Susan X Li

US Patent:

6468917, Oct 22, 2002

Filed:

Feb 10, 2000

Appl. No.:

09/502916

Inventors:

Susan Xia Li - Fremont CA
Arnold Louie - Cupertino CA
Maria Guardado - San Jose CA

Assignee:

Advanced Micro Devices, Inc. - Sunnyvale CA

International Classification:

H01L 21302

US Classification:

438712, 438714, 438723, 438725, 438745

Abstract:

The present invention provides a method for modifying a C4 device, the device including a circuit, a polyimide layer, and a plurality of solder bumps in the active region of the C4 device. The method includes removing the polyimide layer using a plasma etch, the plasma etch comprising a mixture of oxygen and an inert gas; modifying the circuit; and cleaning the modified C4 device with a reactive flux. By mixing the oxygen with an inert gas, the oxidation of the solder bumps due to the plasma etch are reduced. Because the top layer features are now readily visible, circuit structures are more easily located, and modification can be more easily performed and with more accuracy. In the preferred embodiment, the device is then cleaned with a reactive flux, which removes any oxidation layer which has formed on the solder bumps. In this manner, circuit modification may be performed more quickly while also minimizing the oxidation of the solder bumps. The reduced oxidation of the solder bumps will help the C4 packaging process to be successful for electrical testing after focused beam ion (FIB) modification.

US Patent:

6813733, Nov 2, 2004

Filed:

May 21, 2003

Appl. No.:

10/442278

Inventors:

Susan X. Li - Herndon VA
David Alan Thistlethwaite - Alexandra VA
Glen Michael Allison - Potomac Falls VA
Mark Stanley Prendergast - Ashburn VA
Jing Kang - Shatin, HK

Assignee:

America Online, Inc. - Dulles VA

International Classification:

G06F 1100

US Classification:

714 47, 714 4, 714 25, 714 38, 717128

Abstract:

Diagnostics may be enabled on a networked computer system by executing, at the networked computer system, a client application that enables connectivity by the networked computer system to a network of other computer systems. A diagnostic application is executed at the networked computer system and independently of the client application. The diagnostic application is configured to monitor the operational status of the client application and to track client status information related to the monitored operational status of the client application. Access to the client status information is enabled when performing diagnostics on the client application or the networked computer system.

US Patent:

7319623, Jan 15, 2008

Filed:

Nov 4, 2004

Appl. No.:

10/981026

Inventors:

Caiwen Yuan - Union City CA, US
Susan Xia Li - Fremont CA, US
Andy Gray - San Jose CA, US

Assignee:

Spansion LLC - Sunnyvale CA

International Classification:

G11C 7/00

US Classification:

365201, 714718, 714720

Abstract:

According to one exemplary embodiment, a method for isolating a failure site in a leaky wordline in a memory array includes dividing said leaky wordline into an initial leaky wordline portion and an initial non-leaky wordline portion, where the initial leaky wordline portion has wordline-to-substrate leakage. The initial leaky wordline portion can be determined by using a passive voltage contrast procedure to illuminate the initial leaky wordline portion. The method further includes performing a number of division and identification cycles on the initial leaky wordline portion to determine a final leaky wordline portion. According to this exemplary embodiment, the final leaky wordline portion comprises a predetermined number of memory cells. The method further includes performing a cutting and imaging procedure on the final leaky wordline portion to isolate the failure site.

US Patent:

6358852, Mar 19, 2002

Filed:

May 17, 2000

Appl. No.:

09/574580

Inventors:

Susan Xia Li - Fremont CA
Mohammad Massoodi - Campbell CA
Daniel Yim - Fremont CA

Assignee:

Advanced Micro Devices, Inc. - Sunnyvale CA

International Classification:

H01L 2100

US Classification:

438690, 216 67, 216 88, 438691, 438692, 438710

Abstract:

Aspects for performing decapsulation of multi-chip devices are presented. One aspect includes removing a top die of the multi-chip device without employing a wet chemical etch and removing residual attach and package materials to expose a bottom die of the multi-chip device. An alternate aspect includes utilizing mechanical polishing and wet chemical etching to remove a top die of the multi-chip device, and exposing a bottom die through chemical decapsulation to allow failure analysis of the bottom die. A Flash memory die as a top die and a static random access memory (SRAM) die as a bottom die are included as a multi-chip device capable of decapsulation through these aspects.