Thomas P Kirby

US Patent:

57268622, Mar 10, 1998

Filed:

Feb 2, 1996

Appl. No.:

8/596530

Inventors:

Due Huynh - Lawrenceville GA
Thomas P. Kirby - Lithonia GA
Micheal M. Austin - Lilburn GA
John E. Herrmann - Lawrenceville GA

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H05K 702

US Classification:

361773

Abstract:

A leaded component (10) is provided with first and second leads (14 & 16). The leads are formed with stopping deviations (26 & 28) which prevent the leads from being inserted into a circuit board (38) beyond the stopping deviations. The leads may also be provided with retaining deviations (34 & 36) which function to retain the component on the circuit board. Further, the stopping deviations may be formed so as to indicate the polarity of a component, and finally, the stopping deviations may be provided with mounting portions (50 & 52) so that the leaded component may be surface mounted on a circuit board (54).

US Patent:

53081323, May 3, 1994

Filed:

Oct 5, 1992

Appl. No.:

7/956198

Inventors:

Thomas P. Kirby - Boynton Beach FL
Christopher L. Becher - Boynton Beach FL
David H. Rubin - Boynton Beach FL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

B25J 1506
B66C 102

US Classification:

294 641

Abstract:

A robotic placement device (FIG. 1) comprises a programmable end-effector (200) for picking and placing component parts. The programmable end-effector (200) comprises a cylinder (201) having a piston (202) including a first (203) and second (208) shafts coupled together. The first shaft (203) of the piston is larger than the second shaft (208). A controller (102) controls a pressure applied to the cylinder (201) and the piston (202) including the first (203) and second (208) shafts of the programmable end-effector (200) establishes a predetermined placement force at the programmable end-effector (200) while placing component parts. A control circuit 118 senses the pressure and in response thereto generates a signal. A processor 108 coupled to the controller (102) processes the signal and in response thereto varying the pressure for maintaining a substantially constant placement force at the programmable end-effector (200) while the programmable end-effector (200) moves vertically.

US Patent:

54313325, Jul 11, 1995

Filed:

Feb 7, 1994

Appl. No.:

8/192880

Inventors:

Thomas P. Kirby - Lake Worth FL
Jonathon G. Greenwood - Lake Worth FL
Edward Juchniewicz - Delray Beach FL
Ovidiu Neiconi - Boynton Beach FL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

B23K 100
B23K 308
H05K 334

US Classification:

228246

Abstract:

A station (10) in a manufacturing line (12) for the accurate placement of solder balls (30) on a ball grid array package and for the removal of excess solder balls comprises a substrate (4) having an array of solder pads (7), and an adhesion layer (8) on the solder pads. The station further comprises a stencil (16) placed on top of the substrate and having a height between 1/4 times the diameter of one of the solder balls and 5/4 times the diameter of one of the balls, the stencil having an array of apertures (18) corresponding to the array of solder pads and substantially exposing each of the solder pads of the array, a pallet (2) for holding and transporting the substrate to the stencil and further along the manufacturing line, a dispenser (26) for pouring solder balls in bulk over the stencil, a vibration device (20) coupled to the station for urging the solder balls into the apertures of the stencil and onto the adhesion layer above the solder pads, and a moving directed column of air (24) across the surface of the stencil to remove excess solder balls from the stencil.