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2008 to 2000 Project Manager / FI Planning Business Process ManagerFannie Mae, Accounting Data Warehouse, PMO Group Herndon, VA 2007 to 2008 Project Manager, Restatement / Catch-Up / Get CurrentFannie Mae Washington, DC 2006 to 2007 Knowledge Management PortalFreddie Mac McLean, VA 2006 to 2006 Sr. Project ManagerFannie Mae Washington, DC 2005 to 2006 Sr. Program ManagerThe World Bank Group Washington, DC 2002 to 2005 Resource Management (RM), Team Leader/ConsultantThe World Bank Group Washington, DC 1997 to 2000 Project Manager / Information OfficerSupermation, Inc
1996 to 1997 Vice-President Operations/R&DWorld Bank Group
Brian A. Vaartstra - Nampa ID, US Timothy A. Quick - Boise ID, US
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
H01L 21/31 H01L 21/496
US Classification:
438785, 438681, 438778, 438643
Abstract:
A method of forming (and apparatus for forming) a tantalum oxide layer on a substrate, particularly a semiconductor substrate or substrate assembly, using a vapor deposition process and a tantalum precursor compound that includes alkoxide ligands, for example.
Systems And Methods For Forming Metal Oxides Using Metal Compounds Containing Aminosilane Ligands
Brian A. Vaartstra - Nampa ID, US Timothy A. Quick - Boise ID, US
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
H01L 21/00
US Classification:
438240, 438785, 438681
Abstract:
A method of forming (and an apparatus for forming) a metal oxide layer on a substrate, particularly a semiconductor substrate or substrate assembly, using a vapor deposition process and one or more precursor compounds that include aminosilane ligands.
Systems And Method For Forming Silicon Oxide Layers
Brian A. Vaartstra - Nampa ID, US Timothy A. Quick - Boise ID, US
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
H01L 21/31
US Classification:
438758, 438787
Abstract:
A method of forming (and apparatus for forming) a metal oxide layer, preferably a dielectric layer, on a substrate, particularly a semiconductor substrate or substrate assembly, using a vapor deposition process and ozone with one or more metal organo-amine precursor compounds.
Systems And Methods For Forming Metal Oxide Layers
Brian A. Vaartstra - Nampa ID, US Timothy A. Quick - Boise ID, US
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
H01L 21/31
US Classification:
438758, 438778, 438785, 257E21006, 42725531
Abstract:
A method of forming (and apparatus for forming) a metal oxide layer, preferably a dielectric layer, on a substrate, particularly a semiconductor substrate or substrate assembly, using a vapor deposition process and ozone with one or more metal organo-amine precursor compounds.
Systems And Methods For Forming Tantalum Oxide Layers And Tantalum Precursor Compounds
A method of forming (and apparatus for forming) a tantalum oxide layer on a substrate, particularly a semiconductor substrate or substrate assembly, using a vapor deposition process and a tantalum precursor compound that includes alkoxide ligands, for example.
Atomic Layer Deposition Systems And Methods Including Metal Beta-Diketiminate Compounds
The present invention provides atomic layer deposition systems and methods that include metal compounds with at least one β-diketiminate ligand. Such systems and methods can be useful for depositing metal-containing layers on substrates.
Systems And Methods For Forming Metal Oxides Using Metal Compounds Containing Aminosilane Ligands
Brian A. Vaartstra - Nampa ID, US Timothy A. Quick - Boise ID, US
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
H01L 21/31
US Classification:
438786, 438785, 118715
Abstract:
A method of forming (and an apparatus for forming) a metal oxide layer on a substrate, particularly a semiconductor substrate or substrate assembly, using a vapor deposition process and one or more precursor compounds that include aminosilane ligands.
Beta-Diketiminate Ligand Sources And Metal-Containing Compounds Thereof, And Systems And Methods Including Same
Dan Millward - Boise ID, US Timothy A. Quick - Boise ID, US
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
C07F 5/00 C07F 3/00 C23C 16/00
US Classification:
534 15, 556 32, 556 34, 556 35, 427252
Abstract:
The present invention provides metal-containing compounds that include at least one β-diketiminate ligand, and methods of making and using the same. In certain embodiments, the metal-containing compounds include at least one β-diketiminate ligand with at least one fluorine-containing organic group as a substituent. In other certain embodiments, the metal-containing compounds include at least one β-diketiminate ligand with at least one aliphatic group as a substituent selected to have greater degrees of freedom than the corresponding substituent in the β-diketiminate ligands of certain metal-containing compounds known in the art. The compounds can be used to deposit metal-containing layers using vapor deposition methods. Vapor deposition systems including the compounds are also provided. Sources for β-diketiminate ligands are also provided.
Warlick School Gastonia NC 1956-1965, Warlick Elementary School Gastonia NC 1956-1965, Ranlo School Gastonia NC 1958-1965, Holbrook High School Lowell NC 1965-1968
Community:
Robert Stephens, Jesse Lyles, Patsy Quinn, Gail Ethridge, Bob Ipock, Barbara Parker, Lila Braty, Jim Cherry, Linda Carroll, Teresa Glance, Charles Harrison