Syed Mohammed Husain

US Patent:

6937044, Aug 30, 2005

Filed:

Mar 24, 2000

Appl. No.:

09/534729

Inventors:

Fariborz Agahdel - San Jose CA, US
Brad Griswold - San Jose CA, US
Syed Husain - Milpitas CA, US
Robert Moti - San Jose CA, US
Chung W. Ho - Monte Sereno CA, US

Assignee:

Kulicke & Soffa Industries, Inc. - Willow Grove PA

International Classification:

G01R031/02
G01R031/28

US Classification:

324758, 324755, 324765

Abstract:

A bare semiconductor circuit die carrier is provided for use in the test of semiconductor circuits, the carrier, comprising: a substrate defining an opening and an outer perimeter; a multiplicity of I/O pads disposed about the perimeter; an interconnect circuit which includes a composite of a multiplicity of individual electrical conductors which are formed in a polymer dielectric; wherein the interconnect circuit overlays a top surface of the substrate and extends across the opening so as to form a flexible membrane that spans the opening; a multiplicity of die contact pads connected to the conductors are disposed about the flexible membrane with particles deposited on the die contact pads; a fence upstanding from the membrane and sized to receive a test die; a top cap that rests upon the die when the die is received within the fence; a bottom cap that rests against a bottom surface of the substrate; and a fastener for securing the top cap to the bottom cap with the die disposed therebetween.

US Patent:

8158059, Apr 17, 2012

Filed:

Dec 28, 2006

Appl. No.:

11/648050

Inventors:

Colin Kennedy - Greenbrae CA, US
Syed Husain - Fremont CA, US
Dale von Behren - Shrewsbury MA, US
Rick Bernal - Westborough MA, US

Assignee:

Sotax Corporation - Horsham PA

International Classification:

G01N 21/00

US Classification:

422 64, 422 63, 422 65, 422 681, 422401, 422501, 422509, 73866

Abstract:

The invention provides a system and method for dissolution testing. The system includes multiple dissolution vessels and a dose carrier positioned above the dissolution vessels. The dose carrier holds multiple removable carousels that receive individual doses for dissolution tested. Carousels that receive tablets or sinkers typically have a first configuration, while carousels that receive baskets typically have a second configuration. The two different configurations of carousels are interchangeable on the same dose ring. The system further includes a drive head positioned above the dose carrier, the drive head having a basket arbor and a mixing paddle removably and interchangeably attached. A pipettor integral with the system transfers sample aliquots having volumes in the range of 50 μl to 1 ml from the dissolution vessels to wells of an external receptacle.

US Patent:

8518327, Aug 27, 2013

Filed:

Apr 2, 2012

Appl. No.:

13/437414

Inventors:

Colin B. Kennedy - Greenbrae CA, US
Syed Husain - Fremont CA, US
Dale von Behren - Shrewsbury MA, US
Rick Bernal - Westborough MA, US

Assignee:

Sotax Corporation - Horsham PA

International Classification:

G01N 21/00

US Classification:

422 64, 422 50, 422 65, 422 66, 422 67, 422500, 422501, 422502, 422503

Abstract:

The invention provides a system and method for dissolution testing. The system includes multiple dissolution vessels and a dose carrier positioned above the dissolution vessels. The dose carrier holds multiple removable carousels that receive individual doses for dissolution tested. Carousels that receive tablets or sinkers typically have a first configuration, while carousels that receive baskets typically have a second configuration. The two different configurations of carousels are interchangeable on the same dose ring. The system further includes a drive head positioned above the dose carrier, the drive head having a basket arbor and a mixing paddle removably and interchangeably attached. A pipettor integral with the system transfers sample aliquots having volumes in the range of 50 μl to 1 ml from the dissolution vessels to wells of an external receptacle.

US Patent:

20020009392, Jan 24, 2002

Filed:

Mar 26, 2001

Appl. No.:

09/818266

Inventors:

Jeffrey Wolk - Half Moon Bay CA, US
J. Parce - Palo Alto CA, US
Robert Nagle - Mountain View CA, US
Colin Kennedy - Greenbrae CA, US
Syed Husain - Fremont CA, US
Advit Bhatt - Union City CA, US
Garrett Unno - San Jose CA, US

International Classification:

B01L003/02
G01N001/14

US Classification:

422/063000, 436/180000, 422/067000, 422/100000, 422/104000, 204/453000, 204/604000

Abstract:

Methods for reducing fluid carryover by microfluidic devices including capillary element and/or fluid motion. Capillary elements coated with hydrophobic or hydrophilic coatings to resist fluid carryover are also provided. Microfluidic device handling systems are additionally included.

US Patent:

20140033807, Feb 6, 2014

Filed:

Jul 25, 2013

Appl. No.:

13/950874

Inventors:

Syed Husain - Fremont CA, US
Dale von Behren - Shrewsbury MA, US
Rick Bernal - Westborough MA, US

Assignee:

Sotax Coporation - Horsham PA

International Classification:

G01N 1/38

US Classification:

73 6171

Abstract:

The invention provides a system and method for dissolution testing. The system includes multiple dissolution vessels and a dose carrier positioned above the dissolution vessels. The dose carrier holds multiple removable carousels that receive individual doses for dissolution tested. Carousels that receive tablets or sinkers typically have a first configuration, while carousels that receive baskets typically have a second configuration. The two different configurations of carousels are interchangeable on the same dose ring. The system further includes a drive head positioned above the dose carrier, the drive head having a basket arbor and a mixing paddle removably and interchangeably attached. A pipettor integral with the system transfers sample aliquots having volumes in the range of 50 μl to 1 ml from the dissolution vessels to wells of an external receptacle.

US Patent:

46967273, Sep 29, 1987

Filed:

Nov 12, 1986

Appl. No.:

6/929721

Inventors:

Saad Mukhtar - San Jose CA
Syed A. Husain - Fremont CA

Assignee:

Automated Semiconductor, Inc. - San Jose CA

International Classification:

C25D 1700

US Classification:

204206

Abstract:

A selective plating apparatus having a multipitch centerline feed block for delivering a uniform blade of plating solution to a mask and which provides passageways for the drainage of used electrolyte solution. The delivery of a uniform blade of plating solution to the mask allows the mask to be designed such that it controls both the area of sample to be plated and the pitch of the sample.

US Patent:

52270416, Jul 13, 1993

Filed:

Jun 12, 1992

Appl. No.:

7/898038

Inventors:

Bruce N. Brogden - San Jose CA
Leon P. Brown - Newark CA
Syed A. Husain - Milpitas CA

Assignee:

Digital Equipment Corporation - Maynard MA

International Classification:

C25D 1706

US Classification:

204297R

Abstract:

A dry contact electroplating structure is disclosed. The structure includes a base member for immersion within an electroplating solution. The base member has a central aperture defined by an aperture perimeter formed within the base member. A sealing ring is positioned adjacent to the aperture perimeter. The sealing ring forms a sealing connection with an object to be electroplated. A number of electrical contacts are positioned adjacent to the sealing ring. The electrical contacts form an electrical connection with one side of the object to be electroplated. A lid is positioned on the base member over one side of the central aperture. Thus, the lid protects the electrical contacts and one side of the object to be electroplated, while the other side of the object is exposed to the electroplating solution.

US Patent:

58412913, Nov 24, 1998

Filed:

Dec 12, 1996

Appl. No.:

8/764511

Inventors:

Ken Kuang-Fu Liu - Saratoga CA
Robert John Moti - San Jose CA
Syed A. Husain - Milpitas CA

Assignee:

MicroModule Systems - Cupertino CA

International Classification:

G01R 3102

US Classification:

324755

Abstract:

First and second bumps electrically connected at first and second positions along a conductive run borne by a flexible substrate are respectively oriented for contact with a pad of a die under test and a pad of a tester structure. Second and third conductive regions are electrically connected respectively to the power and ground terminals of a power source and an electrical device. The second and third regions are spaced from a first conductive region to filter high-frequency noise components from power and ground potentials provided by the power source.