Thomas G. Strempel - Madison OH Charles J. Hora - Willoughby Hills OH
Assignee:
Diamond Shamrock Corporation - Cleveland OH
International Classification:
C25B 1100
US Classification:
204284
Abstract:
Disclosed is an improved wafer electrode for use in an electrolytic cell, having an access tube to direct a fluid across the electrode plate or to remove fluid from near the electrode plate within the cell. Cells employing the subject wafer electrode in an electrolytic cell can be used for various electrochemical processes such as for the production of alkali metal carbonates.
Application Of Electroplate To Moving Metal By Belt Plating
Terry E. Dorsett - Chardon OH David P. Rininger - Fairport Harbor OH Thomas G. Strempel - Euclid OH
International Classification:
C25D 706 C25D 1700
US Classification:
204 28
Abstract:
An anodic belt electroplating apparatus utilizes a flexible, electrolyte permeable belt anode with porous outer belt covering that provides flexible operation parameters. The perforate belt anode such as of valve metal in mesh form, has an electrocatalytic coating and an electrolyte-containing wrap for the outer belt covering. Processing parameters can provide desirable electroplate, such as of metal coils electroplated in strip form through an at least substantially flat and horizontal electroplate zone, at highly desirable plating speeds as well as providing careful control over plate composition and deposition thickness.
Thomas G. Strempel - Madison OH Charles J. Hora - Willoughby Hills OH
Assignee:
Diamond Shamrock Corporation - Cleveland OH
International Classification:
C25B 1102
US Classification:
204265
Abstract:
Disclosed is an improved wafer electrode for use in an electrolytic cell, having an access tube to direct a fluid across the electrode plate or to remove fluid from near the electrode plate within the cell. Cells employing the subject wafer electrode in an electrolytic cell can be used for various electrochemical processes such as for the production of alkali metal carbonates.