Takashi Sugino

US Patent:

7135358, Nov 14, 2006

Filed:

Sep 24, 2004

Appl. No.:

10/948164

Inventors:

Takashi Sugino - Phoenix AZ, US
Tomonori Shinoda - Saitama, JP

Assignee:

Lintec Corporation - Tokyo

International Classification:

H01L 21/44

US Classification:

438126, 257667, 257E23116, 257E21499

Abstract:

There is disclosed a process for producing a resin-sealed type electronic device which comprises forming a dam frame on edge and side portions of a substrate loaded with a single or a plurality of electronic elements so as to encompass the electronic elements by sticking down a pressure sensitive adhesive sheet to the substrate, pouring a resin for sealing in the inside of the dam frame, and heat-curing the poured resin. The process dispenses with an intricate production step or a long time in forming the dam frame, thus enabling forming of the same with a minimized number of production steps and in the shortest amount of time possible.

US Patent:

7169648, Jan 30, 2007

Filed:

Aug 11, 2004

Appl. No.:

10/916177

Inventors:

Akinori Sato - Saitama, JP
Osamu Yamazaki - Saitama, JP
Hideo Senoo - Saitama, JP
Takashi Sugino - Phoenix AZ, US

Assignee:

Lintec Corporation - Tokyo

International Classification:

H01L 21/00

US Classification:

438118, 438113, 438114, 438464, 438465

Abstract:

A process for producing a resin-sealed semiconductor device having high reliability which is produced more easily and efficiently without voids, the process comprising the steps of: (a) providing a semiconductor wafer having circuits on a surface; (b) applying a resin sheet composed of a support and an adhesive resin layer releasable from the support, on the circuit surface of the semiconductor wafer, and fixing an outer periphery of the resin sheet with a ring frame; (c) cutting the semiconductor wafer and the resin layer by each circuit to form chips; (d) picking up each chip together with the resin layer from the support; (e) mounting each chip on a predetermined position of a chip mounting substrate through the resin layer; and (f) firmly bonding the chip on the chip mounting substrate so as to achieve conduction between the chip and the chip mounting substrate.