Steven D Snyder

Address:

1371 Cathedral Oak Dr NE, Palm Bay, FL 32907

VIN:

3FADP0L34AR121351

Make:

FORD

Model:

FUSION HYBRID

Year:

2010

US Patent:

6418019, Jul 9, 2002

Filed:

Mar 19, 2001

Appl. No.:

09/811815

Inventors:

Steven Robert Snyder - Indian Harbour Beach FL
Charles Michael Newton - Palm Bay FL
Michael Ray Lange - Palm Bay FL

Assignee:

Harris Corporation - Melbourne FL

International Classification:

H05H 720

US Classification:

361700, 16510433, 16510423, 174 151

Abstract:

An electronic module includes a cooling substrate, an electronic device mounted thereon, and a plurality of cooling fluid dissociation electrodes carried by the cooling substrate for dissociating cooling fluid to control a pressure thereof. More particularly, the cooling substrate may have an evaporator chamber adjacent the electronic device, at least one condenser chamber adjacent the heat sink, and at least one cooling fluid passageway connecting the evaporator chamber in fluid communication with the at least one condenser chamber.

US Patent:

6483705, Nov 19, 2002

Filed:

Mar 19, 2001

Appl. No.:

09/811827

Inventors:

Steven Robert Snyder - Indian Harbour Beach FL
Charles Michael Newton - Palm Bay FL
Michael Ray Lange - Palm Bay FL

Assignee:

Harris Corporation - Melbourne FL

International Classification:

H05K 720

US Classification:

361709, 361700, 174 151, 16510433

Abstract:

An electronic module includes a cooling substrate, an electronic device mounted thereon, and a heat sink adjacent the cooling substrate. More particularly, the cooling substrate may have an evaporator chamber adjacent the electronic device, at least one condenser chamber adjacent the heat sink, and at least one cooling fluid passageway connecting the evaporator chamber in fluid communication with the at least one condenser chamber. Furthermore, an evaporator thermal transfer body may be connected in thermal communication between the evaporator chamber and the electronic device. Additionally, at least one condenser thermal transfer body may be connected in thermal communication between the at least one condenser chamber and the heat sink. The evaporator thermal transfer body and the at least one condenser thermal transfer body preferably each have a higher thermal conductivity than adjacent cooling substrate portions.

US Patent:

6930568, Aug 16, 2005

Filed:

Nov 19, 2002

Appl. No.:

10/300456

Inventors:

Steven Robert Snyder - Palm Bay FL, US
Stephen B. Brown - Palm Bay FL, US
Raymond C. Rumpf - Melbourne FL, US
Brett Pigon - Palm Bay FL, US
James J. Rawnick - Palm Bay FL, US

Assignee:

Harris Corporation - Melbourne FL

International Classification:

H03H007/30

US Classification:

333156, 333161, 333 32

Abstract:

Method and apparatus for producing a variable delay for an RF signal. The method can include the step of propagating the RF signal along an RF transmission line, coupling a fluidic dielectric to the RF transmission line, and dynamically changing a composition of the fluidic dielectric to selectively vary its permittivity in response to a time delay control signal. The method can also include the step of dynamically changing a composition of the fluidic dielectric to vary its permeability. The permittivity and the permeability can be varied concurrently in response to the time delay control signal. In a preferred embodiment the method can include selectively varying the permeability concurrently with the permittivity to maintain a characteristic impedance of the transmission line approximately constant.

US Patent:

6952148, Oct 4, 2005

Filed:

Mar 11, 2003

Appl. No.:

10/387209

Inventors:

Steven Robert Snyder - Palm Bay FL, US
Stephen B. Brown - Palm Bay FL, US
James J. Rawnick - Palm Bay FL, US

Assignee:

Harris Corporation - Melbourne FL

International Classification:

H01P001/18

US Classification:

333156, 333161

Abstract:

A continuously variable true time delay line () and method for producing a time delay. The true delay line () includes an RF transmission line () and at least a first fluidic dielectric () contained in a cavity () coupled to the RF transmission line along at least a first length thereof. One or more variable displacement fluid processors () are provided for changing a distribution of the fluid dielectric () in the cavity () in response to a time delay control signal (). The propagation delay of the line is selectively varied by changing the distribution of the fluid dielectric in the cavity.

