Todd E Jones

US Patent:

7786421, Aug 31, 2010

Filed:

Sep 13, 2004

Appl. No.:

10/940591

Inventors:

Shouleh Nikzad - Valencia CA, US
Michael Hoenk - Valencia CA, US
Todd Jones - Altadena CA, US

Assignee:

California Institute of Technology - Pasadena CA

International Classification:

H01L 27/00

US Classification:

2502081, 2502141, 250214 R, 438 57

Abstract:

The present invention relates to curved focal plane arrays. More specifically, the present invention relates to a system and method for making solid-state curved focal plane arrays from standard and high-purity devices that may be matched to a given optical system. There are two ways to make a curved focal plane arrays starting with the fully fabricated device. One way, is to thin the device and conform it to a curvature. A second way, is to back-illuminate a thick device without making a thinned membrane. The thick device is a special class of devices; for example devices fabricated with high purity silicon. One surface of the device (the non VLSI fabricated surface, also referred to as the back surface) can be polished to form a curved surface.

US Patent:

8163094, Apr 24, 2012

Filed:

Jul 23, 2009

Appl. No.:

12/508006

Inventors:

H. Frank Greer - Pasadena CA, US
Todd J. Jones - Altadena CA, US
Richard P. Vasquez - Altadena CA, US
Michael E. Hoenk - Valencia CA, US
Matthew R. Dickie - Altadena CA, US
Shouleh Nikzad - Valencia CA, US

Assignee:

The United States of America as represented by the Administrator of the National Aeronautics and Space Administration - Washington DC

International Classification:

B08B 6/00

US Classification:

134 12, 134 11, 134 26, 156281

Abstract:

A process for removing indium oxide from indium bumps in a flip-chip structure to reduce contact resistance, by a multi-step plasma treatment. A first plasma treatment of the indium bumps with an argon, methane and hydrogen plasma reduces indium oxide, and a second plasma treatment with an argon and hydrogen plasma removes residual organics. The multi-step plasma process for removing indium oxide from the indium bumps is more effective in reducing the oxide, and yet does not require the use of halogens, does not change the bump morphology, does not attack the bond pad material or under-bump metallization layers, and creates no new mechanisms for open circuits.

US Patent:

20110140246, Jun 16, 2011

Filed:

Dec 10, 2010

Appl. No.:

12/965790

Inventors:

Michael E. Hoenk - Valencia CA, US
Shouleh Nikzad - Valencia CA, US
Todd J. Jones - Altadena CA, US
Frank Greer - Pasadena CA, US
Alexander G. Carver - North Hollywood CA, US

Assignee:

California Institute of Technology - Pasadena CA

International Classification:

H01L 29/66
H01L 21/30
C23C 16/02

US Classification:

257655, 438471, 118723 R, 257E29166, 257E21211

Abstract:

Systems and methods for producing high quantum efficiency silicon devices. A silicon MBE has a preparation chamber that provides for cleaning silicon surfaces using an oxygen plasma to remove impurities and a gaseous (dry) NH+NFroom temperature oxide removal process that leaves the silicon surface hydrogen terminated. Silicon wafers up to 8 inches in diameter have devices that can be fabricated using the cleaning procedures and MBE processing, including delta doping.

US Patent:

20110169160, Jul 14, 2011

Filed:

Jan 13, 2011

Appl. No.:

13/005751

Inventors:

Frank Greer - Pasadena CA, US
Todd J. Jones - Altadena CA, US
Shouleh Nikzad - Valencia CA, US
Thomas J. Cunningham - Pasadena CA, US
Edward R. Blazejewski - Moorpark CA, US
Matthew R. Dickie - Altadena CA, US
Michael E. Hoenk - Valencia CA, US

Assignee:

CALIFORNIA INSTITUTE OF TECHNOLOGY - Pasadena CA

International Classification:

H01L 23/48
B23K 31/12
B23K 1/00
B23Q 15/013

US Classification:

257737, 228104, 228 19, 228 9, 257E23023

Abstract:

A method, apparatus, system, and device provide the ability to form one or more solder bumps on one or more materials. The solder bumps are reflowed. During the reflowing, the solder bumps are monitored in real time. The reflow is controlled in real time, thereby controlling a morphology of each of the solder bumps. Further, the wetting of the solder bumps to a surface of the materials is controlled in real time.

US Patent:

20120168891, Jul 5, 2012

Filed:

Oct 25, 2011

Appl. No.:

13/281295

Inventors:

Frank Greer - Pasadena CA, US
Todd J. Jones - Altadena CA, US
Shouleh Nikzad - Valencia CA, US
Michael E. Hoenk - Valencia CA, US

Assignee:

California Institute of Technology - Pasadena CA

International Classification:

H01L 31/18
H01L 31/0232

US Classification:

257437, 438 72, 257E31127

Abstract:

High-quality surface coatings, and techniques combining the atomic precision of molecular beam epitaxy and atomic layer deposition, to fabricate such high-quality surface coatings are provided. The coatings made in accordance with the techniques set forth by the invention are shown to be capable of forming silicon CCD detectors that demonstrate world record detector quantum efficiency (>50%) in the near and far ultraviolet (155 nm-300 nm). The surface engineering approaches used demonstrate the robustness of detector performance that is obtained by achieving atomic level precision at all steps in the coating fabrication process. As proof of concept, the characterization, materials, and exemplary devices produced are presented along with a comparison to other approaches.

US Patent:

20130109977, May 2, 2013

Filed:

Nov 1, 2012

Appl. No.:

13/666915

Inventors:

Shouleh Nikzad - Valencia CA, US
Michael E. Hoenk - Valencia CA, US
Todd J. Jones - Altadena CA, US
Samuel R. Cheng - Walnut CA, US

Assignee:

California Institute of Technology - Pasadena CA

International Classification:

A61B 5/00

US Classification:

600476

Abstract:

A medical imaging system and method. A UV/visible camera uses a back illuminated silicon imaging detector to observe a surface of a brain of a human subject in vivo during brain surgery for excision of a cancerous tumor. The detector can be a CCD detector or a CMOS detector. Under UV illumination, the camera can record images that can be processed to detect the location and extent of a cancerous tumor because the presence of auto-fluorescent NADH variations can be detected between normal and cancerous cells. The image data is processed in a general purpose programmable computer. In some instances, an image is also taken using visible light, and the identified cancerous region is displayed as an overlay on the visible image.

US Patent:

20130175430, Jul 11, 2013

Filed:

Jun 22, 2012

Appl. No.:

13/531204

Inventors:

Thomas J. Cunningham - Pasadena CA, US
Bruce R. Hancock - Altadena CA, US
Chao Sun - San Marino CA, US
Todd J. Jones - Altadena CA, US
Matthew R. Dickie - Altadena CA, US
Shouleh Nikzad - Valencia CA, US
Michael E. Hoenk - Valencia CA, US
Christopher J. Wrigley - La Crescenta CA, US
Kenneth W. Newton - Castaic CA, US
Bedabrata Pain - Los Angeles CA, US

Assignee:

CALIFORNIA INSTITUTE OF TECHNOLOGY - Pasadena CA

International Classification:

H01L 27/146

US Classification:

2502081, 438 59

Abstract:

A method and device for imaging or detecting electromagnetic radiation is provided. A device structure includes a first chip interconnected with a second chip. The first chip includes a detector array, wherein the detector array comprises a plurality of light sensors and one or more transistors. The second chip includes a Read Out Integrated Circuit (ROIC) that reads out, via the transistors, a signal produced by the light sensors. A number of interconnects between the ROIC and the detector array can be less than one per light sensor or pixel.

US Patent:

20160302547, Oct 20, 2016

Filed:

Apr 14, 2016

Appl. No.:

15/099550

Inventors:

Todd Jones - Burbank CA, US

International Classification:

A45D 1/04
A45D 1/28

Abstract:

A curling iron providing angular adjustment of a heatable wand to a handle is disclosed. The curling iron comprises a pivot joint between the elongated handle and the elongated heatable wand. A manual detent is biased to constrain the pivot joint against rotation, thereby locking the elongated heatable wand in a selected position relative to the handle, and to release the wand for adjustment to another position. Release and adjustment may be performed by operating a manual control to release the pivot joint and rotating a wheel of the pivot joint to adjust angle of the wand relative to the handle. Alternatively, a single manual control can be manipulated to both release the pivot joint and also adjust the angle of the wand.