An apparatus (18) for separating an individual chip (14) from a semiconductor wafer (10) adhered to a diaphragm (16) comprises a "C"-shaped arm (26) having parallel, spaced-apart upper and lower arm portions (28) and (29). The upper arm portion (28) is provided with a yoke (34) at its free end for engaging a robot (42) which carries a pickup tool (46). The free end of the lower arm portion (29) mounts a die ejector (38) lying directly beneath the pickup tool (46) when the robot (42) engages the upper arm portion (28). Once the die ejector (38) is positioned below, and the pickup tool (46) is positioned above, a particular chip (14), actuation of the die ejector causes the chip to be separated and urged upwardly for engagement by the pickup tool. In this way, the need to separately position the die ejector (38) and the pickup tool (46) is obviated.
An adjustable angle extender card is used to hot-test a circuit pack having electrical connectors that connect to back plane electrical connectors in an electrical cabinet when the circuit pack is inserted into the electrical cabinet. The extender card comprises a rigid basic board that can be inserted into the electrical cabinet and a rigid circuit pack card guide that accepts the circuit pack. The basic board includes plural replication electrical connectors, arranged along one edge of a substrate, for connection to the back plane electrical cabinet connectors when the basic board is inserted into the electrical cabinet, and plural basic board electrical connectors arranged along an opposite edge of the substrate. Corresponding replication connectors and basic board connectors are electrically connected. The card guide includes plural emulation electrical connectors disposed proximate to an edge of the card guide for connection to the circuit pack electrical connectors when the circuit pack is in the card guide.
A shielded optical fiber adaptor for mounting in an opening of a conductive faceplate of electronic equipment. The adaptor has an insulative body with a conductive plate imbedded therein. The plate has an aperture within the body which allows passage of light from the optical fiber and extends outwardly of the body to contact the faceplate when the body is retained in the faceplate opening. The largest dimension of the plate aperture is no more than ten percent of the wavelength at the highest operating frequency of the electronic equipment.
Joseph S. Kovalchick - Middlesex NJ Theodore J. Sikorski - Trenton NJ Ralph A. Treder - Ewing NJ
Assignee:
American Telephone and Telegraph - New York NY
International Classification:
H04N 718
US Classification:
358101
Abstract:
The color of each of a plurality of wires 18(1). . . 18(8) can be determined by first placing the wires proximate to a white background (31) and then directing a pair of light beams (36,38) thereat. Each of the red, green and blue spectral components in the light reflected from each wire and in the light reflected from the surface is simultaneously sensed by a separate one of three television cameras (40,42 and 44), respectively, having a separate one of a set of red, green and blue band pass filters (52,54 and 56), respectively, thereon. The output signal of the television cameras is processed by a machine vision system (58) which first computes the ratios of the red, green and blue spectral components of the light reflected from each wire to the red, green and blue spectral components, respectively, of the light reflected from the background. Each of the red, green and blue intensity ratios computed for each wire is then compared by the machine vision system to a red, green and blue intensity ratio, respectively, established for each of a plurality of wires of known colors until a substantial match therebetween is found. When a substantial match is found, the wire of unknown color can then be identified.