Ying-Ming Lee - Melbourne FL, US Brinnan C. Riley - West Melbourne FL, US Brett Pigon - Grant-Valkaria FL, US William E. Clark - Palm Bay FL, US Steven R. Sprinkle - West Melbourne FL, US
Assignee:
HARRIS CORPORATION - Melbourne FL
International Classification:
H01Q 1/00 H01R 43/00 H02G 3/04
US Classification:
343905, 174 683, 29825
Abstract:
Interconnect feed devices () are provided for electrically connecting first and second electrical components (). The interconnect feed devices () can include a dielectric shell () with an electrically-conductive coating (), and leads () positioned within individual conduits () of the shell. Each lead () and its associated conduit () can act as a coaxial cable for transmitting radio frequency (RF) energy between the first and second electrical components (). The shell () can be manufactured using a process, such as stereolithography, that allows the shell to be formed with relatively complicated geometries, which in turn can facilitate relatively complicated cable routing.
Radio Frequency Circuit Board Interconnect Assembly
- Waltham MA, US David M. Dyer - Prosper TX, US Steven Sprinkle - Van Alstyne TX, US Paul E. Schlittler - Mc Kinney TX, US
International Classification:
H01Q 23/00 H01Q 9/16 H01Q 21/28
Abstract:
A radio frequency (RF) circuit connection assembly comprises a RF circuit board and a RF connector. The RF circuit board has a first side and a second side opposite the first side. A RF circuit is located on the first side and an aperture extends through the RF circuit board from the first side to the second side. The RF connector comprises a barrel having a socket configured to receive a RF bullet, a flange having a mounting surface, and a RF connector pin extending laterally from the barrel. The barrel of the RF connector extends through the aperture of the RF circuit board such that the mounting surface of the flange is seated against the first side of the RF circuit board, and the RF connector pin is electrically coupled to the RF circuit on the first side of the RF circuit board.
Radio Frequency Circuit Board Interconnect Assembly
- Waltham MA, US David M. Dyer - Prosper TX, US Steven Sprinkle - Van Alstyne TX, US Paul E. Schlittler - Mc Kinney TX, US
International Classification:
H01Q 23/00 H01Q 9/16 H01Q 21/28
Abstract:
A radio frequency (RF) circuit connection assembly comprises a RF circuit board and a RF connector. The RF circuit board has a first side and a second side opposite the first side. A RF circuit is located on the first side and an aperture extends through the RF circuit board from the first side to the second side. The RF connector comprises a barrel having a socket configured to receive a RF bullet, a flange having a mounting surface, and a RF connector pin extending laterally from the barrel. The barrel of the RF connector extends through the aperture of the RF circuit board such that the mounting surface of the flange is seated against the first side of the RF circuit board, and the RF connector pin is electrically coupled to the RF circuit on the first side of the RF circuit board.
- Waltham MA, US Steven Sprinkle - McKinney TX, US
Assignee:
Raytheon Company - Waltham MA
International Classification:
H01R 13/502 H01R 13/52 H01R 13/6581
Abstract:
A backshell includes a substrate having a lower surface and an upper surface and a lower connector having a first groove defined therein. A first gasket is disposed in the first groove and the lower connector is positioned on the lower surface to capture the first gasket in the first groove. The backshell assembly includes a second groove defined in a first connector and a second gasket is disposed in the second groove. The first connector is positioned to capture the second gasket in the second groove. The backshell assembly includes a third groove and a third gasket disposed in the third groove. A second connector is disposed about the first connector to enclose the third gasket in the third groove such that the second connector is capable of moving along the Z-axis while maintaining the third gasket in the third.
Raytheon
Principal Technical Support Engineer
Harris Corporation Apr 2003 - Dec 2014
Mechanical Designer
Corning Optical Communications Jun 1998 - Sep 2001
Designer
Texas Sampling May 1996 - Aug 1997
Draftsman
Education:
The University of Texas at San Antonio 1997 - 1998
Texas State Technical College 1994 - 1996
Texas State Technical College Waco 1994 - 1996
Associates, Associate of Arts, Design
Skills:
Pro Engineer Cad Manufacturing Design For Manufacturing Sheet Metal Engineering Management Autocad Inventor Solid Modeling Product Design Mechanical Engineering Microsoft Office Electronics Packaging Gd&T Machining Product Development Pdm Modeling Electronics Manufacturing Solidworks Mechanical Design Creo Design Electronics Assembly Pro/Engineer Product Data Management Ms Office Suite Mil Spec Electronics Space Structures
Steven Sprinkle (1990-1994), Jerome Perry (1989-1993), Kristen Fraser (1999-2002), Richard Solis (1979-1983), Joseph Smith (1994-1998), Darlene Durden (1983-1986)
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