Sung Joo Yoo

US Patent:

6438150, Aug 20, 2002

Filed:

Mar 9, 1999

Appl. No.:

09/264997

Inventors:

Sung Joo Yoo - Davis CA

Assignee:

Telecordia Technologies, Inc. - Morristown NJ

International Classification:

H01S 500

US Classification:

372 49, 372 45, 372 92, 372 99

Abstract:

An edge-emitting laser formed in an opto-electronic chip and having an emission wavelength determined by dielectric interference filter formed on opposing facets between which said laser extends. The two interference filter are each respective Fabry-Perot etalon filters having two interference mirrors sandwiching a resonant dielectric cavity layer so that the filter manifests a flat reflectance spectrum with a deep reflectance notch in its center. The two filters are fabricated with wavelengths of their notches differing by about 2%. The sum of the two filter transmittances represents round-trip cavity loss and has a double-peaked shape with a sharp minimum between the two notch wavelengths. The wavelength of the sum minimum determines the lasing wavelength without the need for a Bragg grating being incorporated within the chip. The invention can be applied to multi-wavelength edge-emitting lasers including multiple laser stripes by applying filters of different wavelengths to the ends of different stripes.

US Patent:

61116734, Aug 29, 2000

Filed:

Jul 17, 1998

Appl. No.:

9/118437

Inventors:

Sung Joo Yoo - Monmouth Beach NJ

Assignee:

Telcordia Technologies, Inc. - Morristown NJ

International Classification:

H04J 1400

US Classification:

359123

Abstract:

An optical signaling header technique applicable to optical networks wherein packet routing information is embedded in the same channel or wavelength as the data payload so that both the header and data payload propagate through network elements with the same path and the associated delays. The header routing information has sufficiently different characteristics from the data payload so that the signaling header can be detected without being affected by the data payload, and that the signaling header can also be removed without affecting the data payload. The signal routing technique can be overlaid onto the conventional network elements in a modular manner using two types of applique modules. The first type effects header encoding and decoding at the entry and exit points of the data payload into and out of the network; the second type effects header detection at each of the network elements.

US Patent:

57969027, Aug 18, 1998

Filed:

Jul 5, 1996

Appl. No.:

8/682863

Inventors:

Rajaram Bhat - Middletown NJ
Catherine Caneau - Red Bank NJ
Mark A. Koza - Colonia NJ
Sung Joo Yoo - Long Branch NJ

Assignee:

Bell Communications Research, Inc. - Morristown NJ

International Classification:

G02B 600

US Classification:

385122

Abstract:

A waveguide having alternating regions of different crystallographic orientations, thereby providing quasi-phase-matching for a non-linear frequency conversion, in which two wafers with or without epitaxial layers thereon are bonded together having different, preferably opposed, crystallographic orientations. One wafer is etched away, and a grating is etched such that one part of the grating has the orientation of one wafer and the other part has the orientation of the other wafer. Thereafter, a waveguide structure is epitaxially deposited upon the differentially oriented template so that the waveguide is differentially oriented in its axial direction. Thereby, quasi-phase-matching non-linear effects can be achieved. Several important devices can thereby be achieved, including a coherent optical source using frequency doubling and a frequency converter useful in wavelength division multiplexed communication, as well as others.

US Patent:

20150070236, Mar 12, 2015

Filed:

Apr 25, 2014

Appl. No.:

14/262574

Inventors:

- Cupertino CA, US
Michael Eng - San Jose CA, US
Brian S. Tryon - Los Gatos CA, US
Connor R. Duke - Sunnyvale CA, US
Kieran Poulain - San Francisco CA, US
Nicholas J. Kunst - San Francisco CA, US
Shaohai Chen - Cupertino CA, US
Shaoqing Xiang - Sunnyvale CA, US
Sung Woo Yoo - Santa Clara CA, US
Chun Cheng Teo - Mountain View CA, US
Paul Nangeroni - Mountain View CA, US
Eric Steven Jol - San Jose CA, US

Assignee:

Apple Inc. - Cupertino CA

International Classification:

H05K 9/00
H01Q 1/52

US Classification:

343841, 361816, 361748

Abstract:

A wireless electronic device may be provided with components such as electrical and structural components. During transmission of radio-frequency signals, antennas and wireless communications circuitry of the wireless electronic device may produce associated time-varying magnetic fields. One or more components may be covered with magnetic-resistant shield structures that protect the components from the time-varying magnetic fields by preventing magnetic-induced vibrations. The magnetic-resistant shield structures may include a conductive base layer such a layer of brass. A magnetic-resistant layer may be plated onto the conductive base layer. The magnetic-resistant layer may be formed from an amorphous nickel-phosphorous alloy. The amorphous nickel-phosphorous alloy may be produced by controlling the manufacturing temperature and proportion of phosphorous in the alloy while performing the plating operations within a length of time that ensures non-equilibrium conditions during the plating operations.

US Patent:

20150070864, Mar 12, 2015

Filed:

Sep 6, 2013

Appl. No.:

14/020059

Inventors:

- Cupertino CA, US
Connor R. Duke - Sunnyvale CA, US
James W. Bilanski - Palo Alto CA, US
Jeffrey M. Thoma - Mountain View CA, US
Michael Eng - San Jose CA, US
Mingzhe Li - Tianjin, CN
Sung Woo Yoo - Santa Clara CA, US
Miguel Alejandro Lara-Pena - Gilroy CA, US
Weng Choy Foo - Shanghai, CN
Kieran Poulain - San Francisco CA, US

Assignee:

Apple Inc. - Cupertino CA

International Classification:

H01L 23/29
H01L 25/065
H05K 1/03
H01L 21/56

US Classification:

361782, 438126, 361783

Abstract:

An electronic device may be provided with integrated circuits and electrical components such as capacitors that are soldered to printed circuit boards. Liquid polymer adhesive such as encapsulant and underfill materials may be deposited on the printed circuit. Electrical components such as capacitors may be coated with the encapsulant. The underfill may be deposited adjacent to an integrated circuit, so that the underfill wicks into a gap between the integrated circuit and the printed circuit board. The encapsulant may be more viscous than the underfill and may therefore prevent the flowing underfill from reaching the electrical components. Some of the encapsulant may be located between the electrical components and the printed circuit board. The encapsulant can be cured to form an elastomeric material covering the electrical components that helps damp vibrations. The elastomeric material may be less stiff than the underfill.