US Patent:

7046104, May 16, 2006

Filed:

Feb 10, 2003

Appl. No.:

10/361548

Inventors:

Steven Robert Snyder - Palm Bay FL, US
Stephen B. Brown - Palm Bay FL, US
James J. Rawnick - Palm Bay FL, US

Assignee:

Harris Corporation - Melbourne FL

International Classification:

H03K 1/09

US Classification:

333205, 333156

Abstract:

A variable true time delay line () includes an RF transmission line () and at least one fluidic delay unit (). The fluidic delay unit includes a fluidic dielectric contained in a cavity () and coupled to the RF transmission line () along at least a portion of a length thereof. At least one pump is provided for adding and removing the fluid dielectric to the cavity () in response to a time delay control signal. A propagation delay of the RF transmission line is selectively varied by adding and removing the fluid dielectric from the cavity.

US Patent:

7285000, Oct 23, 2007

Filed:

Aug 12, 2005

Appl. No.:

11/202530

Inventors:

Michael Pleskach - Orlando FL, US
Paul Koeneman - Palm Bay FL, US
Carol Gamlen - Melbourne FL, US
Steven R. Snyder - Palm Bay FL, US

Assignee:

Harris Corporation - Melbourne FL

International Classification:

H01R 4/60

US Classification:

439190

Abstract:

An electro-fluidic interconnection. The interconnection includes a body () formed of a ceramic material. The body () is provided with an aperture () having a profile suitable for receiving an interconnecting conduit (). The interconnecting conduit () can be formed of the same type of ceramic material as the body (). The conduit () is defined by an outer shell () with a hollow bore () for transporting a fluid. A mating portion () of the conduit has an exterior profile that matches the profile of the aperture. Moreover, the mating portion () of the conduit () can be compression fitted within the aperture (). Conductive traces () on the conduit and the body can be electrically connected to complete the electro-fluidic interconnection.

US Patent:

7340825, Mar 11, 2008

Filed:

Jul 6, 2006

Appl. No.:

11/428963

Inventors:

Steven R. Snyder - Palm Bay FL, US

Assignee:

Harris Corporation - Melbourne FL

International Classification:

H01F 7/06

US Classification:

29605, 296021, 29882, 72142, 72144, 72225, 72242, 242443, 2424472, 2424373, 2424374, 2424781

Abstract:

A transformer and method of making includes first half primary and secondary windings as metallic circuits that are etched on a metallic cladding of a first liquid crystal polymer (LCP) sheet. Secondary windings are positioned in spaced relation to the primary windings. A second LCP sheet is applied over the first LCP sheet. Second half primary and secondary windings are etched as metallic circuits on a metallic cladding of a second LCP sheet. Respective first and second half primary windings are interconnected to each other and the first and second half secondary windings are connected to each other by conductive vias.

US Patent:

7391293, Jun 24, 2008

Filed:

Aug 15, 2007

Appl. No.:

11/838921

Inventors:

Steven R. Snyder - Palm Bay FL, US

Assignee:

Harris Corporation - Melbourne FL

International Classification:

H01F 5/00

US Classification:

336200, 336223, 336232

Abstract:

A transformer and method of making includes first half primary and secondary windings as metallic circuits that are etched on a metallic cladding of a first liquid crystal polymer (LCP) sheet. Secondary windings are positioned in spaced relation to the primary windings. A second LCP sheet is applied over the first LCP sheet. Second half primary and secondary windings are etched as metallic circuits on a metallic cladding of a second LCP sheet. Respective first and second half primary windings are interconnected to each other and the first and second half secondary windings are connected to each other by conductive vias.