Sundaram N Kumar

US Patent:

7540081, Jun 2, 2009

Filed:

Nov 7, 2006

Appl. No.:

11/557186

Inventors:

Sundaram Nand Kumar - Schaumburg IL, US
Gary Garvin Sites - Rancho Cucamonga CA, US
Bhavik Patel - Bloomingdale IL, US

Assignee:

American Standard Circuits - Franklin Park IL

International Classification:

H05K 3/30

US Classification:

29832, 29825, 29830, 165185

Abstract:

A thermally conductive material is provided as a mixture of a silicone, a ceramic powder, and a curing catalyst. The material may be pre-formed into a pad and each side of the film protected with removable release layers. Each side of the film may also include a coating of an adhesive material that aids in coupling the interface film with a surface. The material may alternatively be produced in a screen-printable paste. As such, a layer of the paste may be screen-printed on a surface as complete sheet form or as a patterned film by using a stencil patterned screen mesh. The interface material is sandwiched between a printed circuit board and a heat sink to form the circuit board assembly. In a multi-step press process, the assembly is cured and a laminate formed. The assembly process may also include a priming function that prepares metal surfaces of the circuit board and heat sink for receiving the interface material.

US Patent:

7867353, Jan 11, 2011

Filed:

Jun 18, 2008

Appl. No.:

12/141257

Inventors:

Sundaram Nand Kumar - Schaumburg IL, US
Gary Sites - Rancho Cucamonga CA, US
Bhavik Patel - Bloomingdale IL, US

Assignee:

American Standard Circuits - Franklin Park IL

International Classification:

B29C 65/00
B32B 37/00
B32B 9/04
B32B 9/06
B32B 11/06
B32B 15/04
C09J 5/00
B05D 3/02

US Classification:

156289, 156311, 427387, 428447, 428448, 428449, 428450

Abstract:

A thermally and electrically conductive material is provided as a mixture of a dimethylpolysiloxane, metal (or one metal coated with another metal) flakes and/or granules, a peroxide-based and/or a dimethyl hexane based catalyst, PTFE powder and a platinum based fire retardant. The thermally and electrically conductive material may be pre-formed into a film or pad and each side of the film protected with removable release layers. The thermally and electrically conductive material may alternatively be produced in a screen-printable paste. As such, a layer of the thermally and electrically conductive paste may be screen-printed on the metal surface in a complete sheet form or as a patterned film by using a stencil patterned screen mesh. Processes for manufacturing high- and low-frequency circuits that include the interface material are also provided.

US Patent:

20060266475, Nov 30, 2006

Filed:

May 24, 2005

Appl. No.:

11/136125

Inventors:

Sundaram Kumar - Schaumburg IL, US
Gary Sites - Rancho Cucamonga CA, US

Assignee:

American Standard Circuits, Inc. - Franklin IL

International Classification:

B32B 27/00

US Classification:

156312000, 428447000, 428040100, 264161000, 264316000, 264320000, 264259000, 264265000

Abstract:

A thermally conductive material is provided as a mixture of a silicone, a ceramic powder, and a curing catalyst. The material may be pre-formed into a pad and each side of the film protected with removable release layers. Each side of the film may also include a coating of an adhesive material that aids in coupling the interface film with a surface. The material may alternatively be produced in a screen-printable paste. As such, a layer of the paste may be screen-printed on a surface as complete sheet form or as a patterned film by using a stencil patterned screen mesh. The interface material is sandwiched between a printed circuit board and a heat sink to form the circuit board assembly. In a multi-step press process, the assembly is cured and a laminate formed. The assembly process may also include a priming function that prepares metal surfaces of the circuit board and heat sink for receiving the interface material.

US Patent:

7527873, May 5, 2009

Filed:

Feb 8, 2006

Appl. No.:

11/349842

Inventors:

Sundaram Nand Kumar - Schaumburg IL, US
Gary Sites - Rancho Cucamonga CA, US
Bhavik Patel - Bloomingdale IL, US

Assignee:

American Standard Circuits - Franklin Park IL

International Classification:

B32B 9/04
C08G 77/06

US Classification:

428447, 528 24

Abstract:

A thermally and electrically conductive material is provided as a mixture of a dimethylpolysiloxane, metal (or one metal coated with another metal) flakes and/or granules, a peroxide-based and/or a dimethyl hexane based catalyst, PTFE powder and a platinum based fire retardant. The thermally and electrically conductive material may be pre-formed into a film or pad and each side of the film protected with removable release layers. The thermally and electrically conductive material may alternatively be produced in a screen-printable paste. As such, a layer of the thermally and electrically conductive paste may be screen-printed on the metal surface in a complete sheet form or as a patterned film by using a stencil patterned screen mesh. Processes for manufacturing high- and low-frequency circuits that include the interface material are also provided.