Thinh Duc Pham

US Patent:

20170309554, Oct 26, 2017

Filed:

Apr 20, 2016

Appl. No.:

15/134330

Inventors:

- Tempe AZ, US
Thinh Van Pham - Austin TX, US

Assignee:

Amkor Technology, Inc. - Tempe AZ

International Classification:

H01L 23/495
H01L 23/495
H01L 21/48
H01L 21/48
H01L 27/092
H01L 23/495

Abstract:

A method of forming a packaged semiconductor device includes providing a conductive frame structure. The conductive frame structure includes a first frame having leadfingers configured for directly attaching to a semiconductor device, such as an integrated power semiconductor device that includes both power devices and logic type devices. The leadfingers are further configured to provide high current capacity and a high thermal dissipation capacity for the power device portion of the semiconductor device. In one embodiment, the conductive frame structure further includes a second frame joined to the first frame. The second frame includes a plurality of leads configured to electrically connect to low power device portions of the semiconductor device. A package body is formed to encapsulate the semiconductor device and at least portions of the leadfingers and leads.