William W. Sheng - Commack NY, US Terence J. Clark - Lansdale PA, US James Fain - Doylestown PA, US Ronald P. Colino - Commack NY, US
Assignee:
Visteon Global Technologies, Inc. - Van Buren Township MI
International Classification:
H01L 23/02
US Classification:
257678, 275702
Abstract:
An aspect of the present invention provides a power module for automotive switching applications including a plurality of semiconductor chips and a unitary silicon nitride substrate. The plurality of semiconductor chips are attached to the silicon nitride substrate and the substrate is configured to have a thermal coefficient of expansion substantially the same as the plurality of semiconductor chips.
Terence Clark (1987-1991), Rachel Pyka (1994-1998), Susan Jencen (1961-1964), Gregory Elliott (1990-1994), Susan Kuzba (1958-1966), Ben Wepfer (1988-1992)