Thuy N Tran

US Patent:

6377464, Apr 23, 2002

Filed:

Jan 29, 1999

Appl. No.:

09/239617

Inventors:

Hassan Hashemi - Laguna Niguel CA
Shiaw Chang - Thousand Oaks CA
Roger Forse - Santa Barbara CA
Evan McCarthy - Costa Mesa CA
Trang Trinh - Cypress CA
Thuy Tran - El Monte CA

Assignee:

Conexant Systems, Inc. - Newport Beach CA

International Classification:

H05K 702

US Classification:

361760, 361761, 361762, 361763, 361764, 361766, 361777, 361782, 361715, 257713, 257516

Abstract:

A multiple chip module (MCM) for use with baseband, RF, or IF applications includes a number of active circuit chips having a plurality of different functions. The active circuit chips are mounted on a substrate that is configured to provide an integrated subsystem in a single MCM package. The MCM includes a number of features that enable it to meet electrical performance, high-volume manufacturing, and low-cost requirements. The MCM may incorporate split ground planes to achieve electronic shielding and isolation, vias configured as both thermal sinks and grounding connections, and specifically configured die attach pads and exposed ground conductor pads.

US Patent:

6885561, Apr 26, 2005

Filed:

Oct 30, 2001

Appl. No.:

10/020380

Inventors:

Hassan Hashemi - Laguna Niguel CA, US
Shiaw Chang - Thousand Oaks CA, US
Roger Forse - Santa Barbara CA, US
Evan McCarthy - Costa Mesa CA, US
Trang Trinh - Cypress CA, US
Thuy Tran - El Monte CA, US

Assignee:

Skyworks Solutions, Inc. - Irvine CA

International Classification:

H05K007/02
H05K007/06
H05K007/08
H05K007/10

US Classification:

361760, 361761, 361763, 361803, 361816, 361818, 174 35 R, 174260, 174261

Abstract:

A multiple chip module (MCM) for use with baseband, RF, or IF applications includes a number of active circuit chips having a plurality of different functions. The active circuit chips are mounted on a substrate that is configured to provide an integrated subsystem in a single MCM package. The MCM includes a number of features that enable it to meet electrical performance, high-volume manufacturing, and low-cost requirements. The MCM may incorporate split ground planes to achieve electronic shielding and isolation, vias configured as both thermal sinks and grounding connections, and specifically configured die attach pads and exposed ground conductor pads.