Thomas M Myers

US Patent:

6896039, May 24, 2005

Filed:

May 7, 2004

Appl. No.:

10/841784

Inventors:

Peter M. Dussinger - Lititz PA, US
Thomas L. Myers - Lititz PA, US
John H. Rosenfeld - Lancaster PA, US
Kenneth L. Minnerly - Lititz PA, US

Assignee:

Thermal Corp. - Stanton DE

International Classification:

F28D015/00

US Classification:

16510426, 16510421, 165 76, 361700, 257715

Abstract:

A heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink is provided. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles so as to form a network of capillary passageways between the particles of the wick.

US Patent:

7028760, Apr 18, 2006

Filed:

Mar 1, 2005

Appl. No.:

11/069260

Inventors:

Peter M. Dussinger - Lititz PA, US
Thomas L. Myers - Lititz PA, US
John H. Rosenfeld - Lancaster PA, US
Kenneth L. Minnerly - Lititz PA, US

Assignee:

Thermal Corp. - Wilmington DE

International Classification:

F28D 15/00
F28F 7/00

US Classification:

16510426, 16510421, 16510433, 165 803

Abstract:

A heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink is provided. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles so as to form a network of capillary passageways between the particles of the wick.

US Patent:

7066240, Jun 27, 2006

Filed:

May 9, 2001

Appl. No.:

09/852322

Inventors:

Peter M. Dussinger - Lititz PA, US
Thomas L. Myers - Lititz PA, US

Assignee:

Thermal Corp - Wilmington DE

International Classification:

F28D 15/00

US Classification:

16510426, 16510433, 361700, 257715

Abstract:

The apparatus is a heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of more highly heat conductive material for only that part of the wick in the region which contacts the heat source, so that there is superior heat conductivity in that region.

US Patent:

7100679, Sep 5, 2006

Filed:

Dec 18, 2003

Appl. No.:

10/739709

Inventors:

Peter M. Dussinger - Lititz PA, US
Thomas L. Myers - Lititz PA, US

Assignee:

Thermal Corp. - Wilmington DE

International Classification:

F28D 15/00

US Classification:

16510426, 16510421

Abstract:

A heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of more highly heat conductive material for only that part of the wick in the region which contacts the heat source, so that there is superior heat conductivity in that region.

US Patent:

7100680, Sep 5, 2006

Filed:

Aug 9, 2005

Appl. No.:

11/200349

Inventors:

Peter M. Dussinger - Lititz PA, US
Thomas L. Myers - Lititz PA, US

Assignee:

Thermal Corp. - Wilmington DE

International Classification:

F28D 15/00
F28F 7/00

US Classification:

16510426, 16510421, 165 83, 165185, 165 76, 361700, 257715

Abstract:

The apparatus is a heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of more highly heat conductive material for only that part of the wick in the region which contacts the heat source, so that there is superior heat conductivity in that region.

US Patent:

20020050341, May 2, 2002

Filed:

Dec 12, 2001

Appl. No.:

10/020845

Inventors:

Peter Dussinger - Lititz PA, US
Thomas Myers - Lititz PA, US

International Classification:

F28D015/00

US Classification:

165/104260

Abstract:

The invention is a flat heat pipe heat spreader with the addition of a solid heat conductive structure spanning the internal space in the heat pipe only at the region of contact with the heat source. Capillary wick is also bonded to the sides of the solid heat conductive structure. Thus, the solid structure provides both direct heat conduction from the heat source to a heat sink mounted atop the heat spreader and also acts as an extended evaporator surface within the heat pipe. The combination furnishes a decrease in the thermal resistance compared to a heat pipe without the solid structure.

US Patent:

20050217826, Oct 6, 2005

Filed:

May 13, 2005

Appl. No.:

11/128453

Inventors:

Peter Dussinger - Lititz PA, US
Thomas Myers - Lititz PA, US
John Rosenfeld - Lancaster PA, US
Kenneth Minnerly - Lititz PA, US

International Classification:

F28D015/00

US Classification:

165104260

Abstract:

A heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink is provided. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles so as to form a network of capillary passageways between the particles of the wick.

US Patent:

20060243425, Nov 2, 2006

Filed:

Jul 14, 2006

Appl. No.:

11/457682

Inventors:

Peter Dussinger - LITITZ PA, US
Thomas Myers - LITITZ PA, US

International Classification:

H05K 7/20

US Classification:

165104260, 361700000

Abstract:

A heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of more highly heat conductive material for only that part of the wick in the region which contacts the heat source, so that there is superior heat conductivity in that region.