Thomas K Chapman

US Patent:

20050098609, May 12, 2005

Filed:

Jan 14, 2002

Appl. No.:

10/467006

Inventors:

Victor Greenhut - Piscataway NJ, US
Thomas Chapman - Corning NY, US

International Classification:

B23K031/02

US Classification:

228122100

Abstract:

A method for directly joining ceramics () and metals (). The method involves forming a structure having a ceramic component (), a more refractory metallic component and a less refractory metallic-material-based interlayer () disposed between the ceramic component () and the metallic component (); adding a eutectic forming reactant to the metallic interlayer (); and heating the structure to approximately a eutectic melting temperature of the reactant and the interlayer to form a metallic-material-based eutectic liquid that interacts with the metallic component to form a bond that directly joins the ceramic and metallic components to one another.