Thomas W Boyd

US Patent:

6556451, Apr 29, 2003

Filed:

Mar 31, 2000

Appl. No.:

09/539367

Inventors:

Ricky R. Feightner - West Linn OR
Thomas A. Boyd - Battle Ground WA

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 500

US Classification:

361756, 361727, 361683, 361752, 361753, 361759, 361801, 361802, 361825, 361747, 361796, 439 62, 439160

Abstract:

A card guide apparatus for retaining a PCI or ISA computer add-on card within a computer chassis frame. The card guide includes a bracket fixed to the computer chassis frame and a shuttle that is moveable between a first position disengaged with edges of the card to a second position engaged with the edges of the card for support during transport. The shuttle is slidably retained along at least one track defined within the bracket and includes an upper and lower panel defining a channel therebetween in which the card edge is received.

US Patent:

60210427, Feb 1, 2000

Filed:

Aug 6, 1997

Appl. No.:

8/907296

Inventors:

Paul H. Anderson - Beaverton OR
A. James Geddes - Beaverton OR
Thomas A. Boyd - BattleGround WA

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 720

US Classification:

361695

Abstract:

A cooling duct for a computer system with redundant air moving units includes a first inlet that receives a first air flow from a first air moving unit. The cooling duct also includes a second inlet that receives a second air flow from a second air moving unit. A mixing chamber is connected to the first inlet and the second inlet. The mixing chamber receives and mixes the first air flow and the second air flow. A first outlet is connected to the mixing chamber. The first outlet directs the first air flow and the second air flow to a first location. A second outlet is connected to the mixing chamber. The second outlet directs the first air flow and the second air flow to a second location.

US Patent:

20210307153, Sep 30, 2021

Filed:

Mar 24, 2020

Appl. No.:

16/828447

Inventors:

- Santa Clara CA, US
Ralph V. MIELE - Hillsboro OR, US
Thomas BOYD - Vancouver WA, US
Steven A. KLEIN - Chandler AZ, US
Gregorio R. MURTAGIAN - Phoenix AZ, US
Eric W. BUDDRIUS - Hillsboro OR, US
Daniel NEUMANN - Newberg OR, US
Rolf LAIDO - Sherwood OR, US

International Classification:

H05K 1/02
H01R 12/85
H05K 1/18

Abstract:

Embodiments disclosed herein include assemblies. In an embodiment, an assembly comprises a socket and a bolster plate on a board, where the bolster plate has load studs and an opening that surrounds the socket; a shim having first and second ends; and a carrier on the bolster plate, where the carrier has an opening and cutouts. The shim may have an opening through the first end as the second end is affixed to the carrier. The opening of the shim entirely over one cutout from a corner region of the carrier. In an embodiment, the assembly comprises an electronic package in the opening of the carrier, where the electronic package is affixed to the carrier, and a heatsink over the electronic package and carrier, where the first end is directly coupled to a surface of the heatsink and a surface of one load stud of the bolster plate.

US Patent:

20190304871, Oct 3, 2019

Filed:

Mar 30, 2018

Appl. No.:

15/942275

Inventors:

- Santa Clara CA, US
Divya Swamy Bandaru - Hillsboro OR, US
Thomas Boyd - Vancouver WA, US
Jorge Contreras Perez - Zapopan, MX
Shelby A. Ferguson - Hillsboro OR, US
Mustafa Haswarey - Tigard OR, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01L 23/40
H05K 1/02

Abstract:

A microprocessor carrier comprising a lever having an elongate arm and a wedge structure extending from one end of the elongate arm, and a frame comprising and a fulcrum structure to receive the lever and a microprocessor. The fulcrum structure is to couple the lever to the frame.

US Patent:

20190306985, Oct 3, 2019

Filed:

Mar 30, 2018

Appl. No.:

15/942263

Inventors:

Shelby A. Ferguson - Hillsboro OR, US
Bijoyraj Sahu - Portland OR, US
Russell Aoki - Tacoma WA, US
Thomas Boyd - Vancouver WA, US
Eric W. Buddrius - Hillsboro OR, US
Kevin Ceurter - Olympia WA, US
Mustafa Haswarey - Tigard OR, US
Rolf Laido - Sherwood OR, US
Daniel Neumann - Hillsboro OR, US
Rachel Taylor - DuPont WA, US
Anthony Valpiani - Olympia WA, US

International Classification:

H05K 1/18
H01L 23/40
H01L 21/48
H01R 12/88
H01R 12/70

Abstract:

A microprocessor carrier, comprising a frame comprising a metal. The first frame surrounds an aperture for receiving a microprocessor package. At least one hinge assembly is on a first frame edge, and at least one latch assembly is on a second frame edge. One or more alignment tabs coupled to the frame. The one or more alignment tabs extend orthogonally from at least one frame edge. The alignment tabs are to align the microprocessor package with a microprocessor socket. The hinge assembly and the latch assembly are to engage with a microprocessor loading mechanism coupled to a printed circuit board.

US Patent:

20190223324, Jul 18, 2019

Filed:

Mar 28, 2019

Appl. No.:

16/368341

Inventors:

- Santa Clara CA, US
Thomas Boyd - Vancouver WA, US
Bijoyraj Sahu - Portland OR, US
Evan Chenelly - Portland OR, US
Christopher Wade Ackerman - Phoenix AZ, US
Carlos Alvizo Flores - Zapopan, MX
Craig Jahne - Beaverton OR, US

International Classification:

H05K 7/20

Abstract:

Systems, apparatuses, methods, and computer-readable media are presented for managing an apparatus for thermal energy management including a first container. The first container includes a first cavity, and is configured to hold a first liquid coolant within the first cavity to at least partially surround a second container. The second container includes a second cavity configured to hold one or more heat sources, and a second liquid coolant to at least partially surround the one or more heat sources. The second container is sealed to separate the first liquid coolant from the second liquid coolant. Other embodiments may be described and/or claimed.

US Patent:

20190052016, Feb 14, 2019

Filed:

Mar 31, 2016

Appl. No.:

16/078613

Inventors:

- Santa Clara CA, US
Thomas A. BOYD - North Plains OR, US
Yong WANG - Chapel Hill NC, US
Kevin J. CEURTER - Olympia WA, US
Srikant NEKKANTY - Chandler AZ, US
Russell S. AOKI - Tacoma WA, US
FeiFei CHENG - Chandler AZ, US

International Classification:

H01R 13/639
H01R 13/629
H01R 13/627
H01L 23/32
H01R 25/00
H01R 12/71

Abstract:

Apparatuses, methods and storage medium associated with connectors for coupling to a computer processing unit (CPU) package are disclosed herein. In embodiments, a connector assembly for connection to a computer processing unit (CPU) package may include a connector housing. One or more electrical contacts of the connector housing may be to couple to the CPU package when the connector assembly is engaged with a mating connector assembly. The connector assembly may further include a mounting handle affixed to a top of the connector housing. The mounting handle may include a locking latch that extends from the mounting handle. The locking latch may engage with a notch within the mating connector assembly that, when engaged, the locking latch may provide a force to maintain coupling of the one or more electrical contacts with the CPU package when engaged with the mating connector assembly.

US Patent:

20180166807, Jun 14, 2018

Filed:

Dec 13, 2016

Appl. No.:

15/377254

Inventors:

THOMAS A. BOYD - North Plains OR, US
FEIFEI CHENG - Chandler AZ, US
DONALD T. TRAN - Phoenix AZ, US
RUSSELL S. AOKI - Tacoma WA, US
KARUMBU MEYYAPPAN - Portland OR, US

International Classification:

H01R 12/70
H01R 12/88

Abstract:

Embodiments herein relate to port frames and connectors for direct connections to integrated circuit packages. In various embodiments, a port frame to receive a connector and maintain a connection between the connector and a computer processor package may include a protrusion to provide stable attachment of the port frame to a bolster frame, a first wall, a second wall opposite the first wall, a first detent in the first wall, and a second detent in the second wall where the connector is to be received between the first wall and the second wall, and where the first detent is to receive a first locking protrusion extending from the connector and the second detent is to receive a second locking protrusion extending from the connector. Other embodiments may be described and/or claimed.