Terrence A Brown

US Patent:

7019530, Mar 28, 2006

Filed:

Dec 20, 2004

Appl. No.:

11/020961

Inventors:

Terrence Harold Brown - Harwood MD, US
Larry Gene Ferguson - Baltimore MD, US

Assignee:

The United States of America as represented by the National Security Agency, - Washington DC

International Classification:

G01R 31/00
G01R 31/26

US Classification:

324501, 324538, 324750, 324765, 438 14, 438 16, 438 17, 438 57, 438107, 438118

Abstract:

The present invention is a method of surface preparation and imaging for integrated circuits. First, a substrate is selected and an opening is cut in the substrate of a sufficient size to fit an integrated circuit to be analyzed. A second substrate is then selected. An adhesive film is applied to the top surface of the first substrate, the adhesive film having adhesive on both sides and covering the opening on the first substrate. An integrated circuit is then inserted into the opening and attached to the bottom side of the adhesive film. Next, the first substrate and integrated circuit are bonded to the second substrate using the adhesive film. The bottom side of the first substrate and the integrated circuit are then thinned until the substrate wafer of the integrated circuit is completely removed. The bottom side of the first substrate and integrated circuit is then thinned to a user-definable level. A handle wafer is then attached to the bottom side of the first substrate.

US Patent:

7183123, Feb 27, 2007

Filed:

Sep 13, 2004

Appl. No.:

10/943826

Inventors:

Terrence Harold Brown - Harwood MD, US
Larry Gene Ferguson - Baltimore MD, US

Assignee:

The United States of America as represented by the National Security Agency - Washington DC

International Classification:

H01L 21/66

US Classification:

438 14, 438 16, 438459

Abstract:

The present invention is a method of surface preparation and imaging for integrated circuits. First, a substrate is selected and an opening is cut in the substrate of a sufficient size to fit an integrated circuit to be analyzed. A second substrate is then selected. An adhesive film is applied to the top surface of the first substrate, the adhesive film having adhesive on both sides and covering the opening on the first substrate. An integrated circuit is then inserted into the opening and attached to the bottom side of the adhesive film. Next, the first substrate and integrated circuit are bonded to the second substrate using the adhesive film. The bottom side of the first substrate and the integrated circuit are then thinned until the substrate wafer of the integrated circuit is completely removed. Finally, an analytical imaging technique is performed on the integrated circuit from the bottom side of the first substrate.

US Patent:

20020070971, Jun 13, 2002

Filed:

Oct 10, 2001

Appl. No.:

09/973066

Inventors:

Terrence A. Brown - Burtonsville MD, US
Reginald Waters - Washington DC, US

International Classification:

G09G005/00

US Classification:

345/775000

Abstract:

A system and methods for tracking central office equipment and inventory records comprised of a series of modules to provide access to link drawings, racks and equipment across an entire network infrastructure. The system and methods provide a user the ability to view equipment, group equipment, and search for equipment and available rack space. Additionally, the central office equipment and inventory records can be compiled into reports for engineering, planning and analysis.

US Patent:

20040083017, Apr 29, 2004

Filed:

Oct 20, 2003

Appl. No.:

10/690251

Inventors:

Terrence Brown - Burtonsville MD, US
Reginald Waters - Washington DC, US
Floyd Pinder - Columbia MD, US

International Classification:

G06F019/00

US Classification:

700/097000

Abstract:

A process and method for an automated rack creator of network equipment based upon input of data to automatically scan a database server to acquire images and/or create images to determine the correct placement in the visual representation of the creation and update of a network rack and equipment dynamically (or in real-time) based upon coding and mathematical equations. The process provides the user a series of input methods or procedures to create, edit and view racks and equipment for the networking and telecommunications industries. The visual representation of the racks provides non-technical personnel with a tool to identify and provide input methods, eliminating the need to visit these networking and telecommunications rooms or offices.

US Patent:

20170195774, Jul 6, 2017

Filed:

Sep 13, 2016

Appl. No.:

15/263757

Inventors:

Terrence Archer Brown - Laurel MD, US
Brandon Archer Brown - Laurel MD, US

International Classification:

H04R 1/10
A45C 13/10
A45C 11/24

Abstract:

A headphone device case, in particular, a dual use case that can be used as both a standard headphone case and a component for personalization of the headphone casing.