Thomas Henry Oberlitner

US Patent:

6375741, Apr 23, 2002

Filed:

May 23, 2000

Appl. No.:

09/575965

Inventors:

Timothy J. Reardon - Kalispell MT 59904
Craig P. Meuchel - Kalispell MT 59904
Thomas H. Oberlitner - Kalispell MT 59904

International Classification:

B05C 1100

US Classification:

118313, 118300, 118315, 427 96, 427421, 438758, 134183, 134200, 134902

Abstract:

A semiconductor processor for spray coating wafers or other semiconductor articles. The processor has a compartment in which are mounted a wafer transfer, coating station and thermal treatment station. The coating station has a spray processing vessel in which a movable spray-head and rotatable wafer holder. The spray station has coating viscosity control features. An ultrasonic resonating spray-head is precisely supplied with coating from a metering pump. The heat treatment station heat cures the coating and then cools the wafer. The system allows coatings to be applied in relatively uniform conformational layers upon irregular surfaces.

US Patent:

6547937, Apr 15, 2003

Filed:

Jan 3, 2000

Appl. No.:

09/476526

Inventors:

Thomas H. Oberlitner - Kalispell MT
Kyle M. Hanson - Kalispell MT

Assignee:

Semitool, Inc. - Kalispell MT

International Classification:

C25D 1700

US Classification:

204224R, 204222, 204245

Abstract:

An integrated tool is provided including at least one workpiece processing station having a paddle assembly. In accordance with one aspect of the invention, the workpiece processing station is adapted for adjusting the level of the processing fluid relative to a workpiece, wherein the portion of the workpiece to be processed and possibly the paddle is selectively immersed within the processing fluid. In accordance with a further aspect of the invention, a paddle is provided for use proximate to a workpiece in a workpiece processing station. The paddle includes a one or more sets of delivery ports and one or more sets of fluid recovery ports. In at least one embodiment, the paddle provides for agitation of a processing fluid proximate to the surface of the workpiece. In at least another embodiment, the paddle provides for the delivery and/or recovery of one or more fluids to the portion of the workpiece to be processed. One aspect of the present invention enables the fluids supplied to the workpiece by the paddle to be limited to the space located between the workpiece and the paddle, thus avoiding mixing of these fluids with the processing fluid located within the bowl assembly not supplied by the paddle.

US Patent:

6645356, Nov 11, 2003

Filed:

Aug 31, 1999

Appl. No.:

09/386558

Inventors:

Daniel J. Woodruff - Kalispell MT
Kyle M. Hanson - Kalispell MT
Thomas H. Oberlitner - Kalispell MT
LinLin Chen - Kalispell MT
John M. Pedersen - Kalispell MT
Vladimir Zila - Scarborough, CA

Assignee:

Semitool, Inc. - Kalispell MT

International Classification:

C25D 1700

US Classification:

204242, 204224 R

Abstract:

A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode within the reactor bowl. The contact assembly includes a plurality of contacts disposed to contact a peripheral edge of the surface of the workpiece to provide electroplating power to the surface of the workpiece. The contacts execute a wiping action against the surface of the workpiece as the workpiece is brought into engagement therewith The contact assembly also including a barrier disposed interior of the plurality of contacts. The barrier includes a member disposed to engage the surface of the workpiece to assist in isolating the plurality of contacts from the electroplating solution. In one embodiment, the plurality of contacts are in the form of discrete flexures while in another embodiment the plurality of contacts are in the form of a Belleville ring contact.

US Patent:

6699373, Mar 2, 2004

Filed:

Aug 30, 2001

Appl. No.:

09/944152

Inventors:

Daniel J. Woodruff - Kalispell MT
Kyle M. Hanson - Kalispell MT
Thomas H. Oberlitner - Kalispell MT
LinLin Chen - Kalispell MT
John M. Pedersen - Kalispell MT
Vladimir Zila - Scarborough, CA

Assignee:

Semitool, Inc. - Kalispell MT

International Classification:

C25D 1700

US Classification:

204198, 204212, 204279, 20429701, 204224 R, 118423, 118500

Abstract:

A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode within the reactor bowl. The contact assembly includes a plurality of contacts disposed to contact a peripheral edge of the surface of the workpiece to provide electroplating power to the surface of the workpiece. The contacts execute a wiping action against the surface of the workpiece as the workpiece is brought into engagement therewith The contact assembly also including a barrier disposed interior of the plurality of contacts. The barrier includes a member disposed to engage the surface of the workpiece to assist in isolating the plurality of contacts from the electroplating solution. In one embodiment, the plurality of contacts are in the form of discrete flexures while in another embodiment the plurality of contacts are in the form of a Belleville ring contact.

US Patent:

6773559, Aug 10, 2004

Filed:

Feb 13, 2001

Appl. No.:

09/782216

Inventors:

Daniel Woodruff - Kalispell MT
Steve Eudy - Kalispell MT
James Erickson - Columbia Falls MT
Thomas Oberlitner - Kalispell MT
Matthew Egloff - Kalispell MT

Assignee:

Semitool, Inc. - Kalispell MT

International Classification:

C25D 1700

US Classification:

204222, 204224 R, 204224 M, 204237, 2042751

Abstract:

Although there are several inventions disclosed herein, the present application is directed to a reactor for electrochemically processing a microelectronic workpiece. The reactor comprises a movable electrode assembly that is disposed for movement along a motion path. The motion path includes at least a portion thereof over which the electrode assembly is positioned for processing at least one surface of the microelectronic workpiece. A cleaning electrode is located along the motion path of the movable electrode assembly. In one embodiment, a programmable controller is connected to direct the movable electrode assembly to move to the cleaning electrode during a cleaning cycle. At that time, the programmable controller connects the movable electrode assembly as an anode and the cleaning electrode as a cathode for cleaning of the movable electrode assembly. The cleaning electrode may be disposed along a position of the motion path that is beyond the range of motion required to process the microelectronic workpiece so that the programmable controller may be programmed to conduct a cleaning cycle while a microelectronic workpiece is present in the reactor for processing.

US Patent:

6869510, Mar 22, 2005

Filed:

Oct 30, 2001

Appl. No.:

09/998142

Inventors:

Daniel J. Woodruff - Kalispell MT, US
Kyle M. Hanson - Kalispell MT, US
Thomas H. Oberlitner - Kalispell MT, US
LinLin Chen - Kalispell MT, US
John M. Pedersen - Kalispell MT, US
Vladimir Zila - Scarborough, CA

Assignee:

Semitool, Inc. - Kalispell MT

International Classification:

C25D017/06

US Classification:

20429701, 20429709

Abstract:

A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode within the reactor bowl. The contact assembly includes a plurality of contacts disposed to contact a peripheral edge of the surface of the workpiece to provide electroplating power to the surface of the workpiece. The contacts execute a wiping action against the surface of the workpiece as the workpiece is brought into engagement therewith The contact assembly also including a barrier disposed interior of the plurality of contacts. The barrier includes a member disposed to engage the surface of the workpiece to assist in isolating the plurality of contacts from the electroplating solution.

US Patent:

7094291, Aug 22, 2006

Filed:

Jun 26, 2001

Appl. No.:

09/893316

Inventors:

Timothy J. Reardon - Walla Walla WA, US
Craig P. Meuchel - Kalispell MT, US
Thomas H. Oberlitner - Kalispell MT, US
Aleksander Owczarz - San Jose CA, US
Raymon F. Thompson - Kalispell MT, US

Assignee:

Semitool, Inc. - Kalispell MT

International Classification:

B05C 11/00
B05B 12/00
B05B 15/00

US Classification:

118313, 118300, 118315

Abstract:

A semiconductor processor for spray coating wafers or other semiconductor articles. The processor has a compartment in which are mounted a wafer transfer, coating station and thermal treatment station. The coating station has a spray processing vessel in which a movable spray-head and rotatable wafer holder. The spray station has coating viscosity control features. An ultrasonic resonating spray-head is precisely supplied with coating from a metering pump. The heat treatment station heat cures the coating and then cools the wafer. The system allows coatings to be applied in relatively uniform conformational layers upon irregular surfaces.

US Patent:

7138016, Nov 21, 2006

Filed:

Jun 26, 2001

Appl. No.:

09/893315

Inventors:

Timothy J. Reardon - Walla Walla WA, US
Thomas H. Oberlitner - Kalispell MT, US
Craig P. Meuchel - Kalispell MT, US
Aleksander Owczarz - San Jose CA, US
Raymon F. Thompson - Kalispell MT, US

Assignee:

Semitool, Inc. - Kalispell MT

International Classification:

B05C 11/00
B05B 12/00
B05B 15/00

US Classification:

118313, 118300, 118315

Abstract:

A semiconductor processor for spray coating wafers or other semiconductor articles. The processor has a compartment in which are mounted a wafer transfer, coating station and thermal treatment station. The coating station has a spray processing vessel in which a movable spray-head and rotatable wafer holder. The spray station has coating viscosity control features. An ultrasonic resonating spray-head is precisely supplied with coating from a metering pump. The heat treatment station heat cures the coating and then cools the wafer. The system allows coatings to be applied in relatively uniform conformational layers upon irregular surfaces.