Steven R Webster

US Patent:

6342406, Jan 29, 2002

Filed:

Nov 15, 2000

Appl. No.:

09/714682

Inventors:

Thomas P. Glenn - Gilbert AZ
Steven Webster - Chandler AZ
Roy Dale Hollaway - Chandler AZ

Assignee:

Amkor Technology, Inc. - Chandler AZ

International Classification:

H01L 2100

US Classification:

438 57, 438 60, 438 64, 438116

Abstract:

Electrically conductive interior traces and exterior traces are formed on interior and exterior surfaces, respectively, of a window. The interior traces are electrically connected to the exterior traces by electrically conductive vias extending through the window. To mount the window to an image sensor, the interior traces are aligned with bond pads on a front surface of the image sensor. Flip chip bumps are formed between the interior traces and the bond pads thus mounting the window to the image sensor. A sealer is applied to form a seal between the window and the image sensor and to protect an active area of the image sensor.

US Patent:

6389687, May 21, 2002

Filed:

Dec 8, 1999

Appl. No.:

09/457517

Inventors:

Thomas P. Glenn - Gilbert AZ
Steven Webster - Chandler AZ

Assignee:

Amkor Technology, Inc. - Chandler AZ

International Classification:

H05K 330

US Classification:

29832, 29825, 29840, 29841, 29740

Abstract:

Image sensor packages are fabricated simultaneously to minimize the cost associated with each individual image sensor package. To fabricate the image sensor packages, windows are molded in molding compound to form a molded window array. A substrate includes a plurality of individual substrates integrally connected together in an array format. Image sensors are attached and electrically connected to corresponding individual substrates. An adhesive layer attaches the molded window array to the substrate. The substrate and attached molded window array are singulated into a plurality of individual image sensor packages.

US Patent:

6396043, May 28, 2002

Filed:

Nov 22, 1999

Appl. No.:

09/448538

Inventors:

Thomas P. Glenn - Gilbert AZ
Steven Webster - Chandler AZ
Roy Dale Hollaway - Paranaque Metro Manila, PH

Assignee:

Amkor Technology, Inc. - Chandler AZ

International Classification:

H01L 2700

US Classification:

2502081, 250239, 2502141

Abstract:

A thin image sensor package includes an image sensor having an active area which is responsive to radiation. The image sensor is mounted to a substrate which is transparent to the radiation. The image sensor is mounted such that the active area of the image sensor faces the substrate. Of importance, the substrate serves a dual function. In particular, the substrate is the window which covers the active area of the image sensor. Further, the substrate is the platform upon which the image sensor package is fabricated. As a result, the image sensor package is thin, lightweight and inexpensive to manufacture.

US Patent:

6399463, Jun 4, 2002

Filed:

Mar 1, 2001

Appl. No.:

09/797756

Inventors:

Thomas P. Glenn - Gilbert AZ
Steven Webster - Chandler AZ
Roy Dale Hollaway - Chandler AZ

Assignee:

Amkor Technology, Inc. - Chandler AZ

International Classification:

H01L 2146

US Classification:

438463, 438113, 438114, 438460, 438462, 438465

Abstract:

A wafer is singulated from the back-side surface of the wafer using laser ablation, thus protecting the front-side surface of the wafer and, more particularly, the integrated circuits and/or functional units on the front-side surface. Since, according to the invention, no saw blade is used, the width of the scribe lines does not need to be any larger than the width of the beam from the laser plus some minimal tolerance for alignment. As a result, using the invention, the width of scribe lines is on the order of twenty-four times smaller than the width of scribe lines required by the prior art methods.

US Patent:

6406934, Jun 18, 2002

Filed:

Sep 5, 2000

Appl. No.:

09/654978

Inventors:

Thomas P. Glenn - Gilbert AZ
Steven Webster - Chandler AZ
Vincent DiCaprio - Mesa AZ

Assignee:

Amkor Technology, Inc. - Chandler AZ

International Classification:

H01L 2148

US Classification:

438106, 438118, 438122, 438123, 438124, 438192, 438460

Abstract:

The invention provides a manufacturing process for making chip-size semi-conductor packages (âCSPsâ) at the wafer-level without the added size, cost, and complexity of substrates in the packages or the need to overmold them with plastic. One embodiment of the method includes the provision of a semiconductor wafer with opposite top and bottom surfaces and a plurality of dies integrally defined therein. Each die has an electronic device formed in a top surface thereof, and one or more electrically conductive vias extending therethrough that electrically connect the electronic device to the bottom surface of the die. The openings for the vias are formed ablatively with a laser and plated through with a conductive material. In a BGA form of the CSP, the vias connects the electronic device to lands on the bottom surface of the die. The lands may each have a bump of a conductive metal, e. g.

US Patent:

6407381, Jun 18, 2002

Filed:

Jul 5, 2000

Appl. No.:

09/610314

Inventors:

Thomas P. Glenn - Gilbert AZ
Steven Webster - Chandler AZ
Tony Arellano - Metro Manila, PH

Assignee:

Amkor Technology, Inc. - Chandler AZ

International Classification:

H01L 310203

US Classification:

250239, 2502081, 257433, 257434

Abstract:

An image sensor package includes an image sensor having bond pads and an active area on an upper surface of the image sensor. The image sensor package further includes a window support on the upper surface of the image sensor. The window support entirely encloses the upper surface including the active area and the bond pads. A window is in contact with the window support, the window overlying the active area. Generally, the window support and the window entirely enclose, and thus protect, the active area of the image sensor.

US Patent:

6420201, Jul 16, 2002

Filed:

Jan 3, 2001

Appl. No.:

09/754229

Inventors:

Steven Webster - Chandler AZ

Assignee:

Amkor Technology, Inc. - Chandler AZ

International Classification:

H01L 2100

US Classification:

438 51, 438 53, 438127, 438126

Abstract:

A plurality of pressure sensor dice are attached to an array of pressure sensor die attach sites located on a substrate. The pressure sensor dice are then electrically connected to the pressure sensor die attach sites using standard wire bond techniques. The resulting array of pressure sensor sub-assemblies is then molded, using a mold tool which closes on three sides of the substrate so that a cavity is formed that is open on the fourth side. A portion of the outer surface of the micro-machine element of each pressure sensor die is left exposed at the bottom of a cavity or hole in the encapsulant. After molding, the exposed outer surface of the micro-machine element is covered with a pressure coupling gel applied in the cavity. The resulting array of packaged pressure sensors are then sigulated using well know sawing or laser techniques or by snapping a specially formed snap array.

US Patent:

6420776, Jul 16, 2002

Filed:

Mar 1, 2001

Appl. No.:

09/797759

Inventors:

Thomas P. Glenn - Gilbert AZ
Steven Webster - Chandler AZ
Roy Dale Hollaway - Chandler AZ

Assignee:

Amkor Technology, Inc. - Chandler AZ

International Classification:

H01L 21304

US Classification:

257620, 438462, 438463

Abstract:

A structure comprises a substrate with electronic components formed on a first surface of the substrate. The structure includes a scribe line on a first surface of the substrate. The structure includes a trench formed by a laser on the second or back-side surface of the substrate, thus protecting the front-side surface of the substrate and, more particularly, the electronic component such as an integrated circuit and/or functional unit on the front-side surface of the substrate during singulation. Since, according to the invention, no saw blade is used, the width of the scribe line does not need to be any larger than the width of the beam from the laser plus some minimal tolerance for alignment. As a result, using the invention, the width of scribe line is on the order of twenty-four times smaller than the width of scribe lines required by the prior art methods.