Tracy O Lang

US Patent:

6807665, Oct 19, 2004

Filed:

Jan 18, 2001

Appl. No.:

09/766007

Inventors:

Tracy J Evans - Albany OR
Dale R Magnuson - Albany OR
Derek J Whiteside - Albany OR
Susan L Wechsler - Corvallis OR
Tracy A Lang - Corvallis OR
Richard Hollon, Jr. - Half Moon Bay CA
Daniel L Severns - Independence OR
Mammie C Lee - Corvallis OR

Assignee:

Hewlett-Packard Development Company, L. P. - Houston TX

International Classification:

G06F 9445

US Classification:

717175

Abstract:

A manufacturer installs software by first partitioning storage media of the computing system into a first partition and a second partition. The manufacturer installs software bundles Into the second partition. Each software bundle is stored in form as an image. The manufacturer also installs bootable software and a user interface into the first partition. The bootable software and the user interface when run, operate to receive from a user a selection as to which of the software bundles to install in the computing system. The software bundle selected by the user is installed into the first partition while overwriting the bootable software and the user interface. After installation of the software bundle selected by the user, the bootable software, for example, can erase the installation software bundles in the second partition. This is done, for example, by overwriting the second partition with a blank file system.

US Patent:

58256253, Oct 20, 1998

Filed:

Oct 9, 1996

Appl. No.:

8/728394

Inventors:

Dennis R. Esterberg - Philomath OR
Mark A. Smith - Corvallis OR
Paul A. Rubens - Salem OR
Tracy A. Lang - Corvallis OR

Assignee:

Hewlett-Packard Company - Palo Alto CA

International Classification:

H05K 720

US Classification:

361719

Abstract:

A heat conductive substrate is mounted within a through-opening of a printed circuit board. An integrated circuit then is mounted to one side of the heat conductive substrate, while a heat sink is fixed in thermal contact to the other side of the substrate. There is no direct thermal contact between the IC and the PC board. The substrate is mounted to an undersurface of the PC board and concentrically spaced from the PC board within the opening. An air gap occurs between the substrate and the PC board within the opening to substantially reduce heat conductivity into the PC board.