Sung Ae Lee

Address:

3814 78 Ave Ct W APT F304, University Place, WA 98466

VIN:

JTEES41A082029041

Make:

TOYOTA

Model:

HIGHLANDER

Year:

2008

US Patent:

6987859, Jan 17, 2006

Filed:

Jul 20, 2001

Appl. No.:

09/910110

Inventors:

Peter V. Loeppert - Hoffman Estates IL, US
Sung Bok Lee - Chicago IL, US

Assignee:

Knowles Electronics, LLC. - Itasca IL

International Classification:

H04R 25/00

US Classification:

381174, 381191

Abstract:

A raised microstructure for use in a silicon based device, such as a microphone, is disclosed. The raised microstructure comprises a generally planar film having a ribbed sidewall supporting the film.

US Patent:

D690183, Sep 24, 2013

Filed:

Jun 19, 2012

Appl. No.:

29/424992

Inventors:

Sung K. Lee - Glenview IL, US

International Classification:

0806

US Classification:

D 8107

US Patent:

20120144964, Jun 14, 2012

Filed:

Dec 14, 2011

Appl. No.:

13/326224

Inventors:

Sung K. Lee - Glenview IL, US

International Classification:

B25G 1/10

US Classification:

81489

Abstract:

A tool handle including: a body configured to receive a handle of a tool; a hand grip extending approximately perpendicular from the body; and an arm ring rotatably disposed on the body, wherein the arm ring is adapted to be placed in at least two positions, a first position in which the arm ring is generally perpendicular to the hand grip such that a user may place the user's forearm through the arm ring to grasp the hand grip and a second position in which the arm ring is generally parallel to the hand grip so as to minimize the width of the tool handle.

US Patent:

20130075836, Mar 28, 2013

Filed:

Sep 20, 2012

Appl. No.:

13/623598

Inventors:

KNOWLES ELECTRONICS, LLC - Itasca IL, US
Sung Bok Lee - Chicago IL, US

Assignee:

KNOWLES ELECTRONICS, LLC - Itasca IL

International Classification:

H01L 29/84

US Classification:

257416, 257E29324

Abstract:

A micro-electromechanical system (MEMS) device includes a housing and a base. The base includes a port opening extending therethrough and the port opening communicates with the external environment. The MEMS die is disposed on the base and over the opening. The MEMS die includes a diaphragm and a back plate and the MEMS die, the base, and the housing form a back volume. At least one vent extends through the MEMS die and not through the diaphragm. The at least one vent communicates with the back volume and the port opening and is configured to allow venting between the back volume and the external environment.

US Patent:

20130184609, Jul 18, 2013

Filed:

Jul 20, 2012

Appl. No.:

13/554781

Inventors:

Sung K. Lee - Euless TX, US
Charles L. Thomas - Salt Lake City UT, US

Assignee:

University of Utah Research Foundation - Salt Lake City UT

International Classification:

B29C 33/42

US Classification:

600573, 604272, 606167, 604173, 264219, 249127

Abstract:

The present invention provides a method for creating a beveled needle or a blade. The method employs a side wall surface of an angled post as a base to control beveled tip geometry. The invention provides needles, microneedle arrays, blades and microblade arrays with sufficient sharpness and toughness.

US Patent:

54923190, Feb 20, 1996

Filed:

Oct 11, 1994

Appl. No.:

8/327003

Inventors:

Sung C. Lee - Wheeling IL

International Classification:

A63B 6936

US Classification:

273181F

Abstract:

An indoor golf chip shot practice apparatus which is to be used for practicing chip shots in the game of golf. The apparatus comprises a rectangular prism shape safety net with only one opening to the side of the user, therefore, the golf ball stays inside of the safety net even in case of bad shots. The apparatus also comprises a frame to support and encompass the safety net and is designed in such a way that the golf ball rolls back on the floor of the safety net to the user after each shot.

US Patent:

20220256292, Aug 11, 2022

Filed:

Feb 11, 2021

Appl. No.:

17/173661

Inventors:

- Itasca IL, US
Sung LEE - Itasca IL, US
Ankur SHARMA - Itasca IL, US
Nick WAKEFIELD - Itasca IL, US

International Classification:

H04R 19/04
H04R 7/06
H04R 7/18

Abstract:

A MEMS die includes a substrate having an opening formed therein, a diaphragm having a first surface attached around a periphery thereof to the substrate and over the opening, and a backplate separated from a second surface of the diaphragm. The diaphragm includes at least one passage disposed between the first and second surfaces, and the at least one passage has a smaller cross-sectional area at the first surface than at the second surface.

US Patent:

20210136475, May 6, 2021

Filed:

Oct 27, 2020

Appl. No.:

17/081628

Inventors:

- Itasca IL, US
Sung B. Lee - Itasca IL, US
Yunfei Ma - Itasca IL, US
Bing Yu - Itasca IL, US

International Classification:

H04R 1/08

Abstract:

An acoustic transducer comprises a transducer substrate having an aperture defined therethrough. At least one diaphragm is disposed on the transducer substrate over the aperture. A back plate is disposed on the transducer substrate and axially spaced apart from the at least one diaphragm. A perimetral support structure is disposed circumferentially between the at least one diaphragm and the back plate at a radially outer perimeter of the back plate. A plurality of perimetral release holes are defined circumferentially through at least one of the at least one diaphragm or the back plate proximate to and radially inwards of the perimetral support structure, at least a portion of the plurality of perimetral release holes defining a non-circular shape.