Emmett L. Tasset - Clute TX Susan M. Dallessandro - Midland MI Warren F. Richey - Lake Jackson TX
Assignee:
The Dow Chemical Company - Midland MI
International Classification:
C11D 750
US Classification:
252171
Abstract:
Superior solder flux, e. g. , rosin flux, removal compositions are disclosed which have no flash point and are substantially non-corrosive toward aluminum. These compositions consist of about 0. 5 to less than 2% methanol with about 3 to 10% of one or more alcohols containing 2-5 carbon atoms the balance being an inhibited 1,1,1-trichloroethane, wherein percentages are based on volume of the total composition.
Photoresist Stripper Composition And Method Of Use
Wesley L. Archer - Midland MI Vicki A. Lynn - Indianapolis IN Susan M. Dallessandro - Midland MI
Assignee:
The Dow Chemical Company - Midland MI
International Classification:
B08B 308 C11D 750 C23G 502
US Classification:
430329
Abstract:
An improved process for removing crosslinked photoresist polymer from printed circuit boards which comprises contacting the printed circuit board with methylene chloride containing from about 5 to about 10 volume percent of a mixture of methanol and methyl formate. Each additive must be present at a minimum concentration of one volume percent. Stabilizers for the methylene chloride, such as epoxides, may be present at amounts no greater than about 0. 5 volume percent.
Susan M. Dallessandro - Midland MI Wesley L. Archer - Midland MI Stephen P. Krupp - Lake Jackson TX
Assignee:
The Dow Chemical Company - Midland MI
International Classification:
B08B 308 C07C 1742 C11D 750 C23G 5028
US Classification:
252153
Abstract:
Stable methylchloroform solvent compositions in combination with from about 3 to about 5 volume percent of 2-butanol and from about 1 to about 3 volume percent of 3-methyl-1-butyn-3-ol have been shown to be superior solvents for removing flux from circuit boards. Such compositions have no flash point and maintain excellent distribution of the components in the vapor and liquid sections of the defluxing apparatus.
Photoresist Stripper Composition And Method Of Use
Wesley L. Archer - Midland MI Susan M. Dallessandro - Midland MI Vicki A. Lynn - Indianapolis IN
Assignee:
The Dow Chemical Company - Midland MI
International Classification:
B08B 308 C11D 750 C23G 502
US Classification:
430329
Abstract:
An improved process for removing crosslinked photoresist polymer from printed circuit boards which comprises contacting the printed circuit board with methylene chloride containing from about 5 to about 10 volume percent of a mixture of methanol and methyl formate. Each additive must be present at a minimum concentration of one volume percent. Stabilizers for the methylene chloride, such as epoxides, may be present at amounts no greater than about 0. 5 volume percent.