Steven M Dutton

US Patent:

7290326, Nov 6, 2007

Filed:

Jul 22, 2005

Appl. No.:

11/187220

Inventors:

Steven Lee Dutton - Phoenix AZ, US

Assignee:

Dynaco Corp. - Tempe AZ

International Classification:

B23P 19/00

US Classification:

29738, 29739, 29830

Abstract:

A method and apparatus for producing high layer count, multi-layer circuits which includes fabricating a fixture having an opening therein for placement within a press. A material stack, particularly a material stack having multiple layers of liquid crystalline polymer, is placed within the opening of the fixture before activating the press to laminate the material stack positioned within the fixture.

US Patent:

7754417, Jul 13, 2010

Filed:

May 21, 2007

Appl. No.:

11/751350

Inventors:

Steven Lee Dutton - Phoenix AZ, US

International Classification:

G03F 7/00
G03F 7/40

US Classification:

430331, 430311, 430325, 430329, 430330

Abstract:

A method for making printed circuits and printed circuit boards which includes coating a non-metallized substrate and plating an image of a desired circuit design directly onto the coated substrate without the need to image the circuit design on an intermediate silver halide polyester film or diazo and utilizing existing imaging, developing and etching subtractive techniques in conventional printed circuit board processing.

US Patent:

8293461, Oct 23, 2012

Filed:

Jun 18, 2008

Appl. No.:

12/141662

Inventors:

Steven Lee Dutton - Phoenix AZ, US

Assignee:

VectraOne Technologies, LLC - Phoenix AZ

International Classification:

G03F 7/00
G03F 7/40

US Classification:

430331, 430311, 430324, 430325, 430329, 430330

Abstract:

A direct emulsion process for making printed circuits and printed circuit boards which includes coating a non-metallized substrate with a solution which creates a light sensitive surface on the substrate, imaging the coated substrate with a circuit design, developing the imaged substrate, and directly plating the developed image onto the coated substrate. Coating solutions which work particularly well in this process include a ferric oxalate and palladium emulsion or a silver based emulsion.

US Patent:

8313891, Nov 20, 2012

Filed:

Jul 12, 2010

Appl. No.:

12/834433

Inventors:

Steven Lee Dutton - Phoenix AZ, US

Assignee:

VectraOne Technologies, LLC - Phoenix AZ

International Classification:

G03F 7/00
G03F 7/40

US Classification:

430331, 430311, 430325, 430329, 430330

Abstract:

A method for making printed circuits and printed circuit boards which includes coating a non-metallized substrate and plating an image of a desired circuit design directly onto the coated substrate without the need to image the circuit design on an intermediate silver halide polyester film or diazo and utilizing existing imaging, developing and etching subtractive techniques in conventional printed circuit board processing. One exemplary embodiment of the method for making printed circuit boards includes coating a non-metallized substrate with a palladium based material including a ferric based solution combined with palladium.

US Patent:

20070107837, May 17, 2007

Filed:

Nov 6, 2006

Appl. No.:

11/593808

Inventors:

Steven Dutton - Phoenix AZ, US

International Classification:

B29C 65/00

US Classification:

156285000, 156182000

Abstract:

A method and apparatus for producing high layer count, multi-layer circuits which includes fabricating a fixture having an opening therein for placement within a press. A material stack, particularly a material stack having multiple layers of liquid crystalline polymer, is placed within the opening of the fixture before activating the press to laminate the material stack positioned within the fixture.

US Patent:

20070234560, Oct 11, 2007

Filed:

May 15, 2007

Appl. No.:

11/749100

Inventors:

Steven Dutton - Phoenix AZ, US

International Classification:

H05K 3/36
H05K 1/00

US Classification:

029830000, 174250000, 029744000, 029739000

Abstract:

A method and apparatus for producing high layer count, multi-layer circuits which includes fabricating a fixture having an opening therein for placement within a press. A material stack, particularly a material stack having multiple layers of liquid crystalline polymer, is placed within the opening of the fixture before activating the press to laminate the material stack positioned within the fixture.

US Patent:

20070234562, Oct 11, 2007

Filed:

May 15, 2007

Appl. No.:

11/749102

Inventors:

Steven Dutton - Phoenix AZ, US

International Classification:

H05K 3/36
C04B 37/00

US Classification:

029839000, 156089230, 174250000, 029852000, 029831000

Abstract:

A method and apparatus for producing high layer count, multi-layer circuits which includes fabricating a fixture having an opening therein for placement within a press. A material stack, particularly a material stack having multiple layers of liquid crystalline polymer, is placed within the opening of the fixture before activating the press to laminate the material stack positioned within the fixture.

US Patent:

20080292784, Nov 27, 2008

Filed:

May 19, 2008

Appl. No.:

12/123323

Inventors:

Steven Lee Dutton - Phoenix AZ, US

International Classification:

B05D 5/12

US Classification:

427 989

Abstract:

A method for making printed circuits and printed circuit boards which utilizes a process for forming a thin metal layer, such as a copper layer, on underlying substrates such as a liquid crystalline polymer material. Forming such a thin metal layer on the surface of the substrate enables fine line imaging for forming printed circuits and printed circuit boards. The process includes providing a metallized substrate, removing the metal from the substrate, vacuum baking the substrate, dipping the substrate in permanganate solution, rinsing the substrate with water, neutralizing the substrate, subjecting the substrate to an electroless copper procedure and plating the substrate with copper.