Abstract:
A coil assembly for use in an optical or a magneto-optical data storage system includes an undercoat and an electrically conductive coil formed of a length of electrical conductor and deposited and secured to the undercoat by means of available wafer processing techniques. The conductive coil terminates in two bonding pads for providing electrical connection to the coil, such that the coil is capable of sustaining an electrical current in excess of approximately 300 mA. The coil is also capable of generating a vertical magnetic field intensity greater than, or equal to approximately 200 Oersteds, and has a resistance of less than, or equal to approximately 2 ohms. The coil assembly further includes a yoke, and an insulation layer which encapsulates at least part of the conductor. The conductor is formed of a plurality of multi-layered turns, such that a first layer is connected to one contact pad and is looped helically, inwardly, and terminates in an innermost turn with a terminal end. A second layer includes an innermost terminal end that overlays the innermost terminal end of the first layer, in order to establish an electrical contact therewith, and to ensure the continuity of the electrical path formed by the coil.