Timothy Edward Cooper

US Patent:

7071715, Jul 4, 2006

Filed:

Feb 2, 2004

Appl. No.:

10/771099

Inventors:

Makarand S. Shinde - Livermore CA, US
Richard A. Larder - Livermore CA, US
Timothy E. Cooper - Discovery Bay CA, US
Ravindra V. Shenoy - Dublin CA, US
Benjamin N. Eldridge - Danville CA, US

Assignee:

FormFactor, Inc. - Livermore CA

International Classification:

G01R 31/02
G01R 31/26
H05K 7/02
H01R 12/04

US Classification:

324754, 324758, 324761, 361760, 439 66

Abstract:

A mechanical support configuration for a probe card of a wafer test system is provided to increase support for a very low flexural strength substrate that supports spring probes. Increased mechanical support is provided by: (1) a frame around the periphery of the substrate having an increased sized horizontal extension over the surface of the substrate; (2) leaf springs with a bend enabling the leaf springs to extend vertically and engage the inner frame closer to the spring probes; (3) an insulating flexible membrane, or load support member machined into the inner frame, to engage the low flexural strength substrate farther away from its edge; (4) a support structure, such as support pins, added to provide support to counteract probe loading near the center of the space transformer substrate; and/or (5) a highly rigid interface tile provided between the probes and a lower flexural strength space transformer substrate.

US Patent:

7084650, Aug 1, 2006

Filed:

Dec 16, 2002

Appl. No.:

10/321743

Inventors:

Timothy E. Cooper - Discovery Bay CA, US
Benjamin N. Eldridge - Danville CA, US
Carl V. Reynolds - Pleasanton CA, US
Ravindra Vaman Shenoy - Dublin CA, US

Assignee:

FormFactor, Inc. - Livermore CA

International Classification:

G01R 31/02

US Classification:

324754, 324757, 324761, 324762

Abstract:

Methods and apparatuses for testing semiconductor devices are disclosed. Over travel stops limit over travel of a device to be tested with respect to probes of a probe card assembly. Feedback control techniques are employed to control relative movement of the device and the probe card assembly. A probe card assembly includes flexible base for absorbing excessive over travel of the device to be tested with respect to the probe card assembly.

US Patent:

7202682, Apr 10, 2007

Filed:

Dec 20, 2002

Appl. No.:

10/328113

Inventors:

Timothy E. Cooper - Discovery Bay CA, US
Benjamin N. Eldridge - Danville CA, US
Igor Y. Khandros - Orinda CA, US
Rod Martens - Livermore CA, US
Gaetan L. Mathieu - Livermore CA, US

Assignee:

FormFactor, Inc. - Livermore CA

International Classification:

G01R 31/02

US Classification:

324756

Abstract:

An electronic device is moved into a first position with respect to probes for making electrical contact with the device. The electronic device is then moved into a second position in which the electronic device is pressed against the probes, compressing the probes. The movement into the second position includes two components. One component of the movement tends to press the electronic device against the probes, compressing the probes and inducing a stress in the probes. The second movement tends to reduce that stress. Test data are then communicated to and from the electronic device through the probes.

US Patent:

7218127, May 15, 2007

Filed:

Feb 18, 2004

Appl. No.:

10/781369

Inventors:

Timothy E. Cooper - Discovery Bay CA, US
Benjamin N. Eldridge - Danville CA, US
Igor Y. Khandros - Orinda CA, US
Rod Martens - Livermore CA, US
Gaetan L. Mathieu - Livermore CA, US

Assignee:

FormFactor, Inc. - Livermore CA

International Classification:

G01R 31/02

US Classification:

324754, 324757, 324758

Abstract:

An electronic device is moved into a first position such that terminals of the electronic device are adjacent probes for making electrical contact with the terminals. The electronic device is then moved horizontally or diagonally such that the terminals contact the probes. Test data are then communicated to and from the electronic device through the probes.

US Patent:

7463043, Dec 9, 2008

Filed:

May 15, 2007

Appl. No.:

11/748988

Inventors:

Timothy E. Cooper - Discovery Bay CA, US
Benjamin N. Eldridge - Danville CA, US
Igor Y. Khandros - Orinda CA, US
Rod Martens - Livermore CA, US
Gaetan L. Mathieu - Livermore CA, US

Assignee:

FormFactor, Inc. - Livermore CA

International Classification:

G01R 31/02

US Classification:

324754, 324757, 324758

Abstract:

An electronic device is moved into a first position such that terminals of the electronic device are adjacent probes for making electrical contact with the terminals. The electronic device is then moved horizontally or diagonally such that the terminals contact the probes. Test data are then communicated to and from the electronic device through the probes.

US Patent:

7482822, Jan 27, 2009

Filed:

Aug 1, 2006

Appl. No.:

11/461734

Inventors:

Timothy E. Cooper - Discovery Bay CA, US
Benjamin N. Eldridge - Danville CA, US
Carl V. Reynolds - Pleasanton CA, US
Ravindra Vaman Shenoy - Dublin CA, US

Assignee:

FormFactor, Inc. - Livermore CA

International Classification:

G01R 31/02

US Classification:

324754, 324757, 324761, 324762

Abstract:

Methods and apparatuses for testing semiconductor devices are disclosed. Over travel stops limit over travel of a device to be tested with respect to probes of a probe card assembly. Feedback control techniques are employed to control relative movement of the device and the probe card assembly. A probe card assembly includes flexible base for absorbing excessive over travel of the device to be tested with respect to the probe card assembly.

US Patent:

7694246, Apr 6, 2010

Filed:

Jun 19, 2002

Appl. No.:

10/177367

Inventors:

Charles A. Miller - Fremont CA, US
Timothy E. Cooper - Discovery Bay CA, US
Yoshikazu Hatsukano - Minato-ku, JP

Assignee:

FormFactor, Inc. - Livermore CA

International Classification:

G06F 17/50

US Classification:

716 4, 716 1

Abstract:

A semiconductor wafer is cut to singulate integrated circuit dice formed on the wafer. A die pick machine then positions and orients the singulated dice on a carrier base such that signal, power and ground pads formed on the surface of each die reside at predetermined positions relative to landmarks on the carrier base the die pick machine optically identifies. With the dice temporarily held in place on the carrier base, they are subjected to a series of testing and other processing steps. Since each die's signal pads reside in predetermined locations, they can be accessed by appropriately arranged probes providing test equipment with signal access to the pads during tests. After each test, a die pick machine may replace any die that fails the test with another die, thereby improving efficiency of subsequent testing and other processing resources.

US Patent:

7701243, Apr 20, 2010

Filed:

Dec 9, 2008

Appl. No.:

12/331163

Inventors:

Timothy E. Cooper - Discovery Bay CA, US
Benjamin N. Eldridge - Danville CA, US
Igor Y. Khandros - Orinda CA, US
Rod Martens - Livermore CA, US
Gaetan L. Mathieu - Varennes CA, US

Assignee:

FormFactor, Inc. - Livermore CA

International Classification:

G01R 31/02

US Classification:

324765, 324754, 324762

Abstract:

An electronic device is moved into a first position such that terminals of the electronic device are adjacent probes for making electrical contact with the terminals. The electronic device is then moved horizontally or diagonally such that the terminals contact the probes. Test data are then communicated to and from the electronic device through the probes.