Thang T Nguyen

US Patent:

6351827, Feb 26, 2002

Filed:

Oct 30, 2000

Appl. No.:

09/702018

Inventors:

Ramon S. Co - Trabuco Canyon CA
Tat Leung Lai - Torrance CA
Thang Nguyen - Santa Ana CA

Assignee:

Kingston Technology Co. - Fountain Valley CA

International Classification:

H02H 305

US Classification:

714 42, 714 29

Abstract:

Margin testing of memory modules uses a personal computer (PC) motherboard. A test adaptor board has a test socket that receives a memory module under test. Pins from the test adaptor board are plugged into holes of a removed memory-module socket on the motherboard, mounted on the reverse, solder side of the motherboard. The test adapter board has a voltage regulator that controls the power-supply (Vcc) voltage applied to the module under test. A delay circuit on the test adapter board varies the phase delay of a clock to the memory module under test. Margin control signals are generated by a controller card in the PCs expansion slots, to control Vcc and clock delay to the module under test without changing the motherboards Vcc voltage. The test program executing on the PC motherboard writes to the controller card to adjust voltage and delay, allowing Vcc and setup and hold margins to be tested.

US Patent:

6357023, Mar 12, 2002

Filed:

Oct 30, 2000

Appl. No.:

09/702017

Inventors:

Ramon S. Co - Trabuco Canyon CA
Steve Si-Yu Chen - San Jose CA
Fred Yen Kong - Irvine CA
Thang Nguyen - Santa Ana CA

Assignee:

Kingston Technology Co. - Fountain Valley CA

International Classification:

H02H 305

US Classification:

714 42, 714718

Abstract:

Memory modules are tested using a test assembly with a personal computer (PC) motherboard. The motherboard is mounted upside-down with its solder-side up to a metal plate using standoffs. A memory-module socket on the motherboard is removed. An opening is made in the metal plate above the removed socket. A well is attached to the metal plate at the opening. The well supports a test adaptor board below the metal plate so that the test adaptor board has a closer spacing to the motherboard than does the metal plate. The test adaptor board has a test socket that receives a module being tested. Pins from the test adaptor board are plugged into the holes of the removed socket on the motherboard, but mounted on the reverse, solder side of the motherboard rather than the component side. The cables, components, and expansion boards of the motherboards are hidden below the metal plate and motherboard, and can be cooled without cooling the memory module in the test socket. A top plate or air guide can be added above the metal plate to blow hot air on the memory module being tested in the test socket, while the cooling air is blown on the motherboard.

US Patent:

6415397, Jul 2, 2002

Filed:

Sep 13, 2000

Appl. No.:

09/660714

Inventors:

Ramon S. Co - Trabuco Canyon CA
Steve Si-Yu Chen - San Jose CA
Fred Yen Kong - Irvine CA
Thang Nguyen - Santa Ana CA

Assignee:

Kingston Technology Company - Fountain Valley CA

International Classification:

H02H 305

US Classification:

714 42, 714718

Abstract:

A test station for testing memory modules uses multiple personal computer (PC) motherboards for performing functional tests on the modules. The motherboards are mounted upside-down with the solder-side up at the desktop level of the test station frame. One or more of the memory-module sockets on each motherboard is removed. A test adaptor board is plugged into the holes of the removed socket, but mounted on the reverse, solder side of the motherboard rather than the component side. The test adaptor board has a test socket that receives a module being tested. An overhead robotic arm picks up memory modules from an input tray and inserts them into test sockets for testing by the motherboards. Since the cables, components, and expansion boards of the motherboards are hidden below the solder-side surface of the motherboards, while the test adaptor board is above, the overhead robotic arm can easily navigate to the test socket without obstruction. Modules that pass are inspected in transit when the robotic arm holds the module in front of a camera that sends images to an image inspection processor.

US Patent:

7523203, Apr 21, 2009

Filed:

May 7, 2001

Appl. No.:

09/850384

Inventors:

Thang C Nguyen - Coppell TX, US
Li Ji - Plano TX, US
Liang Wu - Frisco TX, US
Delon R Whetten - Allen TX, US
Christopher E Pearce - Dallas TX, US

Assignee:

Cisco Technology, Inc. - San Jose CA

International Classification:

G06F 15/173
H04L 12/16
H04M 3/42

US Classification:

709226, 709223, 370260, 370265, 370270, 370271, 37920101, 37920103, 37920201

Abstract:

A method for sharing distributed media resources includes determining at a first call manager that a telephony device controlled by the first call manager requires the use of a media resource device. The method further includes selecting an appropriate media resource device from a media resource group list associated with the telephony device. In addition, the method includes communicating an allocation request to a device process that is associated with the selected media resource device and that is executing at a second call manager controlling the selected media resource device.

Address:

6612 Hillgreen Dr, Arlington, TX 76002

VIN:

5N1AR18U87C601152

Make:

NISSAN

Model:

PATHFINDER

Year:

2007