Thomas J Mathew

US Patent:

20050049517, Mar 3, 2005

Filed:

Sep 3, 2003

Appl. No.:

10/654495

Inventors:

Thomas Mathew - Skokie IL, US
Di-An Hong - Inverness IL, US
George Valliath - Buffalo Grove IL, US
William Olson - Lake Villa IL, US

International Classification:

A61B005/04

US Classification:

600546000

Abstract:

An electromyogram device () have a conformable housing () that houses or otherwise supports an electromyogram signal processor (), electromyogram sensors (), and a display () that provides, for example, information corresponding to one or more muscle condition parameters such as muscular fatigue. In various embodiments, the device can further include additional displays (), memory (), audible alarm mechanisms (), and/or a wireless receiver and/or transmitter (). In one embodiment, such devices can communicate amongst one another to permit central and/or remote display of the resultant electromyogram information.

US Patent:

20080083981, Apr 10, 2008

Filed:

Jun 7, 2006

Appl. No.:

11/422863

Inventors:

Matthew D. Romig - Richardson TX, US
Thomas Mathew - Irving TX, US

International Classification:

H01L 23/34
H01L 21/00

US Classification:

257707, 257713, 438122

Abstract:

BGA packages have thermal properties which are enhanced by a heat channel through the substrate. Solder ball attachment points are provided at the surface of the heat channel for receiving solder balls. A BGA includes an IC operably coupled to a substrate having a top surface for receiving the IC and a bottom surface defining the perimeter of the package bottom. An encapsulant encloses the IC and at least a portion of the top surface of the substrate, defining the top and sides of the package. The substrate includes a heat channel aperture for receiving heat channel having a surface proximal to the IC and having a patterned opposing surface defining at least an interior portion of the package bottom and coupling to solder balls. Methods for assembling packages are disclosed in which a substrate is provided with a heat channel aperture and the heat channel is placed therein.