Sun H Lehmann

US Patent:

20040169162, Sep 2, 2004

Filed:

Feb 28, 2003

Appl. No.:

10/377988

Inventors:

Yue Xiao - Belle Mead NJ, US
Sun Lehmann - Hillsborough NJ, US
Chih-Min Cheng - Westford MA, US
Gunther Dreezen - Olmen, BE

International Classification:

H01B001/00

US Classification:

252/500000

Abstract:

A composition that comprises a) an admixing of at least one epoxy resin and aliphatic amine wherein the ratio of epoxy function group/amine is greater than 1; b) a conductive filler; c) one or more corrosion inhibitors, oxygen scavengers or both; d) imidazole as a curing agent/catalyst; and e) optionally other additives such as organic solvents, flow additives, adhesion promoters and rheology modifiers. The reaction of epoxy and aliphatic amine with excess epoxy functionality results in a flexible resin with remaining active epoxy groups. The compositions exhibit improved electrical stability and impact resistance over other conductive adhesive compositions that do not comprise the admixture.