Susan Janine Bailey

US Patent:

20130288058, Oct 31, 2013

Filed:

Apr 30, 2012

Appl. No.:

13/460372

Inventors:

Wenbin Hong - Ballwin MO, US
Tony D. Flaim - St. James MO, US
Rama Puligadda - Rolla MO, US
Susan Bailey - Rolla MO, US

Assignee:

BREWER SCIENCE INC. - Rolla MO

International Classification:

B32B 37/00
B32B 7/12
B32B 38/10
B32B 37/12
B32B 38/00

US Classification:

428414, 156 60, 156327, 1563317, 156330, 1563309, 156153, 156247, 4284231, 4284744, 428480

Abstract:

New compositions and methods of using those compositions as bonding compositions for temporary wafer bonding are provided. The compositions are used to temporarily bond an active wafer to a carrier wafer or substrate in microelectronic fabrication using an in situ polymerization reaction of the components of the bonding composition to yield the bonding layer. The compositions form polymerized bonding layers that are mechanically strong and thermally resistant, but allow the wafers to be separated at the appropriate stage in the fabrication process. The bonding layer also retains its solubility so that residue can be cleaned from the debonded wafers using simple wet methods rather than etching or other harsh treatments.