01R 106
G01R 3102

US Classification:

324754

Abstract:

An electrical testing device is provided for testing integrated circuits located on a wafer. The testing device employs a multi-layer test circuit having a plurality of contacts for contacting the integrated circuits on a wafer. The layers of the test circuit are embedded in a flexible, supportive dielectric material which allows vertical flexing of the contacts. Cross bar switches are further employed to switch among the plurality of contacts thereby enabling the testing of individual dies of the water to be tested. A microprocessor is further included for controlling the switching and the testing of each die. In an alternate embodiment, the plurality of contacts are mechanically moved relative to the wafer to allow testing of the dies without the need for the switches.

US Patent:

60972653, Aug 1, 2000

Filed:

Nov 24, 1998

Appl. No.:

9/198778

Inventors:

Steven S. Chan - Alhambra CA
Roger A. Davidheiser - Manhattan Beach CA
Alfred E. Lee - Torrance CA
D. Ian Stones - Torrance CA

Assignee:

TRW Inc. - Redondo Beach CA

International Classification:

H01P 5103

US Classification:

333 26

Abstract:

A waveguide structure (10) that provides a transition from a polymeric waveguide (26) to a coaxial connection (48). The coaxial connection (48) includes an outer conductor (50) electrically connected to a top ground plate (36) of the waveguide (26) and an inner conductor (52) that extends into the polymeric material within the waveguide (26). The inner conductor (52) is electrically connected to a capacitive plate (56), and the capacitive plate (56) is electrically connected to an elongated conductive probe (58). The conductive probe (58) is electrically connected to a conductive post (60), which is electrically connected to a bottom ground plate (38) opposite to the top ground plate (36). The conductive probe (58) extends in a direction transverse to the propagation direction of electromagnetic waves, and acts to pick up the energy in the electromagnetic radiation. The capacitive plate (56) provides a shunt capacitance that resonates out the inductance caused by the conductive probe (58) and the inner conductor (52).