Steven A Scheer

US Patent:

7444196, Oct 28, 2008

Filed:

Apr 21, 2006

Appl. No.:

11/408744

Inventors:

Steven Scheer - Austin TX, US
Alan Nolet - San Jose CA, US
Manuel Madriaga - San Jose CA, US

Assignee:

Timbre Technologies, Inc. - Santa Clara CA

International Classification:

G06F 19/00
G01B 11/14
G01R 31/26
H01L 21/66

US Classification:

700109, 700108, 700121, 430311, 430312, 430313, 430315, 430321, 356305, 356326, 356328

Abstract:

A patterned structure in a wafer is created using one or more fabrication treatment processes. The patterned structure has a treated and an untreated portion. One or more diffraction sensitivity enhancement techniques are applied to the structure, the one or more diffraction sensitivity enhancement techniques adjusting one or more properties of the patterned structure to enhance diffraction contrast between the treated portion and untreated portions. A first diffraction signal is measured off an unpatterned structure on the wafer using an optical metrology device. A second diffraction signal is measured off the patterned structure on the wafer using the optical metrology device. One or more diffraction sensitivity enhancement techniques are selected based on comparisons of the first and second diffraction signals.

US Patent:

7473461, Jan 6, 2009

Filed:

Jul 10, 2007

Appl. No.:

11/827014

Inventors:

Colin J. Brodsky - Salt Point NY, US
Wai-Kin Li - Poughkeepsie NY, US
Steven A. Scheer - Poughkeepsie NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B32B 9/00
B32B 33/00

US Classification:

428212, 428336, 4284111

Abstract:

A film stack is provided in which a first film including a first polymer directly contacts a surface of a substrate at which a given material is exposed. A second film, which can include a second polymer other than the first polymer, is formed to have an inner surface contacting the first film. The second film can have a thickness at which a free energy of the second film would be negative if the second film were disposed directly on the substrate. Desirably, the resulting second film is substantially free of dewetting defects.

US Patent:

7483804, Jan 27, 2009

Filed:

Sep 29, 2006

Appl. No.:

11/537085

Inventors:

Steven Scheer - Austin TX, US

Assignee:

Tokyo Electron Limited - Tokyo

International Classification:

G01N 21/00
G03B 27/72
G03C 5/00
G06F 15/00

US Classification:

702127, 355 69, 430 30, 3562374

Abstract:

A method of real time dynamic CD control in a system for patterning resist coated wafers. The method includes lithographically patterning the resist coated wafers using predetermined exposure dose and focus settings. The method further includes obtaining CD metrology data from test areas on the patterned wafers, where different groups of test areas are selected for two or more of the patterned wafers. A CD metrology data map is constructed using the CD metrology data, adjusted exposure dose and/or focus settings are established using the CD metrology data, and additional wafers are then patterned.

US Patent:

7541065, Jun 2, 2009

Filed:

Jun 18, 2007

Appl. No.:

11/820302

Inventors:

Colin J. Brodsky - Salt Point NY, US
Wai-Kin Li - Poughkeepsie NY, US
Steven A. Scheer - Poughkeepsie NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B05D 7/00

US Classification:

427402, 42725515

Abstract:

A method is provided for forming a film stack in which a first film including a first polymer is formed on a substrate. A second film, which can include a second polymer other than the first polymer, is formed to have an inner surface disposed on the first film. The second film can have a thickness at which a free energy of the second film would be negative if the second film were disposed directly on the substrate. Desirably, the resulting second film is substantially free of dewetting defects.

US Patent:

7588879, Sep 15, 2009

Filed:

Mar 5, 2008

Appl. No.:

12/042709

Inventors:

Colin J. Brodsky - Salt Point NY, US
Sean D. Burns - Hopewell Junction NY, US
Dario L. Goldfarb - Mohegan Lake NY, US
Michael Lercel - Austin TX, US
David R. Medeiros - Ossining NY, US
Dirk Pfeiffer - Dobbs Ferry NY, US
Daniel P. Sanders - San Jose CA, US
Steven A. Scheer - Austin TX, US
Libor Vyklicky - Yorktown Heights NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G03F 7/11

US Classification:

4302711, 438952, 430510, 430311

Abstract:

An antireflective coating that contains at least two polymer components and comprises chromophore moieties and transparent moieties is provided. The antireflective coating is useful for providing a single-layer composite graded antireflective coating formed beneath a photoresist layer.

US Patent:

7632631, Dec 15, 2009

Filed:

Jan 5, 2005

Appl. No.:

11/029813

Inventors:

Steven A. Scheer - Poughkeepsie NY, US
Colin J. Brodsky - Salt Point NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G03F 7/00

US Classification:

430330, 4302701, 4302711, 4302731, 4302761, 430935

Abstract:

A method is provided for forming a stable thin film on a substrate. The method includes depositing a co-polymer composition having a first component and a second component onto a substrate to form a stable film having a first thickness. The first component has first dielectric properties not enabling the first component by itself to produce the stable film having the first thickness. However, the second component has second dielectric properties which impart stability to the film at the first thickness. In a preferred embodiment, the second component includes a leaving group, and the method further includes first thermal processing the film to cause a solvent but not the leaving group to be removed from the film, after which second thermal processing is performed to at least substantially remove the leaving group from the film. As a result, the film is reduced to a second thickness smaller than the first thickness, and the film remains stable during both the first and the second thermal processing.

US Patent:

7673278, Mar 2, 2010

Filed:

Nov 29, 2007

Appl. No.:

11/947234

Inventors:

Benjamen M. Rathsack - Austin TX, US
Kathleen Nafus - Leuven, BE
Steven Scheer - Austin TX, US

Assignee:

Tokyo Electron Limited - Tokyo

International Classification:

G06F 17/50

US Classification:

716 19, 716 1, 716 4

Abstract:

The invention provides apparatus and methods for processing substrates using a hot-spot library.

US Patent:

7816069, Oct 19, 2010

Filed:

Jun 23, 2006

Appl. No.:

11/473338

Inventors:

Colin J. Brodsky - Salt Point NY, US
Sean D. Burns - Hopewell Junction NY, US
Dario L. Goldfarb - Mohegan Lake NY, US
Michael Lercel - Austin TX, US
David R. Medeiros - Ossining NY, US
Dirk Pfeiffer - Dobbs Ferry NY, US
Daniel P. Sanders - San Jose CA, US
Steven A. Scheer - Austin TX, US
Libor Vyklicky - Yorktown Heights NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G03F 7/11
G03C 1/00
C08L 29/04
C08L 27/12

US Classification:

4302711, 438952, 438636, 430311, 430511, 430522, 525 57, 525199, 525107, 525108, 525109

Abstract:

An antireflective coating that contains at least two polymer components and comprises chromophore moieties and transparent moieties is provided. The antireflective coating is useful for providing a single-layer composite graded antireflective coating formed beneath a photoresist layer.