Timothy A Strodtbeck

US Patent:

6403933, Jun 11, 2002

Filed:

Oct 12, 2000

Appl. No.:

09/689603

Inventors:

Timothy A. Strodtbeck - Boise ID
John S. Molebash - Meridian ID
Bruce L. Hayes - Boise ID
Rex A. Smith - Boise ID
Shawn D. Davis - Meridian ID

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

H05B 102

US Classification:

219502, 2194441, 118725

Abstract:

A support including a plate having a top surface and a receiving hole, a lift element having a contacting end disposed through the receiving hole, a sensor disposed in a bore in the contacting end of the lift element, and a support member adjacent the top surface.

US Patent:

6413319, Jul 2, 2002

Filed:

Dec 7, 2000

Appl. No.:

09/731499

Inventors:

Timothy A. Strodtbeck - Boise ID

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

B05C 1100

US Classification:

118688, 118404

Abstract:

A process and apparatus for processing a monolayer film and transferring the monolayer film to a substrate are provided. In accordance with one embodiment of the present invention, a process for transferring a monolayer film to a substrate is provided comprising the steps of: (i) providing a water-based: carrier media defining an upper surface; (ii) introducing process particles on the upper surface of the carrier media, wherein the molecules are dissolved in a solvent and the particles and the solvent are insoluble in the carrier media; (iii) evaporating the solvent such that a non-cohesive monolayer film of the particles is formed on the upper surface of the carrier media; (iv) decreasing a degree of void incorporation in the monolayer film of particles by compressing a dimension of the non-cohesive film along the upper surface of the carrier media, and sonicating the carrier media to form micro-bubbles in the carrier media, wherein the compression and the sonication contribute to a decreased degree of void incorporation in the film of process particles; and (v) transferring the film of particles to a surface of the substrate. The steps of compressing and sonicating may be executed concurrently.

US Patent:

6540836, Apr 1, 2003

Filed:

Jun 3, 2002

Appl. No.:

10/161480

Inventors:

Timothy A. Strodtbeck - Boise ID

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

B05C 1100

US Classification:

118688, 118404

Abstract:

A process and apparatus for processing a monolayer film and transferring the monolayer film to a substrate are provided. In accordance with one embodiment of the present invention, a process for transferring a monolayer film to a substrate is provided comprising the steps of: (i) providing a water-based carrier media defining an upper surface; (ii) introducing process particles on the upper surface of the carrier media, wherein the molecules are dissolved in a solvent and the particles and the solvent are insoluble in the carrier media; (iii) evaporating the solvent such that a non-cohesive monolayer film of the particles is formed on the upper surface of the carrier media; (iv) decreasing a degree of void incorporation in the monolayer film of particles by compressing a dimension of the non-cohesive film along the upper surface of the carrier media, and sonicating the carrier media to form micro-bubbles in the carrier media, wherein the compression and the sonication contribute to a decreased degree of void incorporation in the film of process particles; and (v) transferring the film of particles to a surface of the substrate. The steps of compressing and sonicating may be executed concurrently.

US Patent:

7806449, Oct 5, 2010

Filed:

Aug 31, 2006

Appl. No.:

11/469185

Inventors:

Mike Chalom - Boise ID, US
Jon Oliver - Boise ID, US
Ty Gabby - Meridian ID, US
Timothy A. Strodtbeck - Boise ID, US

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

B25J 1/00

US Classification:

294 15, 294104

Abstract:

A device for handling devices, such as reticles, in a semiconductor manufacturing environment. In one illustrative embodiment, the device includes a body, a plurality of spaced-apart grippers and a plurality of magnets for producing a magnetic force to secure a semiconducting substrate or reticle between the spaced-apart grippers. In an embodiment, the magnets are surrounded by magnetic shielding.

US Patent:

8360491, Jan 29, 2013

Filed:

Jul 16, 2010

Appl. No.:

12/837632

Inventors:

Mike Chalom - Boise ID, US
Jon Oliver - Boise ID, US
Ty Gabby - Meridian ID, US
Timothy A. Strodtbeck - Boise ID, US

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

B25J 1/00
B66C 1/04

US Classification:

294 15, 294 655, 294104

Abstract:

Disclosed is a method for handling devices, such as reticles, in a semiconductor manufacturing environment. In one illustrative embodiment, the method includes: providing a pick comprised of a plurality of spaced-apart grippers with a pivot point between the gripper about which point the spaced-apart grippers are configured to pivot; creating a vacuum in a body proximate to the pivot point, wherein the vacuum is configured to draw particles generated in the area of the pivot into the body; and generating a magnetic force between magnets, wherein the magnetic force drives at least one gripper toward another gripper to grasp a semiconducting substrate or a reticle between the grippers.

US Patent:

61506389, Nov 21, 2000

Filed:

Feb 12, 1999

Appl. No.:

9/250067

Inventors:

Timothy A. Strodtbeck - Boise ID
John S. Molebash - Meridian ID
Bruce L. Hayes - Boise ID
Rex A. Smith - Boise ID
Shawn D. Davis - Meridian ID

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

H05B 102

US Classification:

219502

Abstract:

A method of exhausting vapors emanating from a surface. The method includes enclosing the surface and dividing the enclosed area into a stagnant region adjacent the surface and an interior region in communication with the stagnant region. The method also includes applying a suction to the interior region and admitting air into the interior region.

US Patent:

6171402, Jan 9, 2001

Filed:

Feb 12, 1999

Appl. No.:

9/250484

Inventors:

Timothy A. Strodtbeck - Boise ID
John S. Molebash - Meridian ID
Bruce L. Hayes - Boise ID
Rex A. Smith - Boise ID
Shawn D. Davis - Meridian ID

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

B05C 1302

US Classification:

118712

Abstract:

A method of disposing a wafer on a support member protruding from a surface. The method includes supporting the wafer in a first position defined by a lift extending through the surface and manipulating the surface to place the wafer on the support member.

US Patent:

57590079, Jun 2, 1998

Filed:

Nov 1, 1996

Appl. No.:

8/742897

Inventors:

Ernest C. Nichols - Boise ID
Brian D. Brown - Nampa ID
Timothy A. Strodtbeck - Boise ID
Kevin A. Larsen - Boise ID
Shelby K. Moore - Meridian ID
John S. Molebash - Meridian ID

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

B65G 4724

US Classification:

414417

Abstract:

The invention provides a manually operated machine for radially aligning one or more semiconductor wafers. The machine includes an elongated first "notch" roller for rotatably engaging the edge of the wafers, a gear train, and a hand crank for manually rotating the first roller in cooperation with the gear train. The wafers are aligned according to the notches as the wafers are engaged and rotated by the notch roller until the notch in each wafer falls over and is disengaged by that roller. The manual notch finder may also include an elongated second "position" roller for rotatably engaging the edge of the wafers. The position roller is disposed laterally near the notch roller and sized and shaped to engage the edge of the wafers fully along the periphery of each wafer so that the aligned wafers can be positioned to any degree of radial orientation. The invention also provides a combination notch or flat finder machine integrated with a wafer transfer machine. The combination machine includes a base plate, a translatable transfer arm, and a notch finder machine such as that described above, or a flat finder machine.