Senior Failure Analysis Engineer at Hewlett-Packard
Location:
Corvallis, Oregon Area
Industry:
Electrical/Electronic Manufacturing
Work:
Hewlett-Packard since Nov 1998
Senior Failure Analysis Engineer
Hewlett-Packard Sep 1995 - Oct 1998
Failure Analysis and Quality Engineer
CDI Professional Services Sep 1994 - Sep 1995
SEM/EDS/FIB Specialist
Oregon State University Sep 1990 - Sep 1994
Research Assistant
Education:
Oregon State University 1988 - 1994
BSEE/MSEE, Electrical and Computer Engineering
Honor & Awards:
US Pat. 7125731 Drop generator for ultra-small droplets
US Pat. 6885083 Drop generator die processing
US Pat. 6627467 Fluid ejection device fabrication
US Pat. 6933237 Substrate etch method and device
US Pat. 6981759 Substrate and method forming substrate for fluid ejection device
US Pat. 7282448 Substrate and method forming substrate for fluid ejection device
US Pat. 7083265 Circuit routing for printhead having increased corrosion resistance
US Pat. 6698868 Thermal drop generator for ultra-small droplets
US Pat. 7150516 Integrated circuit and method for manufacturing
US Pat. 6960978, 7170387, 7209021 Fuse structure
US Pat. 7249825 Fluid ejection device with data storage structure
US Pat. 6448100 Method for fabricating self-aligned field emitter tips
US Pat. 6954297 Micro-mirror device including dielectrophoretic liquid
US Pat. 6972882 Micro-mirror device with light angle amplification
US Pat. 6882100, 7078855 Dielectric light device
...and more...
Donald W. Schulte - Corvallis OR Terry E. McMahon - Corvallis OR
Assignee:
Hewlett-Packard Compnay - Palo Alto CA
International Classification:
H01L 2100
US Classification:
438 20, 438700, 438 28, 438 34
Abstract:
An efficient and economical method for fabricating field emitter tips within a layered substrate. The layered substrate is patterned using standard photolithographic techniques and etched to form a rectangular or cylindrical column on top of the substrate composed of conductive and non-conductive layers. The layered substrate is then exposed to an anisotropic etching medium which removes the column to produce a well through the conductive and non-conductive layers and which produces a conical or pyramid-shaped field emitter tip within the silicon substrate directly below the well. Finally, a pull-back etch is used to remove dielectric material from the walls of the well. In an optional step, a thin metal coating may be sputtered onto the surface of the silicon-based field emitter tip.
Charles Haluzak - Corvallis OR Terry Mcmahon - Corvallis OR Donald W. Schulte - Corvallis OR
Assignee:
Hewlett-Packard Development Company, LP. - Houston TX
International Classification:
H01L 2100
US Classification:
438 21, 347 1, 347 20, 347 63
Abstract:
A firing chamber is formed in a fluid ejection device. The firing chamber is substantially defined by a barrier layer and a thin film stack. The barrier layer is formed over the thin film stack. The thin film stack is on a substrate and defines the bottom of the firing chamber. A sacrificial layer is encapsulated between the thin film stack and the barrier layer. The sacrificial layer is removed.
Kenneth E. Trueba - Philomath OR Charles C. Haluzak - Corvallis OR Terry E. McMahon - Albany OR Donald W. Schulte - Corvallis OR
Assignee:
Hewlett-Packard Development Company, L.P. - Houston TX
International Classification:
B41J 205
US Classification:
347 63, 347 65
Abstract:
A thermal-type drop generator for ejecting droplets of liquid having ultra-small volumes. In one embodiment the drop generator includes a chamber defined in part by an orifice member. The chamber is supported by a rigid substrate. Removable material is used in fabricating the chamber.
A light device includes an electron supply defining an emitter surface. A dielectric tunneling layer is disposed between the electron supply and a cathode layer. The cathode layer has at least partial photon transparency that is substantially uniform across the emitter surface.
Simon Dodd - Corvallis OR, US Sean P. McClelland - Corvallis OR, US Colby Van Vooren - Corvallis OR, US Terry E. McMahon - Corvallis OR, US Antonio Cruz-Uribe - Corvallis OR, US
Assignee:
Hewlett-Packard Development Company, L.P. - Houston TX
International Classification:
H01L023/544
US Classification:
257620, 257797
Abstract:
Processing a die that has an edge and a substrate upon which a layer of moisture permeable material is disposed. The moisture permeable material extends to the edge of the die. One embodiment comprises interrupting the layer of moisture permeable material to form a gap at a boundary near the edge, thereby to substantially block movement of moisture through the gap of the moisture permeable material.
Donald W. Schulte - Corvallis OR, US Terry McMahon - Corvallis OR, US Chien-Hua Chen - Corvallis OR, US
Assignee:
Hewlett-Packard Development Company, L.P. - Houston TX
International Classification:
H01L021/302
US Classification:
438700, 438706, 438719, 438745, 257622
Abstract:
The present invention provides methods and an etched substrate. In one embodiment, a method for etching a substrate is provided which comprises creating an etch hole in the substrate using a through the substrate etch and forming a junction on an interior of the etched hole for forming a semiconductor device therein.
Micro-Mirror Device Including Dielectrophoretic Liquid
Paul F. Reboa - Corvallis OR, US Robert W. Shreeve - Corvallis OR, US Terry E. McMahon - Corvallis OR, US
Assignee:
Hewlett-Packard Development Company, L.P. - Houston TX
International Classification:
G02B026/08
US Classification:
359223, 359224
Abstract:
A micro-mirror device includes a substrate having a surface, and a plate spaced from and oriented substantially parallel to the surface of the substrate such that the plate and the surface of the substrate define a cavity therebetween. A dielectrophoretic liquid capable of movement when an electrical signal is applied to the micro-mirror device is disposed in the cavity, and a reflective element is interposed between the surface of the substrate and the plate such that the reflective element is adapted to move between a first position and at least one second position.
Stan E. Leigh - Corvallis OR, US Tom P. Abadilla - Corvallis OR, US Donald W. Schulte - Corvallis OR, US Terry McMahon - Corvallis OR, US
Assignee:
Hewlett-Packard Development Company, L.P. - Houston TX
International Classification:
H01H085/10
US Classification:
337159, 337290, 337295
Abstract:
A fuse structure is described. The fuse structure includes a first region adapted to be coupled to a voltage source, a second region adapted to be coupled to a ground, and a current flow region disposed between the first and second regions. The current flow region has a configuration that causes a void to be opened at a point of localized heating due to current crowding within the current flow region and that causes the void to propagate across the current flow region.
Dr. McMahon graduated from the University of California, Los Angeles David Geffen School of Medicine in 1976. He works in Lubbock, TX and specializes in Psychiatry. Dr. McMahon is affiliated with University Medical Center.
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Terry Mcmahon
Education:
Career & Tech Educ Cons
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My success in life is my happiness.
Terry Mcmahon
Education:
University of Michigan
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A Gentleman Songster all about Cats for Pet Adoption
Terry Mcmahon
About:
Writer-Director of multi-award winning feature Charlie Casanova. Awarded the RKO Pictures Hartley-Merrill International Screenwriting Prize in Cannes and Los Angeles, the Tiernan McBride Screenwriting...