Terry A Tull

US Patent:

61876100, Feb 13, 2001

Filed:

Jul 10, 1998

Appl. No.:

9/113573

Inventors:

Gregg Joseph Armezzani - Endwell NY
Robert Nicholas Ives - Guilford NY
Mark Vincent Pierson - Binghamton NY
Terry Alan Tull - Whitney Point NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 2144

US Classification:

438106

Abstract:

An electronic package is provided that includes a flexible polyimide film carrier having electronic circuitry on both of its major surfaces and a plurality of solder interconnection pads on a first major surface; solder mask layers located on both major surfaces, provided that areas between subsequently to be applied individual circuit chips on the first major surface exist that are free from the solder mask; and a plurality of modules attached to the film carrier by the solder balls or bumps. Also provided is a method for fabricating the electronic package that includes reflow of the solder balls or bumps to achieve attachment of the modules.

US Patent:

58186972, Oct 6, 1998

Filed:

Mar 21, 1997

Appl. No.:

8/828205

Inventors:

Gregg Joseph Armezzani - Endwell NY
Robert Nicholas Ives - Guilford NY
Mark Vincent Pierson - Binghamton NY
Terry Alan Tull - Whitney Point NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 114

US Classification:

361749

Abstract:

An electronic package is provided that includes a flexible polyimide film carrier having electronic circuitry on both of its major surfaces and a plurality of solder interconnection pads on a first major surface; solder mask layers located on both major surfaces, provided that areas between subsequently to be applied individual circuit chips on the first major surface exist that are free from the solder mask; and a plurality of modules attached to the film carrier by the solder balls or bumps. Also provided is a method for fabricating the electronic package that includes reflow of the solder balls or bumps to achieve attachment of the modules.