Steven R Garcia

US Patent:

6716038, Apr 6, 2004

Filed:

Jul 31, 2002

Appl. No.:

10/209009

Inventors:

Steven E. Garcia - League City TX

Assignee:

Medallion Technology, LLC - Houston TX

International Classification:

H01R 909

US Classification:

439 75

Abstract:

A three-dimensional circuit module includes z-axis connection pins, such as twist pins to electrically connect multiple, spaced-apart substrates, such as circuit boards. An expanding portion of a bulge of the pin mechanically and electrically contacts a corner edge of a via in a substrate without full insertion of the bulge in the via. Compression of the expanding portion of the non-inserted bulge establishes the electrical connection, which is also assisted by the longitudinal restraint on the pin relative to the substrate. Assembly and disassembly is facilitated without requiring the bulge to be fully inserted into the via.

US Patent:

7797821, Sep 21, 2010

Filed:

Aug 22, 2007

Appl. No.:

11/894874

Inventors:

Steven E. Garcia - Kemah TX, US
Randall J. Boudreaux - Colorado Springs CO, US

Assignee:

Medallion Technology, LLC - Houston TX

International Classification:

B23B 19/00

US Classification:

29747, 29748, 29749, 29 33 M, 29868

Abstract:

A connection portion of a z-axis interconnector is assembled into contact with a plurality of aligned vias in a corresponding plurality of stacked printed circuit boards by gripping and pulling a leader portion of the interconnector connected to the connection portion, to move the interconnector into the final position with the connection portion contacting the aligned vias. The leader portion is severed from the connection portion after the interconnector is moved into the final position. A single pulling and cutting tool which accomplishes these functions preferably does so by a single pinch and cut device having opposing blades which partially penetrate into the leader portion to grip the leader portion, which fully penetrated through the leader portion to sever the leader portion, and which are moved toward and away from the plurality of stacked printed circuit boards to pull the interconnector and to reposition for severing the leader portion.

US Patent:

8141238, Mar 27, 2012

Filed:

Mar 3, 2010

Appl. No.:

12/717050

Inventors:

Steven E. Garcia - Kemah TX, US
Randall J. Boudreaux - Colorado Springs CO, US

Assignee:

Medallion Technology, LLC - Houston TX

International Classification:

B23B 19/00

US Classification:

29747, 29748, 29749, 29 33 M, 29868

Abstract:

Twist pin z-axis interconnectors are assembled in columns of aligned vias in stacked printed circuit boards of a circuit module in automated assembly cycles. Each assembly cycle involves singulating a single twist pin from a plurality of twist pins, inserting the twist pin into the via column, gripping a leader portion of the twist pin, pulling the gripped leader portion until a connection portion moves into contact with the vias of the column, severing the leader portion from the connection portion, extracting the severed leader portion, and automatically repeating assembly cycles until interconnectors have been assembled into a substantial majority of the via columns of the circuit module.

US Patent:

8424197, Apr 23, 2013

Filed:

Dec 21, 2011

Appl. No.:

13/332888

Inventors:

Steven E. Garcia - Kemah TX, US
Randall J. Boudreaux - Colorado Springs CO, US

Assignee:

Medallion Technology, LLC - Houston TX

International Classification:

B23P 19/00

US Classification:

29747, 29844, 29868, 29748

Abstract:

Twist pin z-axis interconnectors are assembled in columns of aligned vias in stacked printed circuit boards of a circuit module in automated assembly cycles. Each assembly cycle involves singulating a single twist pin from a plurality of twist pins, inserting the twist pin into the via column, gripping a leader portion of the twist pin, pulling the gripped leader portion until a connection portion moves into contact with the vias of the column, severing the leader portion from the connection portion, extracting the severed leader portion, and automatically repeating assembly cycles until interconnectors have been assembled into a substantial majority of the via columns of the circuit module.

US Patent:

8613622, Dec 24, 2013

Filed:

Feb 15, 2011

Appl. No.:

13/028098

Inventors:

Steven E. Garcia - Kemah TX, US
Douglas R. Kocher - Happy Valley OR, US

Assignee:

Medallion Technology, LLC - Houston TX

International Classification:

H01R 12/00

US Classification:

439 66, 439 75

Abstract:

A twist pin is used as an interconnect interface to conduct signals to and from an electronic component. The twist pin includes a bulge which establishes compressive contact force with a sidewall of a via in which the twist pin resides, and the resulting force resists movement of the end of the twist pin away from the electronic component to assure good signal conductivity. The arrangement may be used as a test socket for testing integrated circuit components or permanently docking electronic components.

US Patent:

20100107409, May 6, 2010

Filed:

Jan 12, 2010

Appl. No.:

12/685902

Inventors:

Steven E. Garcia - Kemah TX, US
Randall J. Boudreaux - Colorado Springs CO, US

International Classification:

H05K 3/36

US Classification:

29830

Abstract:

A connection portion of a z-axis interconnector is assembled into contact with a plurality of aligned vias in a corresponding plurality of stacked printed circuit boards by gripping and pulling a leader portion of the interconnector connected to the connection portion, to move the interconnector into the final position with the connection portion contacting the aligned vias. The leader portion is severed from the connection portion after the interconnector is moved into the final position. A single pulling and cutting tool which accomplishes these functions preferably does so by a single pinch and cut device having opposing blades which partially penetrate into the leader portion to grip the leader portion, which fully penetrated through the leader portion to sever the leader portion, and which are moved toward and away from the plurality of stacked printed circuit boards to pull the interconnector and to reposition for severing the leader portion.

US Patent:

61696633, Jan 2, 2001

Filed:

Mar 12, 1998

Appl. No.:

9/041572

Inventors:

Steven E. Garcia - League City TX

Assignee:

Medallion Technology, LLC - Houston TX

International Classification:

H05K 336

US Classification:

361760

Abstract:

A method and apparatus is provided for electrically and mechanically interconnecting electronic circuit assemblies or electronic modules. An integrated circuit (300) includes a plurality of leads (302) extending from a surface (305), each of the leads (302) having a seating portion (403) and a stem portion (402). A printed circuit board (400) includes a plurality of plated through holes (401) therein corresponding to the plurality of leads (302) extending from the integrated circuit (300). The steps of the method include positioning the printed circuit board (400) so that a lower surface (404) of the printed circuit board (400) rests on the seating portion (403) of the leads (302) of the integrated circuit (300), and so that the stem portion (302) of each of the leads are positioned within the corresponding plated through holes (401) in the printed circuit board (400). An electrically conductive epoxy adhesive (602) is then dispensed into the holes (401) having the leads (302) therein, and cured to form a solid, electrical, and mechanical connection between the printed circuit board (400) and integrated circuit (300).