Steven J Mccarthy

US Patent:

7476014, Jan 13, 2009

Filed:

Aug 17, 2007

Appl. No.:

11/840451

Inventors:

Steven Dennis McCarthy - Farmington Hills MI, US
Scott William Nicol - Ontario, CA
Chris Greco - Livonia MI, US
John Kallio - Redford MI, US

Assignee:

Visteon Global Technologies, Inc. - Van Buren Township MI

International Classification:

H01R 13/625

US Classification:

362519, 362548

Abstract:

A vehicle headlamp unit that is configured for use with either a halogen lamp or a high intensity discharge lamp. The headlamp unit includes a housing within which a reflector is located for reflecting light from the headlamp unit. A lamp is supported within the reflector and a lamp socket is electrically connected to the lamp. The lamp socket including a wire harness receptacle having a first configuration that is configured to matingly engage the wire harness connector. A secondary receptacle is also connected to the housing. The secondary receptacle has a second configuration that at least partially duplicates the first configuration and is configured to matingly engage the wire harness connector. Accordingly, both the wire harness receptacle and the secondary receptacle are configured to alternately receive and matingly engage the wire harness connector.

US Patent:

20090073713, Mar 19, 2009

Filed:

Sep 7, 2007

Appl. No.:

11/851844

Inventors:

Andrew Z. Glovatsky - Plymouth MI, US
Steven D. McCarthy - Farmington Hills MI, US
Richard T. McCarthy - Sterling Heights MI, US
Joseph Binetti - Howell MI, US
Donald Pope - South Lyon MI, US

International Classification:

H01J 61/94
B60Q 1/00
F21V 5/00
F21V 21/00

US Classification:

362520, 313 1

Abstract:

A substrate assembly for use in a lamp has a main printed wiring board and a standoff board. The main printed wiring board has a main surface with one or more LED packages disposed on the main surface and electrically connected thereto. The standoff board is disposed on the main surface of the main printed wiring board. The standoff board has an LED package disposed thereon and conductors to provide an electrical connection between the LED package disposed on the standoff board and the main printed wiring board.

US Patent:

52079570, May 4, 1993

Filed:

Aug 8, 1991

Appl. No.:

7/742113

Inventors:

Gerald A. Heath - Canton MI
Richard L. Hamilton - Novi MI
Steven D. McCarthy - Farmington Hills MI

Assignee:

Ford Motor Company - Dearborn MI

International Classification:

B29C 4514
B29C 6722

US Classification:

264 405

Abstract:

A method of manufacturing an article having a substructure with a wall having first and second wall surfaces and a molded layer along the first wall surface. The substructure is supported in a tool having first and second die surfaces on either side of the wall. The first die surface is spaced apart from the first wall surface and the second die surface is spaced apart from the second wall surface. A moldable material is injected between the first die surface and the first wall surface under conditions causing said material to exert a force on the wall. The second wall surface is contacted with a fluid under sufficient pressure to create a force on the wall that offsets the force exerted by the material whereby the wall is supported against deformation.