Thomas Scott Gordon

US Patent:

7311302, Dec 25, 2007

Filed:

Sep 25, 2006

Appl. No.:

11/535030

Inventors:

Douglas T. Farlow - San Diego CA, US
Thomas A. Gordon - Round Rock TX, US

Assignee:

Production Solutions, Inc. - Poway CA

International Classification:

B23Q 3/00

US Classification:

269296, 269 21

Abstract:

An improved substrate support system for clamping spring loaded pins that support substrates, such as printed circuit boards, which have even profiles, and uneven profiles due to components being installed on one side during manufacturing operations to the opposite side of the substrate. The substrate support system can utilize a cam lever, a knob, or a draw latch to move a clamping plate between an aligned position and a clamping position.

US Patent:

7758028, Jul 20, 2010

Filed:

Sep 25, 2007

Appl. No.:

11/861152

Inventors:

Douglas T. Farlow - San Diego CA, US
Thomas Alan Gordon - San Diego CA, US

International Classification:

B23Q 1/00

US Classification:

269 21, 269 50, 269 53, 269903, 29740, 29559

Abstract:

An improved vacuum box assembly for use in printed circuit board manufacturing where the printed circuit board is supported during manufacturing operations on the second side of the board. The vacuum box uses a unique and improved side plate that securely retains commercially available substrate support devices within the vacuum box. The side plate has a retention cavity configured to receive one or more substrate support devices therein. The side plate retains the substrate support device in a desired position. Open or unoccupied regions of the retention cavity may be sealed by use of specifically configured vacuum blocking plates.

US Patent:

8505178, Aug 13, 2013

Filed:

May 28, 2009

Appl. No.:

12/473925

Inventors:

Douglas T. Farlow - San Diego CA, US
Thomas A. Gordon - Poway CA, US

Assignee:

Production Solutions, Inc. - Poway CA

International Classification:

B25B 27/14
B25B 1/24
B25B 5/16
B23Q 7/00
H05K 3/30
B23K 37/00
B23Q 1/00

US Classification:

292811, 29832, 29559, 269266, 228 443

Abstract:

A system and method for manufacturing that provides for adjustable support of work pieces such as printed circuit boards includes an edge rail system having first and second edge rails, with at least one of the edge rails being adjustable, allowing the width of the system to be adjusted to accommodate various widths of work pieces. It also includes a set of support strips for supporting a lower side of the work pieces and a means for dynamically adjusting spacing of support strips to adjust to the width of the edge rail system.

US Patent:

20120256070, Oct 11, 2012

Filed:

Apr 11, 2012

Appl. No.:

13/444726

Inventors:

Thomas A. Gordon - Poway CA, US
Douglas T. Farlow - San Diego CA, US

International Classification:

H05K 7/00

US Classification:

248310

Abstract:

An apparatus that supports substrates that requires no locking of the support members as the support members move up and down and conform to the underside topography of the substrate. The apparatus is especially suited for underside support of printed circuit boards during assembly processes for printing, pick-and-place operations and automated inspection for surface mount style substrates.

US Patent:

55424570, Aug 6, 1996

Filed:

Jan 10, 1995

Appl. No.:

8/370632

Inventors:

Thomas Gordon - San Diego CA
Douglas Farlow - San Diego CA

International Classification:

B21F 102

US Classification:

140147

Abstract:

A kit tools for use in repairing bent leads on fine pitch surface mount electronic components and a method of repairing such bent leads. The kit basically comprises a plate having a precisely flat surface and a template having a plurality of recesses corresponding to the lead pattern on a component to be repaired. The template is secured to the plate surface, such as by tape extending across tabs extending from the template. A means such as a vacuum pen is used to lift and move the component without touching the leads. A variety of probes, tweezers and the like are used to bend leads back to proper positions. The component may be placed directly against the surface when checking and correcting lack of lead coplanarity and linearity. Grossly bent leads may be corrected with the component on the surface, while precise positioning is accomplished with the component in the template, since fine adjustments can be made and the minor non-alignment can be easily observed and corrected.

US Patent:

59345454, Aug 10, 1999

Filed:

Feb 21, 1997

Appl. No.:

8/803978

Inventors:

Thomas A. Gordon - San Diego CA

International Classification:

B23K 1018
B23K 100
B23K 3102

US Classification:

228191

Abstract:

A method and apparatus allow securing of balls to ball grid array electronic components. A component having a surface with rows and columns of electrical contact solder pads is removed from a printed circuit board for rework. Excess solder is removed from the solder pads and the surface is pressed against a stencil having a pattern of holes corresponding to the component contact pad pattern. Each of the holes is filled with a solder ball. The assembly is heated to melt the at least the solder pads. Where lower melting solder balls are used, the pads and balls both melt. Where high melting temperature solder balls are used, only the solder pads melt. The assembly is cooled to solidify melted solder, the stencil is removed, the component is cleaned and is ready for reuse. Preferably, the stencil is formed from a material that bows in one direction when heated, so that when the stencil is held against the pad array surface and heated, bowing forces will very tightly press the stencil against the surface, preventing molten solder from migrating between surface and stencil.

US Patent:

55269745, Jun 18, 1996

Filed:

Jan 10, 1995

Appl. No.:

8/370631

Inventors:

Thomas Gordon - San Diego CA
Douglas Farlow - San Diego CA

International Classification:

H05K 334

US Classification:

228103

Abstract:

A method and kit for precisely placing fine pitch surface-mount electronic components onto printed circuit boards. An alignment substrate having a pattern of solder pads and holes or transverse edges corresponding to the pattern of solder pads and holes or edges on a printed circuit board is secured to a base by registration pins fastened to the base and inserted into contact with said holes or edges. Generally, the alignment substrate is preferably another circuit board identical with the board to be bonded to the electrical component. A template having a pattern of recesses corresponding to the component lead pattern is secured over the alignment substrate. A component is placed on the template with leads in the recesses. The component is lifted away, a printed circuit board is placed over the template and the component is lower onto the board. The board with component in place can then be removed for soldering.

US Patent:

58955542, Apr 20, 1999

Filed:

Feb 21, 1997

Appl. No.:

8/804353

Inventors:

Thomas A. Gordon - San Diego CA

International Classification:

H01R 909
H05K 334
B32B 3106

US Classification:

156556

Abstract:

A method and apparatus for aligning an electronic component with a base member where a pattern of contacts on the component are to be bonded to an identical pattern of contacts on the base member. Templates having indentations along one edge shaped to align with the contact pattern on the component and base member can be positioned in alignment with the base member contact pattern along two sides of the pattern and releasably secured in place, such as by tape. The component is placed over the base member with its contacts aligned with the template. This assures precise alignment of the two contact patterns. The assembly can be heated to the melting point of the solder and cooled to bond all of the contacts together. The templates are removed for reuse. With ball grid array components, the template indentations are preferably partially-circular to align with the edge row of round solder contact pads.