Thomas R Steiner

US Patent:

20170294252, Oct 12, 2017

Filed:

Apr 11, 2016

Appl. No.:

15/095700

Inventors:

- Bethesda MD, US
Jaime Ballester - Palmdale CA, US
Thomas Richard Steiner - Palmdale CA, US
William Kui-Kun Ng - Valencia CA, US

International Classification:

H01C 17/00
H01C 7/20

Abstract:

In certain embodiments, a method comprises ablating, by a laser set to a first power level, a first area of a polyimide base substrate and forming, by ablating the first area of the polyimide base substrate, a first carbonaceous material film comprising a first specific resistive value. The method further comprises ablating, by the laser set to a second power level, a second area of the polyimide base substrate and forming, by ablating the second area of the polyimide base substrate, a second carbonaceous material film comprising a second specific resistive value. A tapered resistive material is produced by forming the first carbonaceous material film comprising the first specific resistive value and the second carbonaceous material film comprising the second specific resistive value